摘要:
An image sensor includes a photoelectric conversion unit, a charge storage unit, a switch unit, and a wiring unit, all of which are formed on a single substrate. A capacitor of the charge storage unit is formed at the same substrate position as that of a pattern of said wiring unit.
摘要:
An image photosensor includes a photosensor unit a charge storage unit, and a switch unit, all of which are formed on a single-crystal semiconductor film grown from a single nucleus such that crystal formation is performed on a substrate having a free surface including a non-nucleus formation surface and a nucleus formation surface adjacent thereto. The non-nucleus formation surface has a low nucleation density. The nucleus formation surface has a sufficiently small area to allow growth of only the single nucleus and has a higher nucleation density than that of the non-nucleus formation surface.
摘要:
An image photodetector includes a photosensor unit, a charge storage unit, and a switch unit, all of them are formed on a single-crystal semiconductor film grown from a single nucleus such that crystal formation is performed on a substrate having a free surface including a non-nucleus formation surface and a nucleus formation surface adjacent thereto. The non-nucleus formation surface has a low nucleation density. The nucleus formation surface has a sufficiently small area to allow growth of only the single nucleus and has a higher nucleation density that that of the non-nucleus formation surface.
摘要:
To eliminate non-read time in a photoelectric converting device, a photoelectric converting section is provided in which a plurality of photoelectric conversion elements, switching elements, matrix signal wirings, and gate drive wirings are arranged on the same substrate such that the photoelectric converting section generates parallel signals. A drive switching section is provided for applying drive signals to the gate drive wirings. A read switching section is provided for converting the parallel signals which are transferred from the matrix signal wirings into a serial signal, and for outputting the serial signal. The read switching section comprises a plurality of transfer switches respectively connected to the matrix signal wirings. The transfer switches are preferably activated together, simultaneously. A plurality of read capacitors are also provided in the read switching section to store the charges transferred through the matrix signal wirings. The read switching section also includes a plurality of read switches for reading out carriers stored in the plurality of read capacitors. The read switching section also includes reading circuitry for reading the read switches by sequentially switching the read switches so that a period of driving the transfer switches and a period of driving a first one of the read switches are partially overlapped.
摘要:
A photoelectric conversion device comprises a plurality of blocks each having a plurality of sensor elements each consisting of a combination of a photoelectric conversion section, a charge storage section connected to the photoelectric conversion section, and a switch section arranged in a path for reading a charge from said charge storage section. Gate lines for operating a plurality of switch sections in a given block are commonly connected. Read lines from said switch sections are commonly connected in units of sensor elements corresponding to each block to constitute a wiring matrix. The gate lines are arranged between the adjacent common read lines of the wiring matrix.
摘要:
A semiconductor device wherein m.times.n switch means connected to m.times.n functional elements for transferring signals by switching, and a matrix wiring section having wiring connected respectively to said m.times.n switching means are formed on a common substrate, and wherein said matrix wiring section comprises a lamination structure formed by stacking, at least, a first conductive layer, a first insulating layer, a second conductive layer, a second insulating layer, a semiconductor layer, and a third conductive layer in this order.
摘要:
A photoelectric conversion apparatus having a thin plate glass wear-resisting layer is formed on photoelectric conversion devices, drive circuit and signal lines. An original document is disposed on the wear-resisting layer to confront the photoelectric conversion devices. Light is emitted from a light source disposed to confront the light transmissive substrate on the side opposing the original document, transmitted through a light transmissive substrate and applied to the original document. Reflected light from the original document is received by the photoelectric conversion devices so that electric signals transmitted from the photoelectric conversion devices can be read out through the signal lines. A protection layer is made of an inorganic thin film and formed on at least the photoelectric conversion devices, the drive circuit and the signal lines; a shock-absorbing layer made of an organic film is disposed at least between an end portion of the wear-resisting layer and the light transmissive substrate.
摘要:
A linear element array with n functional elements disposed one-dimensionally is constructed of a linear element array section having N blocks each having m functional elements, and a wiring section having m electrical wirings disposed side by side; wherein each of the functional elements is connected to a corresponding one of the electrical wirings by means of wire bonding.
摘要:
The burn-in apparatus includes a water supply system and a sprayer and has a structure such that water is converted into mist and sprayed onto the upper surface of a device attached to a socket of a burn-in board. The amount of heat generated by the device that generates high heat is removed by the amount of heat that includes a large latent heat from when the mist falls on the upper surface and is evaporated. Burn-in of the device is conducted while it is being cooled to the target temperature.
摘要:
This invention provides a semiconductor film manufacturing method using a new separation technique and applications thereof. The semiconductor film manufacturing method of this invention includes a separation layer forming a step of hetero-epitaxially growing a separation layer (2) on a seed substrate (1), a semiconductor film forming step of forming a semiconductor film (3) on the separation layer (2), and a separation step of separating, by using the separation layer (2), the semiconductor film (3) from a composite member (Ia) formed in the semiconductor film forming step.