公开(公告)号：US20120012999A1

公开(公告)日：2012-01-19

申请号：US12838291

申请日：2010-07-16

申请人： Kazutaka HONDA ,  Tetsuya ENOMOTO ,  Yuuki NAKAMURA

发明人： Kazutaka HONDA ,  Tetsuya ENOMOTO ,  Yuuki NAKAMURA

IPC分类号： H01L23/28 ,  C09J163/04 ,  C09J179/08 ,  H01L21/56

CPC分类号： H01L21/563 ,  C08G59/42 ,  C08L63/00 ,  C09J163/00 ,  C09J163/04 ,  C09J179/08 ,  H01L23/293 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81805 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

摘要翻译： 本发明涉及半导体封装胶粘剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置。 本发明提供了包含（a）环氧树脂和（b）由与环氧树脂反应的有机酸和固化促进剂形成的化合物的半导体封装粘合剂。

公开(公告)号：US20110241780A1

公开(公告)日：2011-10-06

申请号：US13075227

申请日：2011-03-30

申请人： Kazutaka HONDA ,  Tetsuya Makihara ,  Masakiyo Horie

发明人： Kazutaka HONDA ,  Tetsuya Makihara ,  Masakiyo Horie

IPC分类号： H03F3/45

CPC分类号： H03F3/45183 ,  H03F3/45192 ,  H03F3/45659 ,  H03F2200/261 ,  H03F2203/45404 ,  H03F2203/45421 ,  H03F2203/45424 ,  H03F2203/45434 ,  H03F2203/45512 ,  H03F2203/45514 ,  H03F2203/45544 ,  H03F2203/45726 ,  H03F2203/45728

摘要： An amplifier circuit is provided to be switchable between a single end output configuration and a differential output configuration without increasing a circuit area. When first and fourth switches are turned off and a second switch is turned on, a load circuit functions as an active load on a differential pair and a first output terminal is internally disconnected. The amplifier circuit is provided with a single end output configuration and differentially amplifies input voltages inputted to input terminals and outputs an imbalanced signal from a second output terminal. When the first and fourth switches are turned on and the second switch is turned off, the load circuit functions as a load on the differential pair and the first output terminal is internally connected. The amplifier circuit is provided with a differential output configuration and differentially amplifies the input voltages inputted to the input terminals and outputs balanced signals from the output terminals.

摘要翻译： 提供放大器电路以在单端输出配置和差分输出配置之间切换，而不增加电路面积。 当第一和第四开关断开并且第二开关导通时，负载电路用作差分对上的有效负载，并且第一输出端子在内部断开。 放大器电路具有单端输出配置，差分放大输入到输入端的输入电压，并从第二输出端输出不平衡信号。 当第一和第四开关接通并且第二开关断开时，负载电路用作差动对上的负载，并且第一输出端子被内部连接。 放大器电路具有差分输出配置，差分放大输入到输入端的输入电压，并从输出端输出平衡信号。