公开(公告)号：US20180264721A1

公开(公告)日：2018-09-20

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

CPC分类号： B29C64/153 ,  B29B9/06 ,  B29B9/12 ,  B29B2009/125 ,  B29C64/10 ,  B29C64/165 ,  B29C64/264 ,  B29K2067/003 ,  B29K2067/006 ,  B29K2067/046 ,  B29K2071/00 ,  B29K2077/10 ,  B29K2995/0041 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US20200016827A1

公开(公告)日：2020-01-16

申请号：US16495327

申请日：2018-03-07

申请人： Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Shinzo HIGUCHI ,  Toshiyuki ISEKI ,  Yasutomo AMAN ,  Toshiyuki MUTOH ,  Mitsuru NARUSE

发明人： Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Kiichi KAMODA ,  Shigenori YAGUCHI ,  Shinzo HIGUCHI ,  Toshiyuki ISEKI ,  Yasutomo AMAN ,  Toshiyuki MUTOH ,  Mitsuru NARUSE

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12

摘要： Provided is a resin powder for producing a three-dimensional object, wherein the resin powder has a number-average equivalent circle diameter of 10 micrometers or greater but 150 micrometers or less, and wherein a median in an equivalent circle diameter-based particle size distribution of the resin powder is higher than the average equivalent circle diameter.

公开(公告)号：US20180147780A1

公开(公告)日：2018-05-31

申请号：US15822775

申请日：2017-11-27

申请人： Kiichi KAMODA ,  Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI ,  Nozomu TAMOTO ,  Yasuo SUZUKI

发明人： Kiichi KAMODA ,  Yasuyuki YAMASHITA ,  Akira SAITO ,  Sohichiroh IIDA ,  Shinzo HIGUCHI ,  Hitoshi IWATSUKI ,  Nozomu TAMOTO ,  Yasuo SUZUKI

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00

CPC分类号： B29C64/153 ,  B29C64/268 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

摘要： A method of manufacturing a solid freeform fabrication object includes forming a layer of resin powder for solid freeform fabrication including particles having a pillar-like form and solidifying a particular area of the layer with irradiation of laser beams, wherein the laser beams have an energy intensity distribution having a top hat-like form.

公开(公告)号：US20180023219A1

公开(公告)日：2018-01-25

申请号：US15656214

申请日：2017-07-21

申请人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

发明人： Akira SAITO ,  Shigenori YAGUCHI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Yasuo SUZUKI ,  Nozomu TAMOTO ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

IPC分类号： D01F6/66 ,  C08K5/1575 ,  D01F6/84 ,  D01F1/10 ,  D01F1/07 ,  B05D3/06 ,  D01F6/06 ,  C08K3/16 ,  C08K3/22 ,  C08K3/04 ,  C08K7/14 ,  C08K7/20 ,  C08K5/527 ,  D01F6/80

CPC分类号： D01F6/665 ,  B05D3/06 ,  B33Y70/00 ,  C08J3/12 ,  C08J2323/12 ,  C08J2329/14 ,  C08J2367/02 ,  C08J2371/00 ,  C08J2377/06 ,  C08K3/046 ,  C08K3/16 ,  C08K3/2279 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/66 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US20180264720A1

公开(公告)日：2018-09-20

申请号：US15917993

申请日：2018-03-12

申请人： Nozomu TAMOTO ,  Sohichiroh IIDA ,  Akira SAITO ,  Yasuyuki YAMASHITA ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Kiichi KAMODA

发明人： Nozomu TAMOTO ,  Sohichiroh IIDA ,  Akira SAITO ,  Yasuyuki YAMASHITA ,  Hitoshi IWATSUKI ,  Shinzo HIGUCHI ,  Kiichi KAMODA

IPC分类号： B29C64/153 ,  B33Y70/00 ,  B33Y30/00 ,  B29B9/06 ,  B29B9/12 ,  B29C64/165 ,  B29C64/205 ,  B29C64/268 ,  C08K5/13 ,  C08K5/524 ,  C08K3/36 ,  C08G69/26 ,  C08F110/06 ,  C08G65/40 ,  C08G63/183

CPC分类号： B29C64/153 ,  B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29B2009/125 ,  B29C64/10 ,  B29C64/165 ,  B29C64/205 ,  B29C64/268 ,  B29K2023/12 ,  B29K2059/00 ,  B29K2067/006 ,  B29K2071/00 ,  B29K2077/00 ,  B29K2995/0077 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08F110/06 ,  C08G63/183 ,  C08G65/40 ,  C08G69/26 ,  C08K3/36 ,  C08K5/13 ,  C08K5/524

摘要： A resin powder for solid freeform fabrication contains pillar-like form particles having an average circularity of 0.83 or greater in a particle diameter range of from 0.5 to 200 μm.

公开(公告)号：US20190134853A1

公开(公告)日：2019-05-09

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi IWATSUKI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Toshiyuki MUTOH ,  Yasutomo AMAN ,  Toshiyuki ISEKI ,  Mitsuru NARUSE ,  Akira SAITO ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

发明人： Hitoshi IWATSUKI ,  Yasuyuki YAMASHITA ,  Kiichi KAMODA ,  Toshiyuki MUTOH ,  Yasutomo AMAN ,  Toshiyuki ISEKI ,  Mitsuru NARUSE ,  Akira SAITO ,  Shinzo HIGUCHI ,  Sohichiroh IIDA

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20200079011A1

公开(公告)日：2020-03-12

申请号：US16562734

申请日：2019-09-06

申请人： Hitoshi IWATSUKI ,  Sohichiroh IIDA ,  Yunsheng SUN ,  Satoshi OGAWA

发明人： Hitoshi IWATSUKI ,  Sohichiroh IIDA ,  Yunsheng SUN ,  Satoshi OGAWA

IPC分类号： B29C64/153 ,  B33Y70/00

摘要： A resin powder contains a resin containing particles, wherein the proportion of the particles in an aspect ratio range X represented by the following inequality 1 is 50 percent by number or more in a number distribution of an aspect ratio of the resin powder: A50−1≤X≤A50+1 Inequality 1, where A50 represents a median of the aspect ratio.

公开(公告)号：US20200070468A1

公开(公告)日：2020-03-05

申请号：US16558492

申请日：2019-09-03

申请人： Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Mitsuru NARUSE ,  Satoshi OGAWA ,  Yunsheng SUN

发明人： Sohichiroh IIDA ,  Hitoshi IWATSUKI ,  Mitsuru NARUSE ,  Satoshi OGAWA ,  Yunsheng SUN

IPC分类号： B32B5/06 ,  B32B5/02 ,  B32B5/26

摘要： A fiber aggregation contains fiber containing a thermoplastic resin, each of the fiber being mutually joined and aligned.

公开(公告)号：US20200070412A1

公开(公告)日：2020-03-05

申请号：US16555751

申请日：2019-08-29

申请人： Yunsheng SUN ,  Toshiyuki Mutoh ,  Hitoshi Iwatsuki ,  Shigenori Yaguchi ,  Mitsuru Naruse ,  Sohichiroh IIDA

发明人： Yunsheng SUN ,  Toshiyuki Mutoh ,  Hitoshi Iwatsuki ,  Shigenori Yaguchi ,  Mitsuru Naruse ,  Sohichiroh IIDA

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/20

摘要： A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.