Charge Trap Device and Method for Fabricating the Same
    1.
    发明申请
    Charge Trap Device and Method for Fabricating the Same 审中-公开
    充电陷阱装置及其制造方法

    公开(公告)号:US20090108334A1

    公开(公告)日:2009-04-30

    申请号:US12164720

    申请日:2008-06-30

    IPC分类号: H01L21/28 H01L29/792

    摘要: A charge trapping device includes a plurality of isolation layers, a plurality of charge trapping layers, a blocking layer, and a control gate electrode. The isolation layers define active regions, and the isolation layers and active regions extend as respective stripes along a first direction on a semiconductor substrate. The charge trapping layers are disposed on the active regions in island forms where the charge trapping layers are separated from each other in the first direction and disposed on the respective active regions between the isolation layers in a second direction perpendicular to the first direction. The blocking layer is disposed on the isolation layers and the charge trapping layers. The control gate electrode is disposed on the charge trapping layer.

    摘要翻译: 电荷俘获装置包括多个隔离层,多个电荷俘获层,阻挡层和控制栅电极。 隔离层限定有源区,并且隔离层和有源区沿着半导体衬底上的第一方向作为相应条延伸。 电荷捕获层以岛形式设置在有源区,其中电荷捕获层在第一方向上彼此分离,并且在垂直于第一方向的第二方向上设置在隔离层之间的相应有源区上。 阻挡层设置在隔离层和电荷俘获层上。 控制栅电极设置在电荷捕获层上。

    Method for Fabricating Non-Volatile Memory Device with Charge Trapping Layer
    2.
    发明申请
    Method for Fabricating Non-Volatile Memory Device with Charge Trapping Layer 有权
    用电荷捕获层制造非易失性存储器件的方法

    公开(公告)号:US20090163014A1

    公开(公告)日:2009-06-25

    申请号:US12139623

    申请日:2008-06-16

    IPC分类号: H01L21/28

    摘要: A method for fabricating a non-volatile memory device with a charge trapping layer wherein a tunneling layer, a charge trapping layer, a blocking layer, and a control gate electrode are formed on a semiconductor substrate. A temperature of the control gate electrode is increased by applying a magnetic field to the control gate electrode. The blocking layer is densified by allowing the increased temperature to be transferred to the blocking layer contacting the control gate electrode.

    摘要翻译: 一种用于制造具有电荷捕获层的非易失性存储器件的方法,其中在半导体衬底上形成有隧道层,电荷俘获层,阻挡层和控制栅电极。 通过向控制栅电极施加磁场来增加控制栅电极的温度。 通过允许将升高的温度转移到与控制栅电极接触的阻挡层而使阻挡层致密化。

    Method for fabricating non-volatile memory device with charge trapping layer
    3.
    发明授权
    Method for fabricating non-volatile memory device with charge trapping layer 有权
    用电荷捕获层制造非易失性存储器件的方法

    公开(公告)号:US07919371B2

    公开(公告)日:2011-04-05

    申请号:US12139623

    申请日:2008-06-16

    IPC分类号: H01L21/336

    摘要: A method for fabricating a non-volatile memory device with a charge trapping layer wherein a tunneling layer, a charge trapping layer, a blocking layer, and a control gate electrode are formed on a semiconductor substrate. A temperature of the control gate electrode is increased by applying a magnetic field to the control gate electrode. The blocking layer is densified by allowing the increased temperature to be transferred to the blocking layer contacting the control gate electrode.

    摘要翻译: 一种用于制造具有电荷捕获层的非易失性存储器件的方法,其中在半导体衬底上形成有隧道层,电荷俘获层,阻挡层和控制栅电极。 通过向控制栅电极施加磁场来增加控制栅电极的温度。 通过允许将升高的温度转移到与控制栅电极接触的阻挡层而使阻挡层致密化。

    Method of fabricating non-volatile memory device having charge trapping layer
    4.
    发明授权
    Method of fabricating non-volatile memory device having charge trapping layer 失效
    制造具有电荷捕获层的非易失性存储器件的方法

    公开(公告)号:US07981786B2

    公开(公告)日:2011-07-19

    申请号:US11966231

    申请日:2007-12-28

    摘要: A method of fabricating a non-volatile memory device having a charge trapping layer includes forming a tunneling layer, a charge trapping layer, a blocking layer and a control gate electrode layer over a substrate, forming a mask layer pattern on the control gate electrode layer, performing an etching process using the mask layer pattern as an etching mask to remove an exposed portion of the control gate electrode layer, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness, forming an insulating layer for blocking charges from moving on the control gate electrode layer and the mask layer pattern, performing anisotropic etching on the insulating layer to form an insulating layer pattern on a sidewall of the control gate electrode layer and a partial upper sidewall of the blocking layer, and performing an etching process on the blocking layer exposed by the anisotropic etching, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness.

    摘要翻译: 一种制造具有电荷捕获层的非易失性存储器件的方法包括在衬底上形成隧道层,电荷俘获层,阻挡层和控制栅电极层,在控制栅电极层上形成掩模层图案 使用掩模层图案作为蚀刻掩模进行蚀刻处理以去除控制栅电极层的暴露部分,其中蚀刻工艺作为过度蚀刻进行,以将电荷捕获层除去指定厚度,形成绝缘层 用于阻止电荷在控制栅电极层和掩模层图案上移动,对绝缘层进行各向异性蚀刻,以在控制栅电极层的侧壁和阻挡层的一部分上侧壁上形成绝缘层图案,以及 对通过各向异性蚀刻暴露的阻挡层进行蚀刻处理,其中执行蚀刻处理 作为过量蚀刻以将电荷捕获层除去指定的厚度。

    Method for Forming Gate of Non-Volatile Memory Device
    5.
    发明申请
    Method for Forming Gate of Non-Volatile Memory Device 审中-公开
    非易失性存储器件门形成方法

    公开(公告)号:US20090163013A1

    公开(公告)日:2009-06-25

    申请号:US12131558

    申请日:2008-06-02

    IPC分类号: H01L21/28

    摘要: Provided is a method for forming a gate of a non-volatile memory device. A tunneling layer, a charge trapping layer, a blocking layer, and a control gate layer are formed on a semiconductor substrate. A hard mask is formed on the control gate layer. The hard mask defines a region on which a gate is formed. A gate pattern is formed by etching the control gate layer, the blocking layer, the charge trapping layer, and the tunneling layer. A damage compensation layer on a side of the gate pattern is formed using ultra low pressure plasma of a pressure range from approximately 1 mT to approximately 100 mT.

    摘要翻译: 提供了一种用于形成非易失性存储器件的栅极的方法。 在半导体衬底上形成隧道层,电荷俘获层,阻挡层和控制栅极层。 在控制栅极层上形成硬掩膜。 硬掩模限定形成栅极的区域。 通过蚀刻控制栅极层,阻挡层,电荷俘获层和隧道层形成栅极图案。 使用压力范围为约1mT至约100mT的超低压等离子体形成栅极图案侧的损伤补偿层。

    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER
    6.
    发明申请
    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER 失效
    制造具有电荷捕获层的非易失性存储器件的方法

    公开(公告)号:US20090004802A1

    公开(公告)日:2009-01-01

    申请号:US11966231

    申请日:2007-12-28

    IPC分类号: H01L21/336

    摘要: A method of fabricating a non-volatile memory device having a charge trapping layer includes forming a tunneling layer, a charge trapping layer, a blocking layer and a control gate electrode layer over a substrate, forming a mask layer pattern on the control gate electrode layer, performing an etching process using the mask layer pattern as an etching mask to remove an exposed portion of the control gate electrode layer, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness, forming an insulating layer for blocking charges from moving on the control gate electrode layer and the mask layer pattern, performing anisotropic etching on the insulating layer to form an insulating layer pattern on a sidewall of the control gate electrode layer and a partial upper sidewall of the blocking layer, and performing an etching process on the blocking layer exposed by the anisotropic etching, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness.

    摘要翻译: 一种制造具有电荷捕获层的非易失性存储器件的方法包括在衬底上形成隧道层,电荷俘获层,阻挡层和控制栅电极层,在控制栅电极层上形成掩模层图案 使用掩模层图案作为蚀刻掩模进行蚀刻处理以去除控制栅电极层的暴露部分,其中蚀刻工艺作为过度蚀刻进行,以将电荷捕获层除去指定厚度,形成绝缘层 用于阻止电荷在控制栅电极层和掩模层图案上移动,对绝缘层进行各向异性蚀刻,以在控制栅电极层的侧壁和阻挡层的一部分上侧壁上形成绝缘层图案,以及 对通过各向异性蚀刻暴露的阻挡层进行蚀刻处理,其中执行蚀刻处理 作为过量蚀刻以将电荷捕获层除去指定的厚度。

    METHOD FOR FORMING DIODE IN PHASE CHANGE RANDOM ACCESS MEMORY DEVICE
    7.
    发明申请
    METHOD FOR FORMING DIODE IN PHASE CHANGE RANDOM ACCESS MEMORY DEVICE 审中-公开
    在相位变化随机访问存储器件中形成二极管的方法

    公开(公告)号:US20100099243A1

    公开(公告)日:2010-04-22

    申请号:US12493263

    申请日:2009-06-29

    IPC分类号: H01L21/265

    摘要: A method for forming a diode of a phase change random access memory device includes preparing a semiconductor substrate having a dopant area formed thereon. An insulating layer on the semiconductor substrate is formed and a contact hole is formed by etching a part of the insulating layer such that a specific region of the dopant area is exposed. A silicon layer doped with a first-type dopant is formed in the contact hole. A part of the silicon layer is doped with a second-type dopant source gas through a gas cluster ion beam process.

    摘要翻译: 一种形成相变随机存取存储器件的二极管的方法包括制备其上形成有掺杂区的半导体衬底。 形成半导体衬底上的绝缘层,并通过蚀刻绝缘层的一部分使得暴露出掺杂剂区域的特定区域而形成接触孔。 在接触孔中形成掺杂有第一种掺杂剂的硅层。 硅层的一部分通过气体簇离子束工艺掺杂有第二类型的掺杂剂源气体。

    NONVOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER AND METHOD FOR FABRICATING THE SAME
    10.
    发明申请
    NONVOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER AND METHOD FOR FABRICATING THE SAME 审中-公开
    具有电荷捕捉层的非易失存储器件及其制造方法

    公开(公告)号:US20090114977A1

    公开(公告)日:2009-05-07

    申请号:US12147177

    申请日:2008-06-26

    IPC分类号: H01L29/792 H01L21/28

    摘要: Disclosed herein is a nonvolatile memory device having a charge trapping layer and a method of making the same. The nonvolatile memory device includes a substrate, a tunneling layer disposed on the substrate, a charge trapping layer disposed on the tunneling layer, a first blocking layer disposed on the charge trapping layer, a second blocking layer disposed on the first blocking layer, and a control gate electrode disposed on the second blocking layer. A first band gap between the first blocking layer and the charge trapping layer is larger than a second band gap between the second blocking layer and the charge trapping layer.

    摘要翻译: 这里公开了具有电荷捕获层的非易失性存储器件及其制造方法。 非易失性存储器件包括衬底,设置在衬底上的隧道层,设置在隧道层上的电荷俘获层,设置在电荷俘获层上的第一阻挡层,设置在第一阻挡层上的第二阻挡层,以及 设置在第二阻挡层上的控制栅电极。 第一阻挡层和电荷俘获层之间的第一带隙大于第二阻挡层和电荷俘获层之间的第二带隙。