Optical interconnect and method for making the same
    1.
    发明申请
    Optical interconnect and method for making the same 审中-公开
    光互连及其制作方法

    公开(公告)号:US20050047708A1

    公开(公告)日:2005-03-03

    申请号:US10648717

    申请日:2003-08-26

    摘要: A method of fabricating an integrated optical interconnection includes forming a first optical waveguide in a semiconductor substrate, forming a first layer of dielectric material disposed above the optical waveguide, forming an optical interconnect in the first dielectric layer and disposed proximate to the first optical waveguide. The method further includes forming a second layer of dielectric material disposed above the optical interconnect, forming a second optical waveguide in the second layer of dielectric material and disposed proximate to the first optical waveguide, and forming a conductive contact disposed above and proximate the second optical waveguide.

    摘要翻译: 一种制造集成光学互连的方法包括:在半导体衬底中形成第一光波导,形成布置在光波导上方的第一介电材料层,在第一电介质层中形成光学互连并设置在第一光波导附近。 该方法还包括形成布置在光学互连件上方的第二介电材料层,在第二介电材料层中形成第二光波导,并设置在靠近第一光波导的位置,以及形成设置在第二光学器件上方和附近的导电触点 波导。

    Photonic analog-to-digital converters using photonic crystals
    2.
    发明申请
    Photonic analog-to-digital converters using photonic crystals 失效
    使用光子晶体的光子模数转换器

    公开(公告)号:US20060097900A1

    公开(公告)日:2006-05-11

    申请号:US10304214

    申请日:2002-11-26

    IPC分类号: H03M1/66

    摘要: A system and method for quantizing a photonic signal involves passing the photonic signal through a photonic crystal. The photonic crystal has localized defects for splitting the photonic signal into a plurality of quantized photonic components and for directing the quantized photonic components to a set of optical detectors. A digital conversion of the photonic signal can occur by performing a threshold comparison of the quantized components, either in the electrical domain through comparators or in the optical domain through optical limiters.

    摘要翻译: 用于量子化光子信号的系统和方法涉及使光子信号通过光子晶体。 光子晶体具有局部缺陷,用于将光子信号分裂成多个量子化的光子分量,并将量化的光子分量引导到一组光学检测器。 可以通过在电域中通过比较器或通过光学限制器在光学域中执行量化分量的阈值比较来发生光子信号的数字转换。

    Photonic analog-to-digital converters using photonic crystals
    3.
    发明授权
    Photonic analog-to-digital converters using photonic crystals 失效
    使用光子晶体的光子模数转换器

    公开(公告)号:US07212140B2

    公开(公告)日:2007-05-01

    申请号:US10304214

    申请日:2002-11-26

    IPC分类号: H03M1/00

    摘要: A system and method for quantizing a photonic signal involves passing the photonic signal through a photonic crystal. The photonic crystal has localized defects for splitting the photonic signal into a plurality of quantized photonic components and for directing the quantized photonic components to a set of optical detectors. A digital conversion of the photonic signal can occur by performing a threshold comparison of the quantized components, either in the electrical domain through comparators or in the optical domain through optical limiters.

    摘要翻译: 用于量子化光子信号的系统和方法涉及使光子信号通过光子晶体。 光子晶体具有局部缺陷,用于将光子信号分裂成多个量子化的光子分量,并将量化的光子分量引导到一组光学检测器。 可以通过在电域中通过比较器或通过光学限制器在光学域中执行量化分量的阈值比较来发生光子信号的数字转换。

    Solid state optical interconnect system
    4.
    发明授权
    Solid state optical interconnect system 失效
    固态光互连系统

    公开(公告)号:US06839472B1

    公开(公告)日:2005-01-04

    申请号:US09841992

    申请日:2001-04-25

    摘要: A solid state optical interconnect system selectively interconnects a plurality of electromagnetic signals between a plurality of inputs and a plurality of outputs. The system includes a plurality of solid state, selectively actuatable 2×2 optical switching elements; and a plurality of all-optical signal paths extending through said 2×2 optical switching elements between the inputs and outputs. Each of said plurality of all-optical signal paths has substantially the same pathlength. This switch element is relatively robust and insensitive to environmental disturbances and has a reconfiguration time which is an order of magnitude faster than conventional opto-mechanical switches which generally require tens of milliseconds before reconfiguration. The switch element provides constant data pathlength for constant latency, loss, and unskewed data output. The element also advantageously provides for convenient scaling to a non-blocking N×N configuration using N*(log2 N−1) 2×2 switches rather than conventional approaches which require N(log2 N) switches, for a relatively simple and compact configuration.

    摘要翻译: 固态光互连系统选择性地互连多个输入和多个输出之间的多个电磁信号。 该系统包括多个固态可选择致动的2x2光开关元件; 以及在输入和输出之间延伸穿过所述2x2光开关元件的多个全光信号路径。 所述多个全光信号路径中的每一个具有基本上相同的路径长度。 该开关元件相对鲁棒且对环境干扰不敏感,并且具有比常规光机械开关快一个数量级的重新配置时间,通常在重新配置之前需要几十毫秒。 开关元件提供恒定的数据路径长度,用于恒定的延迟,丢失和非限制数据输出。 该元件还有利地提供了使用N *(log2N-1)2x2开关的非阻塞NxN配置的方便的缩放,而不是需要N(log2 N)个开关的常规方法,用于相对简单和紧凑的配置。

    Thin embedded active IC circuit integration techniques for flexible and rigid circuits
    5.
    发明申请
    Thin embedded active IC circuit integration techniques for flexible and rigid circuits 失效
    薄型嵌入式有源IC电路集成技术,用于柔性和刚性电路

    公开(公告)号:US20060249754A1

    公开(公告)日:2006-11-09

    申请号:US11121236

    申请日:2005-05-03

    IPC分类号: H01L27/10

    摘要: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. A releasable bonding layer is used to join the semiconductor chip to a mounting assembly during the grinding operation and removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

    摘要翻译: 由多个电介质层形成的柔性电子电路部件包括嵌入电路部件内的多个变薄的半导体芯片,用于提高集成度和部件密度。 减薄的半导体芯片可以包括其上的各种集成电路。 它们可以形成在各种基板上并使用各种技术,并且嵌入的,变薄的半导体芯片通过在相应的电介质层之间延伸并穿过各个电介质层的图案化互连而互连。 形成柔性电路部件的方法包括将常规半导体芯片连接到安装装置,然后研磨半导体芯片以形成连接到组合形成柔性电子电路部件的各个电介质层的变薄的半导体芯片。 在研磨操作期间使用可剥离粘合层将半导体芯片连接到安装组件,并且在减薄的半导体芯片组合到组合使用的相应电介质层之后去除以形成电子电路部件。

    High density interconnect structure for use on software defined radio
    6.
    发明授权
    High density interconnect structure for use on software defined radio 失效
    用于软件定义无线电的高密度互连结构

    公开(公告)号:US07054599B2

    公开(公告)日:2006-05-30

    申请号:US10434053

    申请日:2003-05-08

    IPC分类号: H04B1/38

    摘要: A radio and method of making the radio is disclosed having a first set of radio components for processing analog signals in a radio transmission and a second set of radio components for processing digital signals in a radio transmission. The radio comprises a substrate base support, and at least one pocket formed within the substrate. The radio comprises at least one processor, each of the at least one processor being within a corresponding one of the at least one pocket for modulating a radio signal into one of a plurality of waveforms based on a software instruction set. Each of the at least one processor being in electronic communication with both of the first and second sets of the radio components. A dielectric layer covers a top surface of the substrate and each of the at least one processor. A plurality of vias are formed in the dielectric layer to expose selected portions of each of the at least one processor. A metallization layer is formed over the dielectric layer and over the plurality of vias so that each of the at least one processor is in electrical communication with the first and second sets of radio components.

    摘要翻译: 公开了一种使收音机的无线电和方法,其具有用于处理无线电传输中的模拟信号的第一组无线电组件和用于在无线电传输中处理数字信号的第二组无线电组件。 无线电装置包括衬底基底支撑件和形成在衬底内的至少一个口袋。 所述无线电装置包括至少一个处理器,所述至少一个处理器中的每一个位于所述至少一个口袋中的对应的一个口袋内,用于基于软件指令集将无线电信号调制成多个波形中的一个。 所述至少一个处理器中的每一个与所述第一和第二组无线电部件电子通信。 介电层覆盖基板的顶表面和至少一个处理器中的每一个。 在电介质层中形成多个通孔以暴露至少一个处理器中的每一个的选定部分。 金属化层形成在电介质层上并在多个通孔之上,使得至少一个处理器中的每一个与第一和第二组无线电部件电连通。

    Micro electromechanical system controlled organic led and pixel arrays and method of using and of manufacturing same
    7.
    发明授权
    Micro electromechanical system controlled organic led and pixel arrays and method of using and of manufacturing same 有权
    微机电系统控制有机LED和像素阵列及其使用和制造方法

    公开(公告)号:US06677709B1

    公开(公告)日:2004-01-13

    申请号:US09618665

    申请日:2000-07-18

    IPC分类号: H05B3300

    摘要: Organic light emitting devices are disclosed that use a micro electromechanical system (MEMS) structure to enable a pixel and pixel array wherein each pixel contains a MEMS and an OLED element. A MEMS structure is used for switching the OLED element. These OLED/MEMS pixels can be fabricated on flex circuit, silicon, as well as other inorganic materials. They can be fabricated in a large array for developing a 2-dimensional display application and each pixel can be addressed through conventional matrix scanning addressing scheme. The ability of fabricating these OLED/MEMS pixels on flexible organic substrates as well as other rigid substrates enables wider selection of substrate materials for use with different applications.

    摘要翻译: 公开了使用微机电系统(MEMS)结构来实现其中每个像素包含MEMS和OLED元件的像素和像素阵列的有机发光器件。 MEMS结构用于切换OLED元件。 这些OLED / MEMS像素可以在柔性电路,硅以及其它无机材料上制造。 它们可以以大阵列制造,用于开发二维显示应用,并且可以通过常规矩阵扫描寻址方案来寻址每个像素。 在柔性有机衬底以及其他刚性衬底上制造这些OLED / MEMS像素的能力使得能够更广泛地选择用于不同应用的衬底材料。

    Thin embedded active IC circuit integration techniques for flexible and rigid circuits
    8.
    发明授权
    Thin embedded active IC circuit integration techniques for flexible and rigid circuits 失效
    薄型嵌入式有源IC电路集成技术,用于柔性和刚性电路

    公开(公告)号:US08120173B2

    公开(公告)日:2012-02-21

    申请号:US11121236

    申请日:2005-05-03

    IPC分类号: H01L23/34

    摘要: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. A releasable bonding layer is used to join the semiconductor chip to a mounting assembly during the grinding operation and removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.

    摘要翻译: 由多个电介质层形成的柔性电子电路部件包括嵌入电路部件内的多个变薄的半导体芯片,用于提高集成度和部件密度。 减薄的半导体芯片可以包括其上的各种集成电路。 它们可以形成在各种基板上并使用各种技术,并且嵌入的,变薄的半导体芯片通过在相应的电介质层之间延伸并穿过各个电介质层的图案化互连而互连。 形成柔性电路部件的方法包括将常规半导体芯片连接到安装装置,然后研磨半导体芯片以形成连接到组合形成柔性电子电路部件的各个电介质层的变薄的半导体芯片。 在研磨操作期间使用可剥离粘合层将半导体芯片连接到安装组件,并且在减薄的半导体芯片组合到组合使用的相应电介质层之后去除以形成电子电路部件。

    High-speed optical read/write pick-up mechanisms and associated methods
    9.
    发明授权
    High-speed optical read/write pick-up mechanisms and associated methods 有权
    高速光读/写拾取机制及相关方法

    公开(公告)号:US06912183B2

    公开(公告)日:2005-06-28

    申请号:US10368170

    申请日:2003-02-18

    IPC分类号: G11B7/085 G11B7/135 G11B7/00

    摘要: High-speed pick-up mechanisms operable for reading data from and/or writing data to an optical storage medium are disclosed. These mechanisms comprise a pivotable structure, a reflective element, a light source, a light receiving device, and an actuation device. The light source and the light receiving device are remotely located from the reflective element via the pivotable structure, and only the reflective element and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-speed optical read/write devices and systems comprising these high-speed pick-up mechanisms are also disclosed. Additionally, high-speed methods for reading data from and/or writing data to an optical storage medium are disclosed.

    摘要翻译: 公开了用于从光学存储介质读取和/或写入数据的高速拾取机构。 这些机构包括可枢转结构,反射元件,光源,光接收装置和致动装置。 光源和光接收装置通过可枢转结构远离反射元件,只有反射元件和可枢转结构的一部分位于光存储介质的表面附近。 还公开了包括这些高速拾取机构的高速光学读/写装置和系统。 另外,公开了从光存储介质读取数据和/或将数据写入光存储介质的高速方法。

    All-optical interconnect utilizing polarization gates
    10.
    发明授权
    All-optical interconnect utilizing polarization gates 失效
    利用偏振门的全光互连

    公开(公告)号:US06259831B1

    公开(公告)日:2001-07-10

    申请号:US09342422

    申请日:1999-06-29

    IPC分类号: G02B1295

    摘要: A switch element utilizes a single polarizer to couple two discreet inputs to any combination of two discreet outputs along non-blocking optical paths. This switch element may be conveniently networked to additional switch elements for scaling to switches having larger numbers (N) of inputs and outputs. The present invention provides advantages typically associated with conventional polarization gates, including terabit per-second data rates, to facilitate use in fiber-optics networks. This switch element is relatively robust and insensitive to environmental disturbances and has a reconfiguration time which is an order of magnitude faster than conventional optomechanical switches which generally require tens of milliseconds before reconfiguration. The switch element provides constant data pathlength for constant latency, loss, and unskewed data output. The element also advantageously provides for convenient scaling to a non-blocking N×N configuration using N* (log2 N−1) 2×2 switches rather than conventional approaches which require N(log2N) switches, for a relatively simple and compact configuration.

    摘要翻译: 开关元件利用单个偏振器将两个谨慎的输入耦合到沿着非阻塞光路的两个离散输出的任何组合。 该开关元件可以方便地与额外的开关元件联网,用于缩放到具有较大数量(N)个输入和输出的开关。 本发明提供了通常与常规偏振门相关联的优点,包括兆比特每秒数据速率,以便于在光纤网络中使用。 该开关元件相对鲁棒且对环境干扰不敏感,并且具有重新配置时间,其比通常在重新配置之前需要几十毫秒的常规光机械开关快一个数量级。 开关元件提供恒定的数据路径长度,用于恒定的延迟,丢失和非限制数据输出。 该元件还有利地提供了使用N *(log2N-1)×2x2开关的非阻塞NxN配置的方便的缩放,而不是需要N(log2N)开关的常规方法,用于相对简单和紧凑的配置。