公开(公告)号：US20230378606A1

公开(公告)日：2023-11-23

申请号：US18319532

申请日：2023-05-18

申请人： Khanh TRAN ,  Mihalis MICHAEL ,  Yasumasa MORITA ,  Shahid PIRZADA ,  Richard van der LINDE ,  Arvind KAMATH

发明人： Khanh TRAN ,  Mihalis MICHAEL ,  Yasumasa MORITA ,  Shahid PIRZADA ,  Richard van der LINDE ,  Arvind KAMATH

IPC分类号： H01M50/446 ,  H01M10/052 ,  H01M4/66 ,  H01M4/131 ,  H01M4/136 ,  H01M10/0562 ,  H01M50/417 ,  H01M50/562 ,  H01M10/058

CPC分类号： H01M50/446 ,  H01M10/052 ,  H01M4/661 ,  H01M4/131 ,  H01M4/136 ,  H01M10/0562 ,  H01M4/663 ,  H01M50/417 ,  H01M50/562 ,  H01M10/058

摘要： A solid-state battery and methods of making the same are disclosed. The battery includes a plurality of cells and first and second terminals on opposite sides/edges of the battery. Each cell includes a cathode current collector (CCC), a cathode thereon, a solid-state electrolyte, an anode current collector (ACC), a moat in the cathode and the electrolyte and around the ACC, a barrier/insulation film, a via/opening in the barrier/insulation film exposing the ACC, and a conductive redistribution layer in the via/opening, in the moat, on the barrier/insulation film, and on a first sidewall of each cell. The barrier/insulation film encapsulates the CCC, the cathode, the solid-state electrolyte and the ACC. One terminal is electrically connected to each ACC through the redistribution layer, and the other is electrically connected to each cathode or CCC.

公开(公告)号：US20230420731A1

公开(公告)日：2023-12-28

申请号：US18319552

申请日：2023-05-18

申请人： Khanh TRAN ,  Arvind KAMATH ,  Richard VAN DER LINDE ,  Yasumasa MORITA ,  Zhongchun WANG ,  Mihalis MICHAEL

发明人： Khanh TRAN ,  Arvind KAMATH ,  Richard VAN DER LINDE ,  Yasumasa MORITA ,  Zhongchun WANG ,  Mihalis MICHAEL

IPC分类号： H01M10/0562 ,  H01M10/052 ,  H01M10/058 ,  H01M4/66 ,  H01M4/131 ,  H01M4/136 ,  H01M50/562

CPC分类号： H01M10/0562 ,  H01M10/052 ,  H01M10/058 ,  H01M50/562 ,  H01M4/131 ,  H01M4/136 ,  H01M4/661

摘要： A solid-state battery and methods of making the same are disclosed. The battery includes a plurality of cells and first and second terminals on opposite sides/edges of the battery. Each cell includes a cathode current collector (CCC), a cathode thereon, a solid-state electrolyte, an anode current collector (ACC), a barrier/insulation film, a via/opening in the barrier/insulation film exposing the ACC, and a conductive redistribution layer on the ACC in the via/opening, on the barrier/insulation film, and on a first sidewall of each cell. The barrier/insulation film encapsulates the CCC, the cathode, the solid-state electrolyte and the ACC. The first sidewall of each cell is on one of the sides/edges of the battery. One terminal is electrically connected to each ACC through the redistribution layer, and the other is electrically connected to each cathode or CCC.

公开(公告)号：US20240113341A1

公开(公告)日：2024-04-04

申请号：US18468606

申请日：2023-09-15

申请人： RICHARD VAN DER LINDE ,  Arvind KAMATH ,  Khanh TRAN ,  Yasumasa MORITA ,  Zhongchun WANG ,  Mihalis MICHAEL

发明人： RICHARD VAN DER LINDE ,  Arvind KAMATH ,  Khanh TRAN ,  Yasumasa MORITA ,  Zhongchun WANG ,  Mihalis MICHAEL

IPC分类号： H01M10/0587 ,  H01M4/13 ,  H01M4/66 ,  H01M50/107 ,  H01M50/109 ,  H01M50/548

CPC分类号： H01M10/0587 ,  H01M4/13 ,  H01M4/661 ,  H01M50/107 ,  H01M50/109 ,  H01M50/548

摘要： A cylindrical solid-state battery and methods of making the same are disclosed. The battery includes a solid-state battery cell wound, wrapped or rolled around a core or itself, first and second terminals on opposite ends of the battery, and packaging between the first and second terminals, sealing the cell therein. The cell comprises a cathode current collector (CCC), a cathode on the CCC, a solid-state electrolyte on the cathode, an anode current collector (ACC) on the electrolyte, an insulation film on the ACC with an opening therein exposing the ACC, and a conductive redistribution layer in the opening and on the insulation film and a first sidewall of the cell. One of the terminals is electrically connected to the ACC through the redistribution layer, and the other terminal is electrically connected to the cathode or CCC on the opposite end of the battery.

公开(公告)号：US20210320323A1

公开(公告)日：2021-10-14

申请号：US17185122

申请日：2021-02-25

申请人： Aditi CHANDRA ,  Richard VAN DER LINDE ,  Paul BUTLER ,  Mao ITO ,  Jon SIMMONS ,  Miki TRIFUNOVIC ,  Alex YAN ,  Arvind KAMATH ,  Shoba RAO

发明人： Aditi CHANDRA ,  Richard VAN DER LINDE ,  Paul BUTLER ,  Mao ITO ,  Jon SIMMONS ,  Miki TRIFUNOVIC ,  Alex YAN ,  Arvind KAMATH ,  Shoba RAO

IPC分类号： H01M10/0562 ,  H01M10/0583 ,  H01M50/178

摘要： A solid-state battery and a method of making the same are disclosed. The battery includes a base frame or support, first and second exterior contacts on the base frame/support, stacked solid-state battery unit cells, first and second electrical connections, and encapsulation in contact with the base frame/support and covering the solid-state battery unit cells and the electrical connections. Each stacked solid-state battery unit cell is on a metal substrate and has exposed cathode and anode current collectors. The electrical connections respectively electrically connect the exposed cathode and anode current collectors to the first and second exterior contacts. The method includes forming the stacked solid-state battery unit cells on the base frame/support, forming the exterior contacts on the base frame/support, electrically connecting the exposed cathode and anode current collectors to the respective exterior contacts, and encapsulating the solid-state battery unit cells and the electrical connections.

公开(公告)号：US20230352781A1

公开(公告)日：2023-11-02

申请号：US18340864

申请日：2023-06-25

申请人： RICHARD VAN DER LINDE ,  Aditi CHANDRA ,  Mao ITO ,  Alex YAN ,  Arvind KAMATH ,  Shoba RAO ,  Jonathon Y Simmons

发明人： RICHARD VAN DER LINDE ,  Aditi CHANDRA ,  Mao ITO ,  Alex YAN ,  Arvind KAMATH ,  Shoba RAO ,  Jonathon Y Simmons

IPC分类号： H01M50/186 ,  H01M10/058

CPC分类号： H01M50/186 ,  H01M10/058

摘要： The present disclosure pertains to a battery and a method of making the same. The battery includes first and second metal substrates, a first solid-state and/or thin-film battery cell on the first metal substrate, a second solid-state and/or thin-film battery cell on the second metal substrate, and a hermetic seal in a peripheral region of the first and second metal substrates. The first and second battery cells are between the first and second metal substrates, and face each other. The method includes respectively forming first and second solid-state and/or thin-film battery cells on first and second metal substrates, placing the second battery cell on the first battery cell so that the first and second battery cells are between the first and second metal substrates, and hermetically sealing the first and second battery cells in a peripheral region of the first and second metal substrates.

公开(公告)号：US20210320355A1

公开(公告)日：2021-10-14

申请号：US17185111

申请日：2021-02-25

申请人： Richard VAN DER LINDE ,  Aditi CHANDRA ,  Mao ITO ,  Alex YAN ,  Arvind KAMATH ,  Shoba RAO ,  Jon SIMMONS

发明人： Richard VAN DER LINDE ,  Aditi CHANDRA ,  Mao ITO ,  Alex YAN ,  Arvind KAMATH ,  Shoba RAO ,  Jon SIMMONS

IPC分类号： H01M50/186 ,  H01M10/058

摘要： The present disclosure pertains to a battery and a method of making the same. The battery includes first and second metal substrates, a first solid-state and/or thin-film battery cell on the first metal substrate, a second solid-state and/or thin-film battery cell on the second metal substrate, and a hermetic seal in a peripheral region of the first and second metal substrates. The first and second battery cells are between the first and second metal substrates, and face each other. The method includes respectively forming first and second solid-state and/or thin-film battery cells on first and second metal substrates, placing the second battery cell on the first battery cell so that the first and second battery cells are between the first and second metal substrates, and hermetically sealing the first and second battery cells in a peripheral region of the first and second metal substrates.

公开(公告)号：US20240128498A1

公开(公告)日：2024-04-18

申请号：US18314616

申请日：2023-05-09

申请人： Arvind KAMATH ,  Shahid PIRZADA ,  Zhongchun WANG ,  Hui YANG

发明人： Arvind KAMATH ,  Shahid PIRZADA ,  Zhongchun WANG ,  Hui YANG

IPC分类号： H01M10/0562 ,  H01M4/485 ,  H01M4/58 ,  H01M4/66 ,  H01M10/02

CPC分类号： H01M10/0562 ,  H01M4/485 ,  H01M4/5825 ,  H01M4/661 ,  H01M4/664 ,  H01M10/02 ,  H01M2004/028

摘要： A solid-state battery cell, a solid-state battery, and methods of making the same are disclosed. The solid-state battery cell includes a cathode current collector, a cathode on the cathode current collector, a low-impedance interface film on the cathode, a solid-state electrolyte on or over the low-impedance interface film, a lithiophilic layer on or over the solid-state electrolyte, and an anode current collector on or over the lithiophilic layer. The low-impedance interface film may include an oxide, a nitride or an oxynitride of lithium and a metal selected from aluminum, silicon and titanium, carbon, a metal oxide, fluoride, oxyfluoride or phosphate, or an alkali metal borate, and may have a thickness of 5-100 Å, for example. The lithiophilic layer may be or include a metal oxide, silicate, aluminate or fluoride, or an elemental metal or metalloid, and may have a thickness of 5 Å to 1 μm, for example.

公开(公告)号：US20130344301A1

公开(公告)日：2013-12-26

申请号：US13975231

申请日：2013-08-23

申请人： Erik SCHER ,  Steven MOLESA ,  Joerg ROCKENBERGER ,  Arvind KAMATH ,  Ikuo MORI ,  Wenzhuo GUO ,  Dmitry KARSHTEDT ,  Vladimir DIOUMAEV

发明人： Erik SCHER ,  Steven MOLESA ,  Joerg ROCKENBERGER ,  Arvind KAMATH ,  Ikuo MORI ,  Wenzhuo GUO ,  Dmitry KARSHTEDT ,  Vladimir DIOUMAEV

IPC分类号： C09D5/24 ,  H01B3/02

CPC分类号： C09D5/24 ,  C09D11/101 ,  C09D11/322 ,  C09D11/36 ,  C09D11/54 ,  H01B3/02 ,  H01L21/02532 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/28008 ,  H01L27/1292 ,  H01L29/6675 ,  H01L29/78696 ,  Y10T428/24802

摘要： Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.

摘要翻译： 实施例涉及从含有材​​料前体的油墨印刷特征。 在一些实施例中，材料包括电活性材料，例如半导体，金属或其组合。 在另一个实施例中，该材料包括电介质。 这些实施例提供改进的印刷工艺条件，其允许更精确地控制印刷线或其它特征的形状，轮廓和尺寸。 组合物和/或方法通过增加油墨中组分的粘度和质量负载来改善对钉扎的控制。 因此，示例性方法包括在基板上以图案印刷包含材料前体和溶剂的油墨; 以图案沉淀前体以形成钉扎线; 基本上蒸发溶剂以形成由钉扎线限定的材料前体的特征; 并将材料前体转化成图案化材料。

公开(公告)号：US20200273719A1

公开(公告)日：2020-08-27

申请号：US16802544

申请日：2020-02-26

申请人： Miki TRIFUNOVIC ,  Aditi CHANDRA ,  Anand DESHPANDE ,  Arvind KAMATH

发明人： Miki TRIFUNOVIC ,  Aditi CHANDRA ,  Anand DESHPANDE ,  Arvind KAMATH

IPC分类号： H01L21/48 ,  H01L21/78 ,  H01L23/495 ,  H01L23/66 ,  H01Q1/38

摘要： A method of attaching one or more active devices on one or more substrates to a metal carrier by “hot stamping” is disclosed. The method includes contacting the active device(s) on the substrate(s) with the metal carrier, and applying pressure to and heating the active device(s) on the substrate(s) and the metal carrier sufficiently to affix or attach the active device(s) on the substrate(s) to the metal carrier. The active device(s) may include an integrated circuit. The substrate(s) may include a metal substrate on the backside of the active device and a protective/carrier film on the frontside of the active device. The protective/carrier film may be or include an organic polymer. The metal carrier may be or include a metal foil. Various examples of the method further include thinning the metal substrate, dicing the active device(s) and a continuous substrate, and/or separating the active devices.

公开(公告)号：US20160035762A1

公开(公告)日：2016-02-04

申请号：US14847999

申请日：2015-09-08

申请人： James Montague CLEEVES ,  J. Devin MACKENZIE ,  Arvind KAMATH

发明人： James Montague CLEEVES ,  J. Devin MACKENZIE ,  Arvind KAMATH

IPC分类号： H01L27/12 ,  H01L29/872 ,  H01L49/02 ,  G06K19/073 ,  H01L23/13 ,  H01L23/66 ,  H01L29/66 ,  G06K19/077 ,  H01L29/786 ,  H01L23/14

CPC分类号： H01L27/1255 ,  G06K19/073 ,  G06K19/07749 ,  H01F17/0006 ,  H01L23/13 ,  H01L23/142 ,  H01L23/66 ,  H01L27/127 ,  H01L27/1292 ,  H01L28/60 ,  H01L29/66143 ,  H01L29/66742 ,  H01L29/78696 ,  H01L29/872 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

摘要： Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g., improved electrical characteristics) as compared to tags containing organic electronic devices.

摘要翻译： 射频识别（RFID）标签及其制造方法。 RFID设备通常包括（1）金属天线和/或电感器; （2）其上的介电层，用于支撑和绝缘来自金属天线和/或电感器的集成电路; （3）介电层上的多个二极管和多个晶体管，二极管具有至少一个与晶体管共同的层; 和（4）与金属天线和/或电感器以及至少一些二极管电连通的多个电容器，所述多个电容器具有与所述多个二极管共同的至少一个层和/或与所述多个二极管的触点 二极管和晶体管。 该方法优选将液态含硅油墨沉积物集成到用于制造RFID电路的成本有效的集成制造工艺中。 此外，与包含有机电子器件的标签相比，本发明的RFID标签通常提供更高的性能（例如，改进的电气特性）。