摘要:
An electronic fuel injection control system for use with an internal combustion engine, which includes means for generating at least one kind of coefficient for correcting the value of basic fuel injection quantity data on the basis of output values of means for detecting engine operating condition parameters inclusive at least of engine temperature, and also includes means for setting the value of the above correction coefficient to a value corresponding to a predetermined value of an engine operating condition parameter concerned which falls within a range within which the value of the same parameter is variable during normal engine operation, when an output value of the detecting means becomes outside a range within which the same output value is variable during normal operation of the engine.
摘要:
A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arranged between the circuit board for inspection and the circuit board for connection and electrically connecting the respective inspection electrodes to the respective terminal electrodes, and a parallelism adjusting mechanism for adjusting a parallelism of the circuit board for inspection and the circuit board for connection to the wafer. The parallelism adjusting mechanism includes a location-varying mechanism, which relatively displaces the circuit board for inspection or the circuit board for connection in the thickness-wise direction of the anisotropically conductive connector. A wafer inspection apparatus can include the probe device.
摘要:
A die for molding a disk substrate capable of forming fine recessed and projected pits and grooves up to the outer periphery of the disk substrate by preventing low heat conductive elements from peeling off and burrs from occurring on the outer periphery thereof. The die includes a first base die, a second base die disposed oppositely to the first base die, a first low heat conductive element fixed to the first base die, a stamper fixed onto the first low heat conductive element, a second low heat conductive element fixed onto the second base die, and a ring-like regulating member fitted to and in slidable contact with either of the first and second low heat conductive elements. The die is characterized in that the end part of the ring-shaped regulating member is positioned within the range of the outer peripheral side face of the low heat conductive element in slidable contact therewith.
摘要:
A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arranged between the circuit board for inspection and the circuit board for connection and electrically connecting the respective inspection electrodes to the respective terminal electrodes, and a parallelism adjusting mechanism for adjusting a parallelism of the circuit board for inspection and the circuit board for connection to the wafer. The parallelism adjusting mechanism includes a location-varying mechanism, which relatively displaces the circuit board for inspection or the circuit board for connection in the thickness-wise direction of the anisotropically conductive connector. A wafer inspection apparatus can include the probe device.
摘要:
Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved, and applications thereof. The anisotropically conductive connector of the invention comprises elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.
摘要:
An optical information recording medium is manufactured by bonding a first substrate having a first central bore and a second substrate having a second central bore to each other with radiation cure resin. The radiation cure resin is coated on the first substrate. The first and second substrates are brought into close contact with each other so as to form the first and second substrates integrally with the radiation cure resin. A neighborhood of the first and second central bores is radiated. A whole of at least one of opposite outer faces of the integral first and second substrates is irradiated with radiation so as to wholly cure the radiation cure resin.
摘要:
An optical disk is constructed such that a thin film including a reflective layer is formed on a substrate, or on a thermoplastic resin layer on the substrate. A stamper having an asperity pattern corresponding to information signals is directly pressed against the thin film to transfer the asperity pattern on the thin film. Heat-pressing the stamper against the thin film makes it possible to further accurately transfer the asperity of the stamper to the reflective layer with less pressing force, in the case where the reflective layer is formed on the thermoplastic resin layer.
摘要:
A liquid-crystal panel comprises a pair of transparent glass substrates each being provided with an electrode. Between the glass substrates are disposed spacers for defining a space and a mixture of droplets of a liquid crystal having a mean diameter of 3.0 &mgr;m or less and of a photo-curing polymer. The edge portions of the glass substrates are sealed with a seal polymer. In curing the photo-curing polymer during the process of manufacturing the liquid-crystal panel, the dose of an ultraviolet ray is set to 500 mJ/cm2 or more so as to reduce the diameters of the droplets of the liquid crystal, thereby preventing light leakage in the state without a voltage applied and improving the contrast. If the spacers are colored, the effect of preventing light leakage is increased. If the spacers are subjected to a surface treatment for rejecting the liquid crystal or composed of a polymer material of the same type as that of the photo-curing polymer, variations in diameter of the droplets of the liquid crystal can be prevented. With the structure, it becomes possible to provide a liquid-crystal panel in which light leakage in the black mode is reduced and which presents uniform and high-contrast display of images.
摘要:
A mixed material of liquid crystals and resin is dropped on at least one substrate in an amount greater than the amount needed to cover a display area for the LCD panel. The substrate is adhered to another substrate, and excess material is removed to the outside of a display area. The phase-separation of the liquid crystals and resin is carried out by irradiating light while pressure is added to at least one substrate, so that a liquid crystal display panel applied to a liquid crystal display device or a light shutter can be manufactured without applying a complex vacuum device.
摘要:
A molding apparatus produces high-density thin type optical disk substrates having good replicability and birefringence sufficient for practical use. In filling the resin into the cavity, the stress on the resin is reduced by controlling the relation of the cavity width and the injection compression force to reduce birefringence. Further, the mirror surface of the mold is maintained at a certain temperature to facilitate the resin flow and a good replicability and reduction of birefringence is achieved by terminating the resin filling and starting the compression process at the time at which the pressure of the resin filling is at a minimum.