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11 条记录 (耗时 0.025 秒)

    Electrochemical device
    1.
    发明授权
    Electrochemical device 失效
    电化学装置

    公开(公告)号：US08536465B2

    公开(公告)日：2013-09-17

    申请号：US12933263

    申请日：2009-03-16

    申请人： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata ,  Motoki Kobayashi

    发明人： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata ,  Motoki Kobayashi

    IPC分类号： H01R13/46

    CPC分类号： H01G9/10 ,  H01G2/10 ,  H01G9/155 ,  H01M2/0202 ,  Y02E60/13

    摘要： Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.

    摘要翻译： 提供与使用无铅焊料的高温回流焊接兼容的电化学装置。 电双层电容器10-1包括由膜或膜构成的封装件14，并且具有通过例如热封将膜彼此重叠的密封部分形成的密封部分14a1至14a3。 封装14的密封部分14a1至14a3的整体与具有比构成封装14的膜的刚性更高的刚性的支撑件16以紧密接触的状态被覆盖。

    Electrochemical device
    4.
    发明授权
    Electrochemical device 失效
    电化学装置

    公开(公告)号：US08455136B2

    公开(公告)日：2013-06-04

    申请号：US12538498

    申请日：2009-08-10

    申请人： Katsuei Ishida ,  Kazushi Yawata ,  Naoto Hagiwara ,  Motoki Kobayashi

    发明人： Katsuei Ishida ,  Kazushi Yawata ,  Naoto Hagiwara ,  Motoki Kobayashi

    IPC分类号： H01M2/00

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/12 ,  H01G11/18 ,  H01G11/74 ,  H01G11/78 ,  H01M2/0257 ,  H01M2/0287 ,  H01M2/06 ,  H01M2/1094 ,  H01M2/22 ,  Y02E60/13

    摘要： An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.

    摘要翻译： 能够通过焊接安装的电化学装置包括由薄膜制成的薄膜包装; 在所述膜包装中与电解质一起封装的电极部分; 一对端子，每个端子的一端连接到所述电极部分，并且每个端子的另一端暴露于所述胶片包装件的外部; 以及与所述薄膜包装的基本上整个表面接触并分别与所述一对端子的暴露端部的部分表面接触的装甲，以封装所述薄膜包装，所述装甲将所述一对端子的剩余部分暴露于 外套的装甲。

    ELECTROCHEMICAL DEVICE
    5.
    发明申请
    ELECTROCHEMICAL DEVICE 失效
    电化学装置

    公开(公告)号：US20110033745A1

    公开(公告)日：2011-02-10

    申请号：US12538498

    申请日：2009-08-10

    申请人： Katsuei Ishida ,  Kazushi Yawata ,  Naoto Hagiwara ,  Motoki Kobayashi

    发明人： Katsuei Ishida ,  Kazushi Yawata ,  Naoto Hagiwara ,  Motoki Kobayashi

    IPC分类号： H01M2/02 ,  H01G9/155

    CPC分类号： H01G9/155 ,  H01G9/016 ,  H01G9/10 ,  H01G11/12 ,  H01G11/18 ,  H01G11/74 ,  H01G11/78 ,  H01M2/0257 ,  H01M2/0287 ,  H01M2/06 ,  H01M2/1094 ,  H01M2/22 ,  Y02E60/13

    摘要： An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.

    摘要翻译： 能够通过焊接安装的电化学装置包括由薄膜制成的薄膜包装; 在所述膜包装中与电解质一起封装的电极部分; 一对端子，每个端子的一端连接到所述电极部分，并且每个端子的另一端暴露于所述胶片包装件的外部; 以及与所述薄膜包装的基本上整个表面接触并分别与所述一对端子的暴露端部的部分表面接触的装甲，以封装所述薄膜包装，所述铠装将所述一对端子的剩余部分暴露于 外套的装甲。

    ELECTROCHEMICAL DEVICE
    6.
    发明申请
    ELECTROCHEMICAL DEVICE 失效
    电化学装置

    公开(公告)号：US20110176254A1

    公开(公告)日：2011-07-21

    申请号：US13122139

    申请日：2009-09-30

    申请人： Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

    发明人： Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

    IPC分类号： H01G9/00

    CPC分类号： H01G9/0003 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/18 ,  H01G11/74 ,  H01G11/80 ,  H01M2/0212 ,  H01M2/06 ,  H01M2/30 ,  Y02E60/13

    摘要： Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.

    摘要翻译： 提供了适用于使用无铅焊料的高温回流焊接的电化学装置。 双电层电容器（10）具有电容器元件（11），密封有电容器元件（11）的封装（14）和正极端子（12）和负极端子（13）， 其中的每一个从电容器元件引出并且设置有密封在封装（14）中的部分，电容器元件和其它部分被引出到封装的外部。 在正极端子（12）的一部分和负极端子（13）的一部分上，经由端子（12,13）抑制向电容器元件（11）的热传递的增加的热阻部（HR1） 从正极端子（12）的其他部分和负极端子（13）的其他部分分别配置。

    Electrochemical device
    8.
    发明授权
    Electrochemical device 失效
    电化学装置

    公开(公告)号：US08619409B2

    公开(公告)日：2013-12-31

    申请号：US13122139

    申请日：2009-09-30

    申请人： Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

    发明人： Kazushi Yawata ,  Naoto Hagiwara ,  Katsuei Ishida

    IPC分类号： H01G4/228 ,  H01G9/00 ,  H01G5/01 ,  H01G5/38 ,  H01G5/06 ,  H01M8/04 ,  H01M10/50

    CPC分类号： H01G9/0003 ,  H01G9/016 ,  H01G9/10 ,  H01G9/155 ,  H01G11/18 ,  H01G11/74 ,  H01G11/80 ,  H01M2/0212 ,  H01M2/06 ,  H01M2/30 ,  Y02E60/13

    摘要： An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.

    摘要翻译： 诸如双电层电容器的电化学装置适用于使用无铅焊料的高温回流焊接，并且设置有蓄电元件，其中密封有蓄电元件的封装和 正极端子和负极端子，每个从蓄电元件引出，并且设置有封装在封装中的部分，其中蓄电元件和其它部分被引出到封装外部。 在正极端子的一部分和负极端子的一部分上，增加了用于抑制从正极端子的其他部分和负极端子的其他部分经由端子对蓄电元件的热传递的热阻部分 分别布置。

    ELECTROCHEMICAL DEVICE
    9.
    发明申请
    ELECTROCHEMICAL DEVICE 失效
    电化学装置

    公开(公告)号：US20110056737A1

    公开(公告)日：2011-03-10

    申请号：US12933263

    申请日：2009-03-16

    申请人： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata ,  Motoki Koyabashi

    发明人： Naoto Hagiwara ,  Katsuei Ishida ,  Kazushi Yawata ,  Motoki Koyabashi

    IPC分类号： H05K1/16

    CPC分类号： H01G9/10 ,  H01G2/10 ,  H01G9/155 ,  H01M2/0202 ,  Y02E60/13

    摘要： Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.

    摘要翻译： 提供与使用无铅焊料的高温回流焊接兼容的电化学装置。 电双层电容器10-1包括由膜或膜构成的封装件14，并且具有通过例如热封将膜彼此重叠的密封部分形成的密封部分14a1至14a3。 封装14的密封部分14a1至14a3的整体与具有比构成封装14的膜的刚性更高的刚性的支撑件16以紧密接触的状态被覆盖。