公开(公告)号：US07395847B2

公开(公告)日：2008-07-08

申请号：US11075721

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： B32B37/00

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

摘要翻译： 本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。 本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。 提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。 当橡胶膜22的体积增加时，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1 。 使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

公开(公告)号：US20050221589A1

公开(公告)日：2005-10-06

申请号：US11075758

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

公开(公告)号：US07571538B2

公开(公告)日：2009-08-11

申请号：US11075712

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： B23P19/00 ,  H01L21/10

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

摘要翻译： 本发明涉及包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片接合步骤的半导体衬底的夹具和方法; 以及用于这种方法的半导体衬底夹具。 本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。 提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。 随着橡胶膜22的体积增加，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1。 使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

公开(公告)号：US20050221588A1

公开(公告)日：2005-10-06

申请号：US11075721

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

摘要翻译： 本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。 本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。 提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。 当橡胶膜22的体积增加时，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1 。 使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

公开(公告)号：US20050221587A1

公开(公告)日：2005-10-06

申请号：US11075712

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

公开(公告)号：US06902944B2

公开(公告)日：2005-06-07

申请号：US10708067

申请日：2004-02-06

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

公开(公告)号：US06750074B2

公开(公告)日：2004-06-15

申请号：US10101169

申请日：2002-03-20

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L2100

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

摘要翻译： 本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。 本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。 提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。 随着橡胶膜22的体积增加，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1。 使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

公开(公告)号：US07109561B2

公开(公告)日：2006-09-19

申请号：US11075758

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L29/82

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

摘要翻译： 本发明涉及一种制造半导体衬底的方法，该半导体衬底包括晶片的后研磨步骤，切割步骤，拾取步骤和芯片键合步骤; 以及用于这种方法的半导体衬底夹具。 本发明的目的是减轻效果并且防止由于在减薄的半导体衬底中的强度不足而引起的损坏。 提供了具有外框架21的夹具和布置在外框架21内的橡胶膜22，并且通过在其中供应空气使其形状变形而具有越来越小的体尺寸。 当橡胶膜22的体积增加时，晶片固定夹具20使橡胶膜变形，并且允许布置在晶片1和橡胶膜22A之间的带2和6从中心向外逐渐推向晶片1 。 使用这种晶片固定夹具进行安装步骤，后研磨步骤，带重新施加步骤，拾取步骤和芯片粘合步骤。

公开(公告)号：US06951800B2

公开(公告)日：2005-10-04

申请号：US10101174

申请日：2002-03-20

申请人： Yoshiaki Shinjo ,  Yuzo Shimobeppu ,  Kazuo Teshirogi ,  Kazuhiro Yoshimoto ,  Eiji Yoshida ,  Noboru Hayasaka ,  Mitsuhisa Watanabe

发明人： Yoshiaki Shinjo ,  Yuzo Shimobeppu ,  Kazuo Teshirogi ,  Kazuhiro Yoshimoto ,  Eiji Yoshida ,  Noboru Hayasaka ,  Mitsuhisa Watanabe

IPC分类号： B23K26/00 ,  B23K26/06 ,  B23K26/40 ,  B23K101/40 ,  B24B1/00 ,  B24B7/22 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78 ,  H01L21/46

CPC分类号： H01L21/304 ,  B23K26/0624 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B24B1/00 ,  B24B7/228 ,  H01L21/78

摘要： A method of making a semiconductor device includes a back-grinding step of grinding a back surface of a semiconductor substrate, a dicing step of dicing the semiconductor substrate along predetermined dicing lines so as to make pieces of semiconductor devices after the back-grinding step, and a laser exposure step of shining laser light on the back surface of the semiconductor substrate after the back-grinding step so as to remove grinding marks generated by the back-grinding step.

摘要翻译： 制造半导体器件的方法包括：研磨半导体衬底的背面的后研磨步骤;切割步骤，根据预定的切割线切割半导体衬底，以便在后磨削步骤之后制造半导体器件; 以及激光曝光步骤，在后磨削步骤之后，在半导体衬底的背面上照射激光，以消除由后磨削步骤产生的磨痕。

公开(公告)号：US20050085171A1

公开(公告)日：2005-04-21

申请号：US10985949

申请日：2004-11-12

申请人： Yuzo Shimobeppu ,  Kazuo Teshirogi ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Takashi Mori ,  Koichi Yajima ,  Yusuke Kimura

发明人： Yuzo Shimobeppu ,  Kazuo Teshirogi ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Takashi Mori ,  Koichi Yajima ,  Yusuke Kimura

IPC分类号： H01L21/683 ,  H01L21/304 ,  H01L21/68 ,  B24B7/30

CPC分类号： B24B37/30

摘要： A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.

摘要翻译： 扁平物体保持器可以保持平坦的物体 - 框架组件，并且保持器具有用保护带固定到框架的平坦物体。 扁平物体保持器至少包括用于通过施加吸力而经由保护带固定地保持平坦物体的平坦物体支撑区域和用于紧固框架的框架固定区域。 通过对平坦物体支撑区域施加负压，承载平面物体框架组件的扁平物体固定件可被选定的卡盘台固定。 扁平物体保持器可以将平坦的物体 - 框架组件传送并放置在容器中。 因此，无论平面物体多么薄，可以处理而不用担心破碎。