公开(公告)号：US4603181A

公开(公告)日：1986-07-29

申请号：US719738

申请日：1985-04-03

申请人： Kenichi Nishino ,  Hiromu Miyashita ,  Tadao Fukui

发明人： Kenichi Nishino ,  Hiromu Miyashita ,  Tadao Fukui

IPC分类号： B29C39/10 ,  B29C43/20 ,  B29C51/14 ,  B29K105/06 ,  C08F290/00 ,  C08F299/00 ,  C08F299/02 ,  C08F299/06 ,  C08G18/67 ,  C08G18/78 ,  C08J7/04 ,  C09D163/10 ,  C09D175/14 ,  C08L63/10

CPC分类号： C08G18/7887 ,  B29C43/203 ,  B29C51/14 ,  C08F299/026 ,  C08F299/065 ,  C08G18/672 ,  C09D163/10 ,  Y10S525/92

摘要： One-package type composition for in-mold coating is disclosed which contains (a) a urethane compound having at least two acryloyloxy or methacryloyloxy groups at the terminal and at least one 1-oxa-3,5-diazine-2,4,6-trione ring in the molecule, (b) an ester resin having at least one reactive double bond prepared by the reaction of an epoxy compound with an unsaturated carboxylic acid and (c) a vinyl monomer. The composition is useful for coating the molded product from fiberglass reinforced thermosetting polyester resin compounds within a mold. The composition, when coated, shows excellent adherence to the molded product and excellent water resistance.

摘要翻译： 公开了一种用于模内涂布的单组分组合物，其包含（a）在末端具有至少两个丙烯酰氧基或甲基丙烯酰氧基的氨基甲酸酯化合物和至少一个1-氧杂-3,5-二嗪-2,4,6 （b）通过环氧化合物与不饱和羧酸的反应制备的至少一种反应性双键的酯树脂和（c）乙烯基单体。 该组合物可用于在模具内从玻璃纤维增​​强的热固性聚酯树脂化合物涂覆模制产品。 当涂覆时，组合物显示出优异的粘合性和优异的耐水性。

公开(公告)号：US20090120998A1

公开(公告)日：2009-05-14

申请号：US12350334

申请日：2009-01-08

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B23K31/02

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

摘要翻译： 提供了一种加热加压装置（101），其上带有经由接合元件（9）与其预粘合的电子部件（8）的电路板（70）。 加热加压装置通过具有加热装置（122）的接触构件（1211）加热和加压电子部件，将电子部件与电路板进行后接合。 通过相互独立地执行电子部件到电路板的预接合和后接合，与现有的情况相比，可以降低后接合所需的时间，并且整个安装线的生产率 可以改进。

公开(公告)号：US6055724A

公开(公告)日：2000-05-02

申请号：US155720

申请日：1998-10-02

申请人： Kenichi Nishino ,  Shinji Kanayama ,  Hiroyuki Otani ,  Kohei Enchi ,  Hiroyuki Yoshida

发明人： Kenichi Nishino ,  Shinji Kanayama ,  Hiroyuki Otani ,  Kohei Enchi ,  Hiroyuki Yoshida

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/56 ,  H01L23/28 ,  H01R43/00 ,  B23P19/00

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L21/563 ,  H01L21/67126 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49171 ,  Y10T29/53178

摘要： A method and device for sealing an IC chip are provided, by which a sealing material is surely discharged onto the upper surface of a circuit board, and the occurrence of imperfect sealing can be eliminated. A first gap (h1) is provided between an application nozzle (15) and a circuit board (13) on which an IC chip (12) is mounted before discharging the sealing material (17), after which a second gap (h2) which is greater than the first gap (h1) is provided between the application nozzle (15) and the circuit board (13) while discharging the sealing material (17), thereby accomplishing the sealing of the IC chip (12), and ensuring that the sealing operation is performed after the sealing material (17) has completely come to contact with the upper surface of the circuit board (13).

摘要翻译： PCT No.PCT / JP98 / 00447 Sec。 371日期：1998年10月2日 102（e）1998年10月2日日期PCT提交1998年2月2日PCT公布。 第WO98 / 34276号公报 日本1998年8月6日提供了一种用于密封IC芯片的方法和装置，通过该方法和装置可靠地将密封材料排出到电路板的上表面上，并且可以消除不完全密封的发生。 在排出密封材料（17）之前，在施加喷嘴（15）和安装有IC芯片（12）的电路板（13）之间设置有第一间隙（h1），之后，将第二间隙（h2） 大于在排出密封材料（17）时在施加喷嘴（15）和电路板（13）之间提供第一间隙（h1），从而实现IC芯片（12）的密封，并且确保 在密封材料（17）完全与电路板（13）的上表面接触之后进行密封操作。

公开(公告)号：US4456744A

公开(公告)日：1984-06-26

申请号：US445098

申请日：1982-11-29

申请人： Yoshio Kamatani ,  Michio Tanaka ,  Kyuya Yamazaki ,  Kenichi Nishino

发明人： Yoshio Kamatani ,  Michio Tanaka ,  Kyuya Yamazaki ,  Kenichi Nishino

IPC分类号： C08G18/00 ,  C08G18/08 ,  C08G18/40 ,  C08G18/50 ,  C08G18/62 ,  C08G18/64 ,  C08G18/70 ,  C08G18/78 ,  C08G18/79 ,  C09D175/00 ,  C09J175/00

CPC分类号： C08G18/0804 ,  C08G18/5021 ,  C08G18/6266 ,  C08G18/6283 ,  C08G18/6415 ,  C08G18/643 ,  C08G18/701 ,  C08G18/7887

摘要： Disclosed is a composition for polyurethane resins which is ordinarily of two-package type and curable at ambient temperature and which comprises an isocyanate component having oxadiazinetrione ring as a curing agent and a polyol component, having in the molecule, at least one of a tertiary amino group, a quaternary ammonium group and a salt-formed carboxyl group as a main component. The composition has excellent curability and provides cured products excellent in adhesiveness and physical properties.

摘要翻译： 公开了一种聚氨酯树脂的组合物，其通常为双组分型并且在环境温度下可固化，并且其包含具有恶二嗪三酮环作为固化剂的异氰酸酯组分和多元醇组分，其在分子中具有至少一个叔氨基 基团，季铵基和盐形成的羧基作为主要成分。 该组合物具有优异的固化性，并提供粘合性和物理性能优异的固化产物。

公开(公告)号：US06544377B1

公开(公告)日：2003-04-08

申请号：US09554721

申请日：2000-05-18

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B32B3120

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

公开(公告)号：US5582341A

公开(公告)日：1996-12-10

申请号：US496691

申请日：1995-06-29

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Ohnakada ,  Kenichi Nishino ,  Nobuhiko Muraoka

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Ohnakada ,  Kenichi Nishino ,  Nobuhiko Muraoka

IPC分类号： G02F1/1345 ,  B23K20/02 ,  G09F9/00 ,  H01L23/50 ,  B23K37/04

CPC分类号： B23K20/023

摘要： A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

摘要翻译： 提供一种端子部件接合装置，其具有用于支撑其上具有端子部件的板的支撑台。 具有加热器的压力工具以可移动的方式设置在工作台上方的垂直方向上，以便将端子部件以热和压力结合到板上。 沿着压力工具的下表面设置无震动片材，沿着无震动片材的下表面设置用于端子部件的按压板，并且由比无冲击片材的热膨胀系数低的板材制成。

公开(公告)号：US5064900A

公开(公告)日：1991-11-12

申请号：US469748

申请日：1990-01-19

申请人： Hisayuki Iwai ,  Yasuhrio Mishima ,  Ken Hatta ,  Kenichi Nishino ,  Sanji Aoki ,  Tatsuhiko Ozaki ,  Hirotaka Wada

发明人： Hisayuki Iwai ,  Yasuhrio Mishima ,  Ken Hatta ,  Kenichi Nishino ,  Sanji Aoki ,  Tatsuhiko Ozaki ,  Hirotaka Wada

IPC分类号： C08K13/02 ,  C08F2/44 ,  C08F283/01 ,  C08F299/04 ,  C08K7/02 ,  C08L67/06

CPC分类号： C08L67/06

摘要： A curable unsaturated polyester resin composition contains graft copolymers each having 10-60 weight % of a first constituent given by ##STR1## 38-89.7 weight % of a second constituent given by ##STR2## and 0.3-2 weight % of a third constituent which is a vinyl monomer unit having carboxylic acid or carboxylic anhydride groups, unsaturated polyester, vinyl monomer, a filler, a curing catalyst, and reinforcing fibers, where either of R.sup.1 and R.sup.2 is H, the other being either H or CH.sub.3, R.sub.3 is ethylene group or propylene group, R.sup.4 is hydrocarbon group with 1-18 carbton atoms, R.sup.5 is alkyl group with 1-4 carbon atoms, R.sup.6 is alkyl group with 1-3 carbon atoms, m is 6-90 and n is 1-5.

摘要翻译： 可固化的不饱和聚酯树脂组合物含有接枝共聚物，它们各自具有10-60重量％的第一组分，由第<！ - SIPO - >图38-89.7重量％ 作为具有羧酸或羧酸酐基团的乙烯基单体单元的第三组分，不饱和聚酯，乙烯基单体，填料，固化催化剂和增强纤维，其中R 1和R 2中的任一个是H，另一个是H或CH 3， R3是亚乙基或亚丙基，R4是具有1-18个碳原子的烃基，R5是1-4个碳原子的烷基，R6是1-3个碳原子的烷基，m是6-90，n是1 -5。

公开(公告)号：US4952652A

公开(公告)日：1990-08-28

申请号：US232027

申请日：1988-08-15

申请人： Kenichi Nishino ,  Takashi Shibata ,  Sanzi Aoki ,  Yasuhiro Mishima ,  Hisayuki Iwai ,  Ken Hatta

发明人： Kenichi Nishino ,  Takashi Shibata ,  Sanzi Aoki ,  Yasuhiro Mishima ,  Hisayuki Iwai ,  Ken Hatta

IPC分类号： C08F283/01 ,  C08F299/04 ,  C08K5/09 ,  C08L53/02 ,  C08L67/00 ,  C08L67/06

CPC分类号： C08L53/02 ,  C08F299/0464 ,  C08L67/06

摘要： Unsaturated polyester compositions which are quickly curable and from which molded products with superior surface quality can be obtained are characterized as being composed of an unsaturated polyester, an olefinic unsaturated monomer, an aromatic vinyl-conjugated diene block copolymer or a hydrogenated aromatic vinyl-conjugated diene block copolymer, a mixture of t-butylperoxy benzoate, t-butylperoxy octoate and 1,1-bis(t-butylperoxy) 3,3,5-trimethyl cyclohexane, and at least one selected from organic compounds of cobalt, copper and manganese.

摘要翻译： 可以得到快速固化的不饱和聚酯组合物和具有优异表面质量的成型产品，其特征在于由不饱和聚酯，烯属不饱和单体，芳族乙烯基 - 共轭二烯嵌段共聚物或氢化芳族乙烯基共轭二烯 嵌段共聚物，过氧苯甲酸叔丁酯，过氧辛酸叔丁酯和1,1-双（叔丁基过氧）3,3,5-三甲基环己烷的混合物，以及选自钴，铜和锰的有机化合物中的至少一种。

公开(公告)号：US07490652B2

公开(公告)日：2009-02-17

申请号：US11235183

申请日：2005-09-27

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B29C65/48 ,  B29C65/54 ,  B32B37/06 ,  B32B37/10 ,  B32B39/00 ,  H05K13/04

CPC分类号： H01L24/75 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75317 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K13/0469 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/16 ,  Y10T156/17 ,  Y10T156/1702 ,  H01L2924/00

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

摘要翻译： 提供了一种加热加压装置（101），其上带有经由接合元件（9）与其预粘合的电子部件（8）的电路板（70）。 加热加压装置通过具有加热装置（122）的接触构件（1211）加热和加压电子部件，将电子部件与电路板进行后接合。 通过相互独立地执行电子部件到电路板的预接合和后接合，与现有的情况相比，可以降低后接合所需的时间，并且整个安装线的生产率 可以改进。

公开(公告)号：US07220922B2

公开(公告)日：2007-05-22

申请号：US10399915

申请日：2001-10-23

申请人： Kenichi Nishino ,  Shinji Kanayama ,  Shinjiro Tsuji ,  Masayuki Ida ,  Tomotaka Nishimoto

发明人： Kenichi Nishino ,  Shinji Kanayama ,  Shinjiro Tsuji ,  Masayuki Ida ,  Tomotaka Nishimoto

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： G02F1/13452 ,  H01L2924/0002 ,  H01R4/04 ,  H01R12/62 ,  H01R12/7076 ,  H05K1/118 ,  H05K1/189 ,  H05K3/361 ,  H05K13/046 ,  Y10T29/49144 ,  Y10T156/17 ,  Y10T156/1744 ,  H01L2924/00

摘要： Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

摘要翻译： 组件安装设备将FPC板安装在LCD板上。 LCD板具有在一个侧边缘上的第一电极部分和在另一个侧边缘上的第二电极部分。 FPC基板具有在一个侧边缘上的第一部分和在另一个侧边缘上的第二部分。 第一安装装置将第一部分安装在第一电极部分上。 第二安装装置将第二部分安装在第二电极部分上。 在第二部件安装装置中，第二部分在ACF供给部分与第二电极部分分离，并在预压接合部分处被释放。