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1.发明授权公开(公告)号：US07402457B2
公开(公告)日：2008-07-22
申请号：US10491137
申请日：2002-09-25
申请人： Kerstin Häse , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jörg Zapf , Matthias Rebhan
发明人： Kerstin Häse , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jörg Zapf , Matthias Rebhan
IPC分类号： H01L21/00
CPC分类号： H05K3/4605 , H01L23/051 , H01L23/3735 , H01L23/482 , H01L24/24 , H01L24/82 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , H05K3/108 , H05K3/32 , H05K3/4632 , H05K2201/0129 , H05K2201/0154 , H05K2203/068 , H05K2203/085 , H05K2203/1469 , H01L2924/00 , H01L2224/48
摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
摘要翻译： 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。
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2.发明申请Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces 有权用于接触基底和由具有电接触表面的基底组成的装置的电接触表面的方法公开(公告)号：US20050032347A1
公开(公告)日：2005-02-10
申请号：US10491137
申请日：2001-09-25
申请人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
发明人： Kerstin Hase , Laurence Amigues , Herbert Schwarzbauer , Norbert Seliger , Karl Weidner , Jorg Zapf , Matthias Rebhan
IPC分类号： H01L23/051 , H01L23/373 , H01L23/482 , H01L25/07 , H01L25/18 , H05K1/03 , H05K3/10 , H05K3/32 , H05K3/46 , H01L21/44 , H01L21/4763
CPC分类号： H05K3/4605 , H01L23/051 , H01L23/3735 , H01L23/482 , H01L24/24 , H01L24/82 , H01L25/072 , H01L2224/2402 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/45124 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , H05K3/108 , H05K3/32 , H05K3/4632 , H05K2201/0129 , H05K2201/0154 , H05K2203/068 , H05K2203/085 , H05K2203/1469 , H01L2924/00 , H01L2224/48
摘要： A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.
摘要翻译： 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。
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3.发明授权Electrical component and film composite laminated on the component and method for production 有权电气元件和薄膜复合层压在组件上和生产方法公开(公告)号：US07932585B2
公开(公告)日：2011-04-26
申请号：US11989528
申请日：2006-07-10
IPC分类号： H01L23/58
CPC分类号： H01L23/3735 , H01L23/5389 , H01L23/62 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24051 , H01L2224/24226 , H01L2224/82039 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01056 , H01L2924/01058 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , Y10T156/10 , H01L2924/00
摘要： At least one film composite is laminated on a surface of at least one electrical component. The film composite includes at least one electrically-conducting plastic film with at least one electrically conducting conductor. The electrically-conducting plastic film has a high-ohmic resistance. This method may be used in planar large-surface electrical contacting technology for the production of modules with power semiconductors, where an electrical contacting of the components is achieved by the plastic films. A low lateral electrical conductivity is achieved, such that an electrical charging of the plastic films required for the contacting technology is prevented on operation of the component or the module.
摘要翻译： 至少一个薄膜复合材料层压在至少一个电气部件的表面上。 膜复合材料包括至少一个具有至少一个导电导体的导电塑料膜。 导电塑料膜具有高的欧姆电阻。 该方法可用于平面大面积电接触技术，用于生产具有功率半导体的模块，其中部件的电接触由塑料膜实现。 实现低的横向电导率，使得在组件或模块的操作时防止接触技术所需的塑料膜的充电。
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4.发明申请Electrical Component and Film Composite Laminated On the Component and Method for Production 有权电气元件和薄膜复合材料在组件和生产方法上的层叠公开(公告)号：US20100044889A1
公开(公告)日：2010-02-25
申请号：US11989528
申请日：2006-07-10
CPC分类号： H01L23/3735 , H01L23/5389 , H01L23/62 , H01L24/24 , H01L24/82 , H01L2224/2402 , H01L2224/24051 , H01L2224/24226 , H01L2224/82039 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01056 , H01L2924/01058 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , Y10T156/10 , H01L2924/00
摘要： At least one film composite is laminated on a surface of at least one electrical component. The film composite includes at least one electrically-conducting plastic film with at least one electrically conducting conductor. The electrically-conducting plastic film has a high-ohmic resistance. This method may be used in planar large-surface electrical contacting technology for the production of modules with power semiconductors, where an electrical contacting of the components is achieved by the plastic films. A low lateral electrical conductivity is achieved, such that an electrical charging of the plastic films required for the contacting technology is prevented on operation of the component or the module.
摘要翻译： 至少一个薄膜复合材料层压在至少一个电气部件的表面上。 膜复合材料包括至少一个具有至少一个导电导体的导电塑料膜。 导电塑料膜具有高的欧姆电阻。 该方法可用于平面大面积电接触技术，用于生产具有功率半导体的模块，其中部件的电接触由塑料膜实现。 实现低的横向电导率，使得在组件或模块的操作时防止接触技术所需的塑料膜的充电。
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