Printed wiring board and semiconductor device and processes to prepare the same
    4.
    发明授权
    Printed wiring board and semiconductor device and processes to prepare the same 失效
    印刷电路板和半导体器件及其制备方法

    公开(公告)号:US06709804B2

    公开(公告)日:2004-03-23

    申请号:US10368960

    申请日:2003-02-19

    Abstract: A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.

    Abstract translation: 印刷电路板,用于配置半导体芯片的基板和通过用包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物涂布基板而制备的半导体装置,并通过暴露于辐射形成精细图案。 用于制造印刷线路板的方法,用于设置半导体芯片的基板和半导体器件,其包括用感光性树脂组合物涂布基材并通过与通过氧气曝光产生的单线态氧化缩聚反应顺式二烯来形成精细图案 敏化剂对辐射。 感光性树脂组合物为负型,显示出高灵敏度,高分辨率。 感光性树脂组合物形成耐热性优异的树脂层。

    PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE
    5.
    发明授权
    PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE 失效
    感光性树脂组合物,印刷线路板,用于处理半导体芯片的基板,用于制造印刷电路板的半导体器件和工艺,用于处理半导体器件的衬底和半导体器件

    公开(公告)号:US06528231B1

    公开(公告)日:2003-03-04

    申请号:US09490627

    申请日:2000-01-24

    Abstract: A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.

    Abstract translation: 包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物。 印刷电路板,用于设置半导体芯片的基板和通过用感光性树脂组合物涂布基板而制备的半导体器件,并且通过暴露于辐射形成精细图案。 制造印刷电路板的方法,用于设置半导体芯片的基板和半导体装置,其包括用感光性树脂组合物涂布基板并通过与通过氧气曝光产生的单线态的氧化缩聚来交联顺式二烯而形成精细图案 敏化剂对辐射。 感光性树脂组合物为负型,显示出高灵敏度,高分辨率。 感光性树脂组合物可以形成耐热性优异的树脂层。

    System and method of diagnosing particle formation
    6.
    发明授权
    System and method of diagnosing particle formation 失效
    诊断颗粒形成的系统和方法

    公开(公告)号:US06374194B1

    公开(公告)日:2002-04-16

    申请号:US09288667

    申请日:1999-04-09

    Applicant: Kazuo Takeuchi

    Inventor: Kazuo Takeuchi

    CPC classification number: H01L21/67253 C23C14/542 C23C16/4401

    Abstract: A particle formation diagnosing system monitors the condition of particle formation in each of reaction chambers 1 of a semiconductor device fabricating line on the basis of data provided by a pressure measuring device 2a, a temperature measuring device 2b and a differential mobility analyzer 3 combined with each reaction chamber 1. The operation record recording unit 4a of the computer system 4 records data on the relation between the values of the operation parameters of each reaction chamber 1 and the amount of particles formed in the reaction chamber. Then, the operating condition determining unit 4b determines the optimum values for the operation parameters of the reaction chamber which will reduce the possibility of particle formation to the least possible extent on the basis of the data recorded by the operation record recording unit 4a.

    Abstract translation: 颗粒形成诊断系统基于由压力测量装置2a,温度测量装置2b和差速迁移率分析仪3提供的数据监测半导体装置制造线的每个反应室1中的颗粒形成状况, 计算机系统4的操作记录记录单元4a记录关于每个反应室1的操作参数的值与在反应室中形成的颗粒的量之间的关系的数据。 然后,操作条件确定单元4b确定反应室的操作参数的最佳值,其将基于由操作记录记录单元4a记录的数据以最小程度降低颗粒形成的可能性。

    Quick connector for piping
    9.
    发明授权
    Quick connector for piping 失效
    用于管道的快速接头

    公开(公告)号:US06540264B1

    公开(公告)日:2003-04-01

    申请号:US09546533

    申请日:2000-04-10

    Abstract: In a quick connector for piping 10 for detachably connecting a male member 12 to a female member 11, an O-ring 15 is interposed between the female member 11 and the male member 12 so as to form a seal therebetween, and the O-ring 15 is subjected to a low-friction treatment so that the O-ring can be moved in a direction of an axis of the quick connector 10 by a pressure of an employed fluid.

    Abstract translation: 在用于将阳构件12可拆卸地连接到阴构件11的管道10的快速连接器中,O形环15插入在阴构件11和阳构件12之间以在其间形成密封,并且O形环 15进行低摩擦处理,使得O形环可以通过所用流体的压力沿快速连接器10的轴线的方向移动。

    Method for automatic, non-destructive measurement of eccentricity of
coated electrodes
    10.
    发明授权
    Method for automatic, non-destructive measurement of eccentricity of coated electrodes 失效
    自动,无损测量涂层电极偏心率的方法

    公开(公告)号:US4395119A

    公开(公告)日:1983-07-26

    申请号:US202240

    申请日:1980-10-30

    CPC classification number: G01B11/08 G01B11/272

    Abstract: Disclosed is a method for the automatic, nondestructive, measurement of the eccentricity of a core wire in a coating composition coated upon an electrode, the measurement being formed by at least two sets of optical means, each including a light source and a line sensor. One of the optical sensors is positioned to measure the diameter of a coated portion of the core wire while at least one of the remaining sensors is positioned to measure the diameter of an uncoated portion. The positions and diameters of both portions are compared to find the eccentricity of the core wire. Where three sensors are used to measure the position and thickness of the exposed wire portion, the eccentricity of a misaligned or bent rod can be determined.

    Abstract translation: 公开了一种用于自动,非破坏性地测量涂覆在电极上的涂料组合物中的芯线的偏心度的方法,该测量由至少两组光学装置形成,每组包括光源和线传感器。 其中一个光学传感器定位成测量芯线的涂覆部分的直径,而其余的传感器中的至少一个定位成测量未涂覆部分的直径。 比较两部分的位置和直径以找出芯线的偏心度。 当使用三个传感器来测量露出的线部分的位置和厚度时,可以确定不对准或弯曲的杆的偏心度。

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