Heat sink device for electronic devices
    1.
    发明授权
    Heat sink device for electronic devices 失效
    电子设备散热装置

    公开(公告)号:US6115252A

    公开(公告)日:2000-09-05

    申请号:US343459

    申请日:1999-06-30

    IPC分类号: H05K7/20 G06F1/20

    摘要: A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a heat removal opening. A heat sink disposed within the housing comprises a metal body having a heat pipe portion, and a radiation fin attached to the body in the vicinity of the heat removal opening and opposed to the opening. The heat-generating electronic component, such as CPU, is held in contact with the metal body at a location away from the fin attached portion thereof.

    摘要翻译: 一种用于电子装置的散热装置,用于将电子装置的壳体外部的大气散发到设置在壳体内的电子部件产生的热量。 壳体具有形成有散热开口的周壁。 设置在壳体内的散热器包括具有热管部分的金属体和在除热开口附近并与开口相对的散热片。 诸如CPU的发热电子部件在远离其翅片连接部分的位置处与金属体保持接触。

    METHOD FOR SURFACE PROCESSING
    7.
    发明申请
    METHOD FOR SURFACE PROCESSING 审中-公开
    表面处理方法

    公开(公告)号:US20110223339A1

    公开(公告)日:2011-09-15

    申请号:US13128513

    申请日:2009-12-08

    IPC分类号: B05D1/36 B82Y30/00 B82Y40/00

    CPC分类号: B82Y30/00 B22D17/2007

    摘要: A method for a surface processing is provided. The method may include coating a surface of an object by a carbon coating including at least one type of a nano carbon selected from a carbon nano coil, a carbon nanotube and a carbon nano filament and applying liquid including fullerene to the carbon coating.

    摘要翻译: 提供了一种表面处理方法。 该方法可以包括通过包括选自碳纳米线圈,碳纳米管和碳纳米线的至少一种纳米碳的碳涂层涂覆物体的表面,并将包含富勒烯的液体涂覆到碳涂层上。

    DIE-CASTING DIE AND METHOD FOR DIE-CASTING
    8.
    发明申请
    DIE-CASTING DIE AND METHOD FOR DIE-CASTING 有权
    铸造模具和铸造方法

    公开(公告)号:US20110209844A1

    公开(公告)日:2011-09-01

    申请号:US13127518

    申请日:2009-10-16

    IPC分类号: B22D17/22 B22D27/04

    摘要: PROBLEMSA method for die-casting that fluidity of molten material is satisfactory and the molten material solidifies with suitable speed is realized.MEANS OF SOLVING THE PROBLEMSA die-casting die 12 comprises a cavity forming surface 9b. A part of the cavity forming surface 9b is coated with a surface treatment layer 24 having a thermal conductivity that increases in connection to an increase in an acted pressure. Satisfactory fluidity is kept at a cavity forming surface 8b coated with the surface treatment layer 24 until a filling of the molten material to the cavity 9 is completed. The molten material is cooled by the cavity forming surface 8b coated with the surface treatment layer 24 increasing the thermal conductivity after the filling of the molten material to the cavity 9 is completed.

    摘要翻译: 一种压铸方法,其中熔融材料的流动性令人满意并且熔融材料以合适的速度固化。 解决问题的手段压铸模具12包括空腔形成表面9b。 腔形成表面9b的一部分涂覆有表现处理层24,该表面处理层24具有与作用压力的增加相关联的增加的热导率。 令人满意的流动性保持在涂覆有表面处理层24的空腔形成表面8b上,直到熔融材料填充到空腔9完成。 熔融材料被涂覆有表面处理层24的空腔形成表面8b冷却,在熔融材料填充到空腔9完成之后增加热导率。

    Semiconductor module
    9.
    发明授权
    Semiconductor module 有权
    半导体模块

    公开(公告)号:US07923833B2

    公开(公告)日:2011-04-12

    申请号:US12086715

    申请日:2006-12-11

    IPC分类号: H01L23/06

    摘要: A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

    摘要翻译: 半导体模块10包括陶瓷基板,其具有安装有半导体元件12的前表面和在前表面的相对侧上的后表面,与前表面接合的前金属板15,后金属板16接合 后部金属板16包括面向散热片13的接合面16b。接合面16b包括接合区域和非接合区域。 非接合区域包括在后金属板16的厚度方向上延伸的凹部18.后金属板16的接合面积在接合面16b的总面积的65%〜85%的范围内 后金属板16.结果,可以在发生由于热应力引起的变形和开裂的同时实现优异的散热性能。

    Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device
    10.
    发明授权
    Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device 失效
    制冷系统,压缩和放热装置和散热装置

    公开(公告)号:US07690217B2

    公开(公告)日:2010-04-06

    申请号:US10531705

    申请日:2003-10-24

    IPC分类号: F25B1/00

    摘要: A refrigeration system including a two-stage type compressor having independent low-pressure and high-pressure compressing portions, a heat-releasing device having independent primary and secondary heat-releasing paths, an expansion valve and a cooler. The refrigerant primarily compressed by the low-pressure compressing portion is primarily released in heat by the primary heat-releasing path. The primarily heat-released refrigerant is secondarily compressed by the high-pressure compressing portion. The secondarily compressed refrigerant is secondarily released in heat by the secondary heat-releasing path to thereby obtain a low-temperature and high-pressure refrigerant. The low-temperature and high-pressure refrigerant is decompressed and expanded by an expansion valve and passes through the cooler to absorb the heat in a room air, and then returns to the low-pressure compressing portion of the compressor. In this system, the refrigerant temperature during the heat-releasing procedure can be kept low.

    摘要翻译: 一种包括具有独立的低压和高压压缩部分的两级式压缩机的制冷系统,具有独立的一次和二次散热路径的散热装置,膨胀阀和冷却器。 主要由低压压缩部压缩的制冷剂主要通过一次散热路径被放热。 主要由热释放的制冷剂被高压压缩部二次压缩。 二次压缩的制冷剂通过二次放热路径被二次释放,从而获得低温高压的制冷剂。 低温高压制冷剂通过膨胀阀进行减压膨胀,通过冷却器吸收室内空气中的热量,然后返回到压缩机的低压压缩部。 在该系统中,可以将散热过程中的制冷剂温度保持为低。