公开(公告)号：US6055724A

公开(公告)日：2000-05-02

申请号：US155720

申请日：1998-10-02

申请人： Kenichi Nishino ,  Shinji Kanayama ,  Hiroyuki Otani ,  Kohei Enchi ,  Hiroyuki Yoshida

发明人： Kenichi Nishino ,  Shinji Kanayama ,  Hiroyuki Otani ,  Kohei Enchi ,  Hiroyuki Yoshida

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/56 ,  H01L23/28 ,  H01R43/00 ,  B23P19/00

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L21/563 ,  H01L21/67126 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49171 ,  Y10T29/53178

摘要： A method and device for sealing an IC chip are provided, by which a sealing material is surely discharged onto the upper surface of a circuit board, and the occurrence of imperfect sealing can be eliminated. A first gap (h1) is provided between an application nozzle (15) and a circuit board (13) on which an IC chip (12) is mounted before discharging the sealing material (17), after which a second gap (h2) which is greater than the first gap (h1) is provided between the application nozzle (15) and the circuit board (13) while discharging the sealing material (17), thereby accomplishing the sealing of the IC chip (12), and ensuring that the sealing operation is performed after the sealing material (17) has completely come to contact with the upper surface of the circuit board (13).

摘要翻译： PCT No.PCT / JP98 / 00447 Sec。 371日期：1998年10月2日 102（e）1998年10月2日日期PCT提交1998年2月2日PCT公布。 第WO98 / 34276号公报 日本1998年8月6日提供了一种用于密封IC芯片的方法和装置，通过该方法和装置可靠地将密封材料排出到电路板的上表面上，并且可以消除不完全密封的发生。 在排出密封材料（17）之前，在施加喷嘴（15）和安装有IC芯片（12）的电路板（13）之间设置有第一间隙（h1），之后，将第二间隙（h2） 大于在排出密封材料（17）时在施加喷嘴（15）和电路板（13）之间提供第一间隙（h1），从而实现IC芯片（12）的密封，并且确保 在密封材料（17）完全与电路板（13）的上表面接触之后进行密封操作。

公开(公告)号：US5582341A

公开(公告)日：1996-12-10

申请号：US496691

申请日：1995-06-29

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Ohnakada ,  Kenichi Nishino ,  Nobuhiko Muraoka

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Satoshi Ohnakada ,  Kenichi Nishino ,  Nobuhiko Muraoka

IPC分类号： G02F1/1345 ,  B23K20/02 ,  G09F9/00 ,  H01L23/50 ,  B23K37/04

CPC分类号： B23K20/023

摘要： A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

摘要翻译： 提供一种端子部件接合装置，其具有用于支撑其上具有端子部件的板的支撑台。 具有加热器的压力工具以可移动的方式设置在工作台上方的垂直方向上，以便将端子部件以热和压力结合到板上。 沿着压力工具的下表面设置无震动片材，沿着无震动片材的下表面设置用于端子部件的按压板，并且由比无冲击片材的热膨胀系数低的板材制成。

公开(公告)号：US07220922B2

公开(公告)日：2007-05-22

申请号：US10399915

申请日：2001-10-23

申请人： Kenichi Nishino ,  Shinji Kanayama ,  Shinjiro Tsuji ,  Masayuki Ida ,  Tomotaka Nishimoto

发明人： Kenichi Nishino ,  Shinji Kanayama ,  Shinjiro Tsuji ,  Masayuki Ida ,  Tomotaka Nishimoto

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： G02F1/13452 ,  H01L2924/0002 ,  H01R4/04 ,  H01R12/62 ,  H01R12/7076 ,  H05K1/118 ,  H05K1/189 ,  H05K3/361 ,  H05K13/046 ,  Y10T29/49144 ,  Y10T156/17 ,  Y10T156/1744 ,  H01L2924/00

摘要： Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

摘要翻译： 组件安装设备将FPC板安装在LCD板上。 LCD板具有在一个侧边缘上的第一电极部分和在另一个侧边缘上的第二电极部分。 FPC基板具有在一个侧边缘上的第一部分和在另一个侧边缘上的第二部分。 第一安装装置将第一部分安装在第一电极部分上。 第二安装装置将第二部分安装在第二电极部分上。 在第二部件安装装置中，第二部分在ACF供给部分与第二电极部分分离，并在预压接合部分处被释放。

公开(公告)号：US06647616B1

公开(公告)日：2003-11-18

申请号：US09446031

申请日：1999-12-15

申请人： Nobuya Matsumura ,  Hiroyuki Kiyomura ,  Kenichi Nishino ,  Kenji Takahashi ,  Shinji Kanayama

发明人： Nobuya Matsumura ,  Hiroyuki Kiyomura ,  Kenichi Nishino ,  Kenji Takahashi ,  Shinji Kanayama

IPC分类号： B23P2100

CPC分类号： H01L21/67144 ,  H01L21/67763 ,  H01L21/67769 ,  H05K13/021 ,  Y10T29/53174 ,  Y10T29/53313 ,  Y10T29/53317

摘要： A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.

摘要翻译： 公开了一种凸块焊接单元，其包括用于分配托盘的新颖的存储，输送和馈送系统，其将IC芯片保持在凸块接合单元的各种操作。 凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置，反之亦然，以及用于拾取IC芯片而没有形成凸块的转移头，并将IC芯片移动到凸块形成 位置，并且用于拾取IC芯片，其上形成有凸块并将IC芯片移动到存储位置。 凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。 每个托盘存储装置包括一个托架，该托架垂直移动以定位托盘堆叠;托盘托架，其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架，用于支撑和释放由托盘支撑的托盘 接收器。

公开(公告)号：US5462626A

公开(公告)日：1995-10-31

申请号：US98813

申请日：1993-07-29

申请人： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

发明人： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

IPC分类号： H05K3/34 ,  H05K3/36 ,  H05K13/04 ,  B32B31/00

CPC分类号： H05K3/363 ,  H05K13/0465 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/3421 ,  H05K3/3494

摘要： A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.

摘要翻译： 一种用于外部引线的接合方法，包括以下步骤：将IC部件的外部引线与电路基板的电极对准，将焊接工具的外部引线保持面设置在通过涂覆多个外部端部 使用树脂的注册的IC部件的外部引线，并且使外部引线与相应的电极接触。 灯光束照射登记在一个电极上的一个外部引线，从而将它们接合，并且将冷却气体喷射到外部引线的接合部分上，以冷却外部引线和电极的接合部分。 在照射步骤期间，登记在一个相应的电极上的外部引线中的一个可以被压在电极上，以将电极的接合部分和外部引线接合。 在该方法中使用的接合工具包括具有外部引线保持表面的壁，用于设置在平坦的外部突片上并按压外部引线之一，以使外部引线中的一个与相应的一个引线保持接触 电极。 激光束通道设置在接合工具中，激光束通过该激光束照射到外部引线接合部分，并且还设置有气体通道，冷却气体通过该通道喷射到外部引线接合部分以冷却接合部分 的外部引线和电极。

公开(公告)号：US6129203A

公开(公告)日：2000-10-10

申请号：US29391

申请日：1998-02-27

申请人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenichi Nishino ,  Kenji Takahashi ,  Naomi Kainou

发明人： Hiroyuki Kiyomura ,  Shinji Kanayama ,  Nobuya Matsumura ,  Kenichi Nishino ,  Kenji Takahashi ,  Naomi Kainou

IPC分类号： H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  B65G23/00

CPC分类号： H05K13/0486

摘要： In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.

摘要翻译： PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102（e）1998年2月27日PCT 1997年7月2日PCT公布。 公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中，提供了一种IC去除装置，通过该IC去除装置，尽管它们的无缺陷已被识别出被错误地去除的IC（4）可以以这样的方式被去除 连续排列而不会在表面上划伤而不会导致静电破坏。 此外，该器件允许容易地目视检查IC的目的是重新使用。 该装置包括用于承载IC（4）的玻璃板（2）和用于以固定角度旋转该玻璃板（2）的机构，由此如果发生识别错误，则吸入IC（4）的接合头（1） 从而移动到玻璃板（2）上的IC去除位置，然后降低直到IC（4）接触玻璃板（2），从而去除IC（4）。 结果，IC（4）可以排成一行而不会在表面上划伤而不会引起静电破坏，从而允许容易地目视检查IC以便重新使用。

公开(公告)号：US20090120998A1

公开(公告)日：2009-05-14

申请号：US12350334

申请日：2009-01-08

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B23K31/02

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

摘要翻译： 提供了一种加热加压装置（101），其上带有经由接合元件（9）与其预粘合的电子部件（8）的电路板（70）。 加热加压装置通过具有加热装置（122）的接触构件（1211）加热和加压电子部件，将电子部件与电路板进行后接合。 通过相互独立地执行电子部件到电路板的预接合和后接合，与现有的情况相比，可以降低后接合所需的时间，并且整个安装线的生产率 可以改进。

公开(公告)号：US4456744A

公开(公告)日：1984-06-26

申请号：US445098

申请日：1982-11-29

申请人： Yoshio Kamatani ,  Michio Tanaka ,  Kyuya Yamazaki ,  Kenichi Nishino

发明人： Yoshio Kamatani ,  Michio Tanaka ,  Kyuya Yamazaki ,  Kenichi Nishino

IPC分类号： C08G18/00 ,  C08G18/08 ,  C08G18/40 ,  C08G18/50 ,  C08G18/62 ,  C08G18/64 ,  C08G18/70 ,  C08G18/78 ,  C08G18/79 ,  C09D175/00 ,  C09J175/00

CPC分类号： C08G18/0804 ,  C08G18/5021 ,  C08G18/6266 ,  C08G18/6283 ,  C08G18/6415 ,  C08G18/643 ,  C08G18/701 ,  C08G18/7887

摘要： Disclosed is a composition for polyurethane resins which is ordinarily of two-package type and curable at ambient temperature and which comprises an isocyanate component having oxadiazinetrione ring as a curing agent and a polyol component, having in the molecule, at least one of a tertiary amino group, a quaternary ammonium group and a salt-formed carboxyl group as a main component. The composition has excellent curability and provides cured products excellent in adhesiveness and physical properties.

摘要翻译： 公开了一种聚氨酯树脂的组合物，其通常为双组分型并且在环境温度下可固化，并且其包含具有恶二嗪三酮环作为固化剂的异氰酸酯组分和多元醇组分，其在分子中具有至少一个叔氨基 基团，季铵基和盐形成的羧基作为主要成分。 该组合物具有优异的固化性，并提供粘合性和物理性能优异的固化产物。

公开(公告)号：US06544377B1

公开(公告)日：2003-04-08

申请号：US09554721

申请日：2000-05-18

申请人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

发明人： Shozo Minamitani ,  Naoto Hosotani ,  Koichi Morita ,  Syunji Onobori ,  Kenichi Nishino

IPC分类号： B32B3120

CPC分类号： H05K13/0469 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178 ,  Y10T156/1092 ,  Y10T156/1744 ,  Y10T156/1768 ,  H01L2924/00 ,  H01L2224/05599

摘要： A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

公开(公告)号：US5064900A

公开(公告)日：1991-11-12

申请号：US469748

申请日：1990-01-19

申请人： Hisayuki Iwai ,  Yasuhrio Mishima ,  Ken Hatta ,  Kenichi Nishino ,  Sanji Aoki ,  Tatsuhiko Ozaki ,  Hirotaka Wada

发明人： Hisayuki Iwai ,  Yasuhrio Mishima ,  Ken Hatta ,  Kenichi Nishino ,  Sanji Aoki ,  Tatsuhiko Ozaki ,  Hirotaka Wada

IPC分类号： C08K13/02 ,  C08F2/44 ,  C08F283/01 ,  C08F299/04 ,  C08K7/02 ,  C08L67/06

CPC分类号： C08L67/06

摘要： A curable unsaturated polyester resin composition contains graft copolymers each having 10-60 weight % of a first constituent given by ##STR1## 38-89.7 weight % of a second constituent given by ##STR2## and 0.3-2 weight % of a third constituent which is a vinyl monomer unit having carboxylic acid or carboxylic anhydride groups, unsaturated polyester, vinyl monomer, a filler, a curing catalyst, and reinforcing fibers, where either of R.sup.1 and R.sup.2 is H, the other being either H or CH.sub.3, R.sub.3 is ethylene group or propylene group, R.sup.4 is hydrocarbon group with 1-18 carbton atoms, R.sup.5 is alkyl group with 1-4 carbon atoms, R.sup.6 is alkyl group with 1-3 carbon atoms, m is 6-90 and n is 1-5.

摘要翻译： 可固化的不饱和聚酯树脂组合物含有接枝共聚物，它们各自具有10-60重量％的第一组分，由第<！ - SIPO - >图38-89.7重量％ 作为具有羧酸或羧酸酐基团的乙烯基单体单元的第三组分，不饱和聚酯，乙烯基单体，填料，固化催化剂和增强纤维，其中R 1和R 2中的任一个是H，另一个是H或CH 3， R3是亚乙基或亚丙基，R4是具有1-18个碳原子的烃基，R5是1-4个碳原子的烷基，R6是1-3个碳原子的烷基，m是6-90，n是1 -5。