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    Light Source with Inner and Outer Bodies
    2.
    发明申请
    Light Source with Inner and Outer Bodies 有权
    光源与内部和外部

    公开(公告)号：US20120235187A1

    公开(公告)日：2012-09-20

    申请号：US13047293

    申请日：2011-03-14

    申请人： Keat Chuan Ng ,  Norfidathul Aizar Abdul Karim ,  Chiau Jin Lee

    发明人： Keat Chuan Ng ,  Norfidathul Aizar Abdul Karim ,  Chiau Jin Lee

    IPC分类号： H01L33/46 ,  H01L33/52

    CPC分类号： H01L33/486 ,  G09F9/33 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light-emitting device having an inner reflective body and an outer non-reflective body is disclosed. The inner reflective body defines a reflector configured to reflect light. In one embodiment, the outer non-reflective body encloses the inner reflective body to minimize reflectivity of the light-emitting device. When assembled into an infotainment display system, the outer non-reflective body may be configured to reduce reflection of ambient light and hence, increase contrast ratio of the display. Reliability performance of the light-emitting device may be improved by using interlocking aperture at the lead frame, interlock structure and interlock geometries defined by the inner reflective body and the outer non-reflective body.

    摘要翻译： 公开了一种具有内部反射体和外部非反射体的发光装置。 内部反射体限定了反射光的反射器。 在一个实施例中，外部非反射体包围内部反射体以最小化发光器件的反射率。 当组装成信息娱乐显示系统时，外部非反射体可以被配置为减少环境光的反射，并因此增加显示器的对比度。 可以通过在引线框架处使用互锁孔，互锁结构和由内反射体和外部非反射体限定的互锁几何形状来改善发光器件的可靠性。

    LEAD FRAME PACKAGE WITH MULTIPLE BENDS
    3.
    发明申请
    LEAD FRAME PACKAGE WITH MULTIPLE BENDS 审中-公开
    引导框架包多个弯

    公开(公告)号：US20120056218A1

    公开(公告)日：2012-03-08

    申请号：US12877796

    申请日：2010-09-08

    申请人： Norfidathul Aizar Abdul Karim ,  Chiau Jin Lee ,  Keat Chuan Ng

    发明人： Norfidathul Aizar Abdul Karim ,  Chiau Jin Lee ,  Keat Chuan Ng

    IPC分类号： H01L33/62 ,  H01L33/08 ,  H01L33/60

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A lead frame package with multiple bends suitable for a light-emitting device, as well as a non-optical device is disclosed. A light-emitting device incorporating the lead frame package with multiple bends may comprise a light source die, a body and a plurality of leads. A non-optical device incorporating the lead frame package may comprise a die, a body and a plurality of leads. Each of the leads has at least first, second, and third bends defining each of the leads into at least first, second, third and fourth sections. At least the second section, the third section and the second bends of each lead are encapsulated by an encapsulating material forming the body.

    摘要翻译： 公开了一种具有适用于发光装置的多个弯曲的引线框架封装以及非光学装置。 结合具有多个弯曲的引线框架封装的发光器件可以包括光源管芯，主体和多个引线。 结合引线框架封装的非光学器件可以包括管芯，主体和多个引线。 每个引线具有至少第一，第二和第三弯曲，其将每个引线限定为至少第一，第二，第三和第四部分。 每个引线的至少第二部分，第三部分和第二弯曲部都被形成本体的封装材料封装。

    Light source
    6.
    发明授权
    Light source 有权
    光源

    公开(公告)号：US08120055B2

    公开(公告)日：2012-02-21

    申请号：US12426768

    申请日：2009-04-20

    申请人： Aizar Abdul Karim Norfidathul ,  Chiau Jin Lee ,  Keat Chuan Ng

    发明人： Aizar Abdul Karim Norfidathul ,  Chiau Jin Lee ,  Keat Chuan Ng

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Embodiments of a light source are disclosed herein. An embodiment of the light source comprises a first terminal and a second terminal. The first terminal comprises a first terminal first portion and a first terminal second portion, wherein at least a portion of the first terminal second portion is located on a first plane, the first terminal second portion comprising at least two contacts separated by a space. A second terminal comprises a second terminal first portion and a second terminal second portion. The second terminal first portion is located proximate the first terminal first portion. The second terminal second portion is located substantially on the first plane and in the space. A light emitter is affixed to the first terminal first portion, the light emitter is electrically connected to the first terminal first portion. A connection exists between the light emitter and the second terminal first portion.

    摘要翻译： 本文公开了光源的实施例。 光源的实施例包括第一端子和第二端子。 第一端子包括第一端子第一部分和第一端子第二部分，其中第一端子第二部分的至少一部分位于第一平面上，第一端子第二部分包括由空间分开的至少两个触点。 第二端子包括第二端子第一部分和第二端子第二部分。 第二端子第一部分位于第一端子第一部分附近。 第二端子第二部分基本上位于第一平面上并在该空间中。 光发射器固定到第一端子第一部分，光发射器电连接到第一端子第一部分。 光发射器和第二端子第一部分之间存在连接。

    Multi-chip packaged LED light source
    7.
    发明授权
    Multi-chip packaged LED light source 有权
    多芯片封装LED光源

    公开(公告)号：US08115385B2

    公开(公告)日：2012-02-14

    申请号：US12871704

    申请日：2010-08-30

    申请人： Aizar Abdul Karim Norfidathul ,  Chiau Jin Lee ,  Kheng Leng Tan ,  Keat Chuan Ng ,  Kiam Soon Ong

    发明人： Aizar Abdul Karim Norfidathul ,  Chiau Jin Lee ,  Kheng Leng Tan ,  Keat Chuan Ng ,  Kiam Soon Ong

    IPC分类号： H01J1/62

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/01068 ,  Y10S362/80

    摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.

    摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。

    MULTI-CHIP PACKAGED LED LIGHT SOURCE
    8.
    发明申请
    MULTI-CHIP PACKAGED LED LIGHT SOURCE 有权
    多芯片包装LED光源

    公开(公告)号：US20100320485A1

    公开(公告)日：2010-12-23

    申请号：US12871704

    申请日：2010-08-30

    申请人： Aizar Abdul Karim Norfidathul ,  Chiau Jin Lee ,  Kheng Leng Tan ,  Keat Chuan Ng ,  Kiam Soon Ong

    发明人： Aizar Abdul Karim Norfidathul ,  Chiau Jin Lee ,  Kheng Leng Tan ,  Keat Chuan Ng ,  Kiam Soon Ong

    IPC分类号： H01L33/44 ,  H01L33/52 ,  H01L33/64

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/01068 ,  Y10S362/80

    摘要： A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.

    摘要翻译： 公开了一种具有引线框架，主体和多个管芯的光源，每个管芯具有LED。 主体包括顶表面，底表面和多个侧表面。 引线框架包括第一部分，第二部分和第三部分，第一部分包括具有穿过主体并终止于底部表面上的焊盘的第一突起的管芯安装区域。 第二和第三部分各自包括弯曲以形成沿着一个侧表面延伸的第一和第二引线的突起。 每个模具结合到模具安装区域，使得第一触点电连接到模具安装区域，并且第二触点连接到第二和第三部分中的一个。 第一部分的第一突起提供改善的热传递。

    Light emitting device having increased light output
    9.
    发明申请
    Light emitting device having increased light output 审中-公开
    具有增加的光输出的发光器件

    公开(公告)号：US20070284589A1

    公开(公告)日：2007-12-13

    申请号：US11449088

    申请日：2006-06-08

    申请人： Keat Chuan Ng ,  Wei Liam Loo ,  Chiau Jin Lee ,  Yean Chon Yaw

    发明人： Keat Chuan Ng ,  Wei Liam Loo ,  Chiau Jin Lee ,  Yean Chon Yaw

    IPC分类号： H01L33/00 ,  H01L31/12 ,  H01L27/15 ,  H01L29/26

    CPC分类号： F21K9/00 ,  B29C39/003 ,  B29C39/10 ,  B29K2995/0018 ,  B29L2011/00 ,  H01L33/54 ,  H01L33/60

    摘要： The light intensity emitted from a package is increased by adjusting a portion of the package encapsulant so that light impacting the side walls of the adjusted encapsulant portion will encounter total internal reflection (TIR) with the reflected light directed toward the top surface of the package. The adjusted portion of the package is positioned so that air can be used as the second (exterior) medium with the critical TIR angle being such that light emitted from a light source (such as from an LED die) will be directed primarily so as to escape the package from the top surface as opposed to being scattered internal to the package. In one embodiment, a lower portion of the encapsulant is surrounded by a casing to inwardly direct light from the light source that impacts the side of the encapsulant with an angle less than the critical TIR angle.

    摘要翻译： 通过调节封装密封剂的一部分来增加从封装发射的光强度，使得影响调节的密封剂部分的侧壁的光将遇到全反射（TIR），反射光指向封装的顶表面。 包装的经调节的部分定位成使得空气可以用作第二（外部）介质，其中临界TIR角度使得从光源（例如来自LED管芯）发射的光将主要被定向为 将包装从顶面排出，而不是在包装内部散开。 在一个实施例中，密封剂的下部被壳体包围以向内引导来自光源的光，其以小于临界TIR角的角度撞击密封剂的侧面。