摘要:
An optical fiber sheet comprises optical fibers sandwiched between sheet members and fixed thereto. Distal ends of the optical fibers extend from outer peripheral edges of the sheet members with resin coatings applied to the distal ends to produce extensions. The distal ends of the extensions are inserted into fiber holes of connectors with the resin coatings applied to the distal ends to be connected with the connectors.
摘要:
An optical fiber sheet comprises optical fibers sandwiched between sheet members and fixed thereto. Distal ends of the optical fibers extend from outer peripheral edges of the sheet members with resin coatings applied to the distal ends to produce extensions. The distal ends of the extensions are inserted into fiber holes of connectors with the resin coatings applied to the distal ends to be connected with the connectors.
摘要:
An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.
摘要:
An optical backplane includes an optical connector which receives juxtaposed optical signals transmitted in nonparallel to the main surface of a circuit substrate from the circuit substrate or transmits juxtaposed optical signals in nonparallel to the main surface of the circuit substrate to the circuit substrate. The optical connector disposes and accommodates edge portions of a plurality of optical fibers and the disposing direction of the optical fibers in the optical connector is in nonparallel to the main surface of the circuit substrate.
摘要:
A blood vessel ultrasonic image measuring method capable of facilitating the positioning of an ultrasonic probe and acquiring sufficient positioning accuracy. Because of inclusion of an around-X-axis positioning step of causing a multiaxis driving device to position an ultrasonic probe such that distances from respective ultrasonic array probes to the center of a blood vessel are equalized, and an X-axis direction positioning step and an around-Z-axis positioning step of causing the multiaxis driving device to position the ultrasonic probe such that the image of the blood vessel is positioned at the center portion in the width direction of the first short axis image display area and the second short axis image display area, the positioning may be performed by using the positions in the longitudinal direction of the ultrasonic array probes relative to the blood vessel or the distances of the ultrasonic array probes to the blood vessel.
摘要:
Provided is a display device in which design properties have been improved by eliminating the flickering when the display level changes. A microcomputer (5) causes light emission of first LEDs (23 and 24) which are the first and second ones counting from the right end among the emitting first LEDs (21 to 24), with decreasing brightness towards the right end. Furthermore, the microcomputer (5) causes light emission of second LEDs from a second LED (77) which is disposed at the right end of the second LEDs (71 to 77), to a second LED (73) which is disposed at a position overlapped with the first LEDs (23 and 24) that emit light with decreasing brightness towards the right end, and also causes light emission of second LEDs (73 and 74), which are the first and second ones counting from the left end among the emitting second LEDs (73 to 77), with decreasing brightness towards the left end.
摘要:
External electrodes are provided on a bottom surface of a laminate, and are connected to both ends of a main line and both ends of a sub-line, respectively. A warpage prevention conductor is provided on an insulating material layer that is provided on a top surface side of the laminate with respect to insulating material layers to which the main line is provided and with respect to insulating material layers to which the sub-line is provided. The warpage prevention conductor overlaps with the external electrodes when seen from a z-axis direction in a plan view. A conductor layer that is not connected to the main line or the sub-line is not provided on any of the insulating material layers provided on a bottom surface side of the laminate with respect to the insulating material layer on which the warpage prevention conductor is provided.
摘要:
The present invention relates to an optical waveguide comprising a lower cladding layer, a patternized core layer and an upper cladding layer, wherein a striking part for positioning is provided in one end part thereof, and an optical path turning mirror face is formed in a position different from a striking part-forming end part in the above core layer.Capable of being provided are an optical waveguide and an optoelectronic circuit board each having a simple configuration in which an optical device is not mounted on an optical wiring part or an optoelectronic composite wiring part and capable of connecting an optical device with a core of an optical waveguide in an optical wiring part (optical waveguide) or an optoelectronic composite wiring part (optoelectronic circuit board) at a high position accuracy and an optical module comprising an optical waveguide or an optoelectronic circuit board and a connector.
摘要:
A multilayer wiring structure of a semiconductor device having a stacked structure is arranged to restrain reliability degradation due to stress applied to the region of wiring between opposite upper and lower plugs. The rate of overlap of contact surface between upper plug and wiring on contact surface between lower plug and wiring, is small to the extent that no void is generated. The multilayer wiring structure is produced such that no grain boundary is contained in the region of wiring between upper and lower plugs. The difference in thermal expansion coefficient between the material of wiring and the material of upper and lower plugs, is small to the extent that no void is generated.
摘要:
An apparatus for measuring a short-axis image of a blood vessel under a skin of a living being, the apparatus including an ultrasonic probe including an ultrasonic array which has a plurality of ultrasonic transducers arranged in one direction in an emission surface and which emits, from the emission surface, an ultrasonic beam toward the blood vessel, the ultrasonic probe additionally including a main frame which is adapted to be placed on the skin of the living being, an x-axis supporting device which is supported by the main frame and which supports the ultrasonic array such that the ultrasonic array is rotatable about an x axis parallel to the direction of arrangement of the ultrasonic transducers in the emission surface, and an x-axis control device which controls a posture of the ultrasonic array supported by the x-axis supporting device such that in a y-z plane, the emission surface of the ultrasonic array is parallel to the blood vessel.