摘要:
When a horizontal skipping operation is performed in a solid-state imaging apparatus that includes an A/D converting circuit in each column and that applies an arithmetic operation process to a digitalized signal and an arithmetic operation is performed with signals held by a plurality of register circuits, A/D converters and register circuits in columns in which signals are skipped, or not read out, are not involved in the operations. A more consideration is needed in terms of the use efficiency of circuits. A unit for connecting a register circuit of a certain column and a register circuit of a different column is arranged.
摘要:
When a horizontal skipping operation is performed in a solid-state imaging apparatus that includes an A/D converting circuit in each column and that applies an arithmetic operation process to a digitalized signal and an arithmetic operation is performed with signals held by a plurality of register circuits, A/D converters and register circuits in columns in which signals are skipped, or not read out, are not involved in the operations. A more consideration is needed in terms of the use efficiency of circuits. A unit for connecting a register circuit of a certain column and a register circuit of a different column is arranged.
摘要:
When a horizontal skipping operation is performed in a solid-state imaging apparatus that includes an A/D converting circuit in each column and that applies an arithmetic operation process to a digitalized signal and an arithmetic operation is performed with signals held by a plurality of register circuits, A/D converters and register circuits in columns in which signals are skipped, or not read out, are not involved in the operations. A more consideration is needed in terms of the use efficiency of circuits. A unit for connecting a register circuit of a certain column and a register circuit of a different column is arranged.
摘要:
A solid-state imaging device has a configuration for selecting from a plurality of reference pixels at least one reference pixel for outputting a reference signal.
摘要:
An imaging system includes an A/D converter including a holding unit holding a pixel signal as a voltage level, a comparator comparing the voltage level held with a reference level, a circuit capable of changing the voltage level so as to approach the reference level at first and second rates, wherein the voltage level is changed at the first rate to determine higher bits in accordance with inversion of a relationship between the reference level and the voltage level, after that, the voltage level is changed at the second rate to determine lower bits in accordance with inversion of the relationship between the reference level and the voltage level, and an adjusting unit which adjusts the voltage level during a period until the voltage level is changed at the second rate after determination of the higher bits so that the lower bits and the voltage level hold a linear relationship.
摘要:
In a solid-state imaging device, a photoelectric conversion unit, a transfer transistor, and at least a part of electric charge holding unit, among pixel constituent elements, are disposed on a first semiconductor substrate. An amplifying transistor, a signal processing circuit other than a reset transistor, and a plurality of common output lines, to which signals are read out from a plurality of pixels, are disposed on a second semiconductor substrate.
摘要:
The present invention relates to a solid-state image pickup device. The device includes a first substrate including a photoelectric conversion element and a transfer gate electrode configured to transfer charge from the photoelectric conversion element, a second substrate having a peripheral circuit portion including a circuit configured to read a signal based charge generated in the photoelectric conversion element, the first and second substrates being laminated. The device further includes a multilayer interconnect structure, disposed on the first substrate, including an aluminum interconnect and a multilayer interconnect structure, disposed on the second substrate, including a copper interconnect.
摘要:
A constant current source has a first current source circuit for outputting a first current; a second current source circuit for outputting a second current according to a reference voltage; a current comparison circuit for comparing magnitudes of the first and second currents; and a current adjustment unit for adjusting a current value of the first current output from the first current source circuit in accordance with a comparison result of the current comparison circuit.
摘要:
In a solid-state imaging device, a photoelectric conversion unit, a transfer transistor, and at least a part of electric charge holding unit, among pixel constituent elements, are disposed on a first semiconductor substrate. An amplifying transistor, a signal processing circuit other than a reset transistor, and a plurality of common output lines, to which signals are read out from a plurality of pixels, are disposed on a second semiconductor substrate.
摘要:
A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.