公开(公告)号：US07411225B2

公开(公告)日：2008-08-12

申请号：US11086186

申请日：2005-03-21

申请人： Geun-Ho Kim ,  Ki-Chang Song ,  Sun-Ho Kim

发明人： Geun-Ho Kim ,  Ki-Chang Song ,  Sun-Ho Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/053 ,  H05K1/183 ,  H01L2224/0401

摘要： A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well as luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of the light source apparatus, reduce the process time and costs and increase reliability by directly connecting the sub-mount to the stem by the first electrode and the second electrode which pass through holes of the sub-mount, and extend a life span of the light emitting device because of the enhanced heat radiating effect.

摘要翻译： 光源装置及其制造方法可以通过在副安装座中形成凹槽并将发光器件接合到凹槽中来防止彼此相邻的发光器件之间的光干涉，通过以下方式提高散热效果以及发光效率 从发光装置侧发射的光朝向光源装置的前方收集，通过第一电极和第二电极直接连接到底座上，从而减少了处理时间和成本并提高了可靠性 并且由于散热效果的提高，延长了发光装置的使用寿命。

公开(公告)号：US20060208271A1

公开(公告)日：2006-09-21

申请号：US11086186

申请日：2005-03-21

申请人： Geun-Ho Kim ,  Ki-Chang Song ,  Sun-Ho Kim

发明人： Geun-Ho Kim ,  Ki-Chang Song ,  Sun-Ho Kim

IPC分类号： H01L29/06

CPC分类号： H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/053 ,  H05K1/183 ,  H01L2224/0401

摘要： A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well as luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of the light source apparatus, reduce the process time and costs and increase reliability by directly connecting the sub-mount to the stem by the first electrode and the second electrode which pass through holes of the sub-mount, and extend a life span of the light emitting device because of the enhanced heat radiating effect.

摘要翻译： 光源装置及其制造方法可以通过在副安装座中形成凹槽并将发光器件接合到凹槽中来防止彼此相邻的发光器件之间的光干涉，通过以下方式提高散热效果以及发光效率 从发光装置侧发射的光朝向光源装置的前方收集，通过第一电极和第二电极直接连接到底座上，从而减少了处理时间和成本并提高了可靠性 并且由于散热效果的提高，延长了发光装置的使用寿命。

公开(公告)号：US20050063279A1

公开(公告)日：2005-03-24

申请号：US10980784

申请日：2004-11-04

申请人： Ki-Chang Song ,  Geun-Ho Kim ,  Sun-Ho Kim

发明人： Ki-Chang Song ,  Geun-Ho Kim ,  Sun-Ho Kim

IPC分类号： G11B3/085 ,  G11B7/12 ,  G11B7/125 ,  G11B3/00

CPC分类号： G11B3/08512 ,  G11B7/123 ,  G11B7/1263 ,  G11B7/22

摘要： Disclosed are an optical pickup module and a manufacturing method thereof. The manufacturing method of an optical pickup module comprises the steps of: forming a wet-etching mask layer at an outer portion of an upper surface of a silicon substrate to be used as a sub mount; etching a middle portion of the silicon substrate by using the wet-etching mask layer thereby forming a cavity, forming an inclination surface at the etched portion, and then removing the wet-etching mask layer; forming an insulating layer on an entire upper surface of the silicon substrate; forming an electrode layer on an upper surface of the insulating layer; forming adhesive layers at a part of an upper surface of the electrode layer; and arranging a light emitting device at an upper surface of one adhesive layer and arranging an MPD at an upper surface of another adhesive layer by a fixation thereby completing an optical pickup module.

摘要翻译： 公开了一种光学拾取模块及其制造方法。 光拾取器模块的制造方法包括以下步骤：在硅衬底的上表面的外部形成湿蚀刻掩模层，以用作副安装座; 通过使用湿蚀刻掩模层蚀刻硅衬底的中间部分，从而形成空腔，在蚀刻部分形成倾斜表面，然后除去湿蚀刻掩模层; 在所述硅衬底的整个上表面上形成绝缘层; 在绝缘层的上表面上形成电极层; 在电极层的上表面的一部分形成粘合剂层; 并且在一个粘合剂层的上表面上布置发光器件，并且通过固定将MPD布置在另一粘合剂层的上表面，从而完成光学拾取模块。

公开(公告)号：US07408203B2

公开(公告)日：2008-08-05

申请号：US11106188

申请日：2005-04-13

申请人： Geun-Ho Kim ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Ki-Chang Song

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/06825 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.

摘要翻译： 发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中 半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。 结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以 有效地排放到外部。 另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

公开(公告)号：US08263996B2

公开(公告)日：2012-09-11

申请号：US13190352

申请日：2011-07-25

申请人： Geun-Ho Kim ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Ki-Chang Song

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/06825 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.

摘要翻译： 发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中 半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。 结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以 有效地排放到外部。 另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

公开(公告)号：US08008677B2

公开(公告)日：2011-08-30

申请号：US12165282

申请日：2008-06-30

申请人： Geun-Ho Kim ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Ki-Chang Song

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/06825 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.

摘要翻译： 发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中 半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。 结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以 有效地排放到外部。 另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

公开(公告)号：US07868349B2

公开(公告)日：2011-01-11

申请号：US11059525

申请日：2005-02-17

申请人： Geun-Ho Kim ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Ki-Chang Song

IPC分类号： H01L33/00

CPC分类号： H05K3/328 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48145 ,  H05K1/053 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other and increase the luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of a metal stem by forming grooves at a sub-mounts, bonding the light emitting device to the inside of the groove by a flip chip bonding method and forming a reflective layer inside the groove.

摘要翻译： 光源装置及其制造方法可以防止彼此相邻的发光器件之间的光干涉，并且通过在发光器件的一侧形成凹槽来收集从发光器件的一侧发射的光朝向金属杆的前部而增加发光效率 通过倒装芯片接合方法将发光器件结合到槽的内部，并在沟槽内形成反射层。

公开(公告)号：US20060180828A1

公开(公告)日：2006-08-17

申请号：US11059525

申请日：2005-02-17

申请人： Geun-Ho Kim ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Ki-Chang Song

IPC分类号： H01L29/06

CPC分类号： H05K3/328 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48145 ,  H05K1/053 ,  H05K2201/10106 ,  H05K2203/049 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other and increase the luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of a metal stem by forming grooves at a sub-mounts, bonding the light emitting device to the inside of the groove by a flip chip bonding method and forming a reflective layer inside the groove.

摘要翻译： 光源装置及其制造方法可以防止彼此相邻的发光器件之间的光干涉，并且通过在发光器件的一侧形成凹槽来收集从发光器件的一侧发射的光朝向金属杆的前部而增加发光效率 通过倒装芯片接合方法将发光器件结合到槽的内部，并在沟槽内形成反射层。

公开(公告)号：US20080290820A1

公开(公告)日：2008-11-27

申请号：US12165282

申请日：2008-06-30

申请人： Geun-Ho Kim ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Ki-Chang Song

IPC分类号： G09G3/32 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/06825 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.

摘要翻译： 发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中 半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。 结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以 有效地排放到外部。 另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

公开(公告)号：US20050274959A1

公开(公告)日：2005-12-15

申请号：US11147468

申请日：2005-06-08

申请人： Geun-Ho Kim ,  Chil-Keun Park ,  Ki-Chang Song

发明人： Geun-Ho Kim ,  Chil-Keun Park ,  Ki-Chang Song

IPC分类号： H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L27/15

CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a high power LED package, including an LED; a silicon submount to which the LED is flip chip bonded; a reflective film formed on the silicon submount and electrically connected to the LED to increase light emitting efficiency of the LED; electrical wires connected to the reflective film to connect the LED to an external circuit; an insulating body formed below the silicon submount; a heat sink formed below the insulating body; an insulating substrate formed on the heat sink; and metal lines formed on the insulating substrate and connected to the electrical wires. In the LED package, since the silicon submount having the LED flip chip bonded thereto is directly attached to the heat sink, heat generated upon operation of the LED can be effectively radiated. Also, the LED package has a simple structure, thus having drastically decreased manufacturing costs. The high power LED can be applied to backlight units of LCDs or general illumination fixtures, and as well, to backlight units of conventional PCS phones or LED packages for key pads, therefore increasing the light properties of the LED. In particular, the LED package has an array of two or more submounts each having an LED flip chip bonded thereto, and thus, it can be applied to a module of a backlight unit for LCDs, thus having remarkably reduced manufacturing costs.

摘要翻译： 公开了一种大功率LED封装，包括LED; 一个硅衬底，LED被倒装在芯片上; 反射膜，形成在硅基座上并电连接到LED以提高LED的发光效率; 连接到反射膜的电线将LED连接到外部电路; 形成在硅基座下方的绝缘体; 在绝缘体下形成的散热器; 形成在散热器上的绝缘基板; 以及形成在绝缘基板上并连接到电线的金属线。 在LED封装中，由于具有与其结合的LED倒装芯片的硅基座直接连接到散热器，所以可以有效地辐射LED工作时产生的热量。 此外，LED封装具有简单的结构，从而大大降低了制造成本。 大功率LED可以应用于LCD或一般照明灯具的背光单元，以及用于键盘的常规PCS电话或LED封装的背光单元，因此增加了LED的光特性。 特别地，LED封装具有两个或更多个具有与其结合的LED倒装芯片的基座的阵列，因此可以应用于用于LCD的背光单元的模块，从而显着降低制造成本。