Epoxy resin composition for semiconductor encapsulation and
semiconductor device using the same
    1.
    发明授权
    Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same 失效
    用于半导体封装的环氧树脂组合物和使用其的半导体器件

    公开(公告)号:US5294835A

    公开(公告)日:1994-03-15

    申请号:US920657

    申请日:1992-07-28

    IPC分类号: H01L23/29 H01L23/28

    摘要: A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.

    摘要翻译: 一种半导体器件,其中将半导体芯片封装在环氧树脂组合物中,其包含(A)由式(I)表示的环氧树脂:(*化学结构*)(I)其中R1,R2,R3和R4各自表示 具有1至4个碳原子的烷基,和(B)通过使由式(II)表示的硅烷化合物预先反应获得的反应产物:(*化学结构*)(II)其中X表示至少具有一个 一个选自缩水甘油基,氨基和巯基的官能团; Y表示具有1至4个碳原子的烷氧基; 和n表示0,1或2,与式(III)表示的酚芳烷基树脂(*化学结构*)(III)表示,其中m表示0或正整数。 环氧树脂组合物具有低吸湿性和低应力,以提供耐热裂纹性和耐湿性优异的半导体器件。

    Steel For Machine Structural Use With Excellent Strength, Ductility, And Toughness And Method For Producing The Same
    4.
    发明申请
    Steel For Machine Structural Use With Excellent Strength, Ductility, And Toughness And Method For Producing The Same 审中-公开
    钢结构使用优良的强度,延性和韧性及其生产方法

    公开(公告)号:US20080017283A1

    公开(公告)日:2008-01-24

    申请号:US11795192

    申请日:2006-06-30

    IPC分类号: C21D9/46 C22C38/00

    CPC分类号: C21D9/46 C22C38/00

    摘要: A steel for machine structural use with a better strength-ductility-toughness balance than maraging steel and applications thereof are provided. The steel for machine structural use with excellent strength, ductility, and toughness contains, in percent by mass, more than 0.30% to 0.5% of carbon, 1.0% or less of silicon, 1.5% or less of manganese, 0.025% or less of aluminum, 0.3% to 0.5% of molybdenum, and 0.0005% to 0.01% of boron, and the balance is iron and incidental impurities. The steel has a structure including at least 90% by volume of martensitic structure. The martensitic structure includes blocks having a size of 1.5 μm or less. Dissolved boron is contained in an amount of at least 0.0005% and is present at boundaries of prior austenite grains in a concentration at least 1.5 times that in the prior austenite grains.

    摘要翻译: 提供了一种具有比马氏体时效钢更好的强度 - 延性 - 韧性平衡的机械结构用钢及其应用。 具有优异的强度,延展性和韧性的机械结构用钢,以质量%计含有超过0.30%〜0.5%的碳,1.0%以下的硅,1.5%以下的锰,0.025%以下的 铝,0.3〜0.5%的钼和0.0005〜0.01%的硼,余量为铁和杂质。 该钢具有至少90体积%的马氏体组织。 马氏体结构包括尺寸为1.5μm或更小的块。 溶解硼的含量至少为0.0005%,并且在现有奥氏体晶粒的边界处,其浓度至少为现有奥氏体晶粒中的1.5倍。

    SPRING STEEL AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    SPRING STEEL AND METHOD FOR MANUFACTURING THE SAME 有权
    弹簧钢及其制造方法

    公开(公告)号:US20130048158A1

    公开(公告)日:2013-02-28

    申请号:US13638375

    申请日:2011-02-28

    摘要: Disclosed is high strength spring steel that can limit the depth of pitting occurring when corroded and therefore possesses high strength as well as excellent pitting corrosion resistance and corrosion fatigue property, with a composition containing: C: greater than 0.35 mass % and less than 0.50 mass %; Si: greater than L75 mass % and less than or equal to 3.00 mass %; Mn: 0.2 mass % to 1.0 mass %; Cr: 0.01 mass % to 0.04 mass %; P: 0.025 mass % or less; S: 0.025 mass % or less; Mo: 0.1 mass % to 1.0 mass %; and 0: 0.0015 mass % or less, under a condition that a PC value calculated by PC=4.2×([C]+[Mn])+0.1×(1/[Si]+1/[Mo])+20.3×[Cr]+0.001×(1/[N]) is greater than 3.3 and equal to or less than 8.0. Also disclosed is a preferred method for manufacturing the same.

    摘要翻译: 公开了一种高强度弹簧钢,其可以限制腐蚀发生的点蚀深度,因此具有高强度以及优异的耐点腐蚀性和耐腐蚀疲劳性能,组合物含有:C:大于0.35质量%且小于0.50质量% %; Si:大于L75质量%且小于等于3.00质量%; Mn:0.2质量%〜1.0质量% Cr:0.01质量%〜0.04质量% P:0.025质量%以下; S:0.025质量%以下; Mo:0.1质量%〜1.0质量% 在[PC] = 4.2×([C] + [Mn])+ 0.1×(1 / [Si] + 1 / [Mo])+ 20.3× [Cr] + 0.001×(1 / [N])大于3.3且等于或小于8.0。 还公开了其制造方法。

    Hot forging facility
    6.
    发明授权
    Hot forging facility 有权
    热锻设备

    公开(公告)号:US07827842B2

    公开(公告)日:2010-11-09

    申请号:US11921320

    申请日:2006-06-05

    IPC分类号: B21D37/16

    摘要: A hot forging facility enabling the manufacture of a hot forged product excellent in fatigue properties and cold workability is provided. A heating furnace for heating a steel material and a hot forging apparatus for performing forging of the heated steel material are sequentially arranged on a transport line. A partially cooling apparatus/apparatuses for partially cooling a forged product after hot forging is provided on an exit side of the hot forging apparatus.

    摘要翻译: 提供了一种能够制造疲劳性能和冷加工性优异的热锻产品的热锻设备。 用于加热钢材的加热炉和用于进行加热钢材锻造的热锻设备依次布置在输送线上。 在热锻设备的出口侧设置用于在热锻后部分冷却锻造产品的部分冷却装置/设备。