公开(公告)号：US06960980B2

公开(公告)日：2005-11-01

申请号：US10102558

申请日：2002-03-19

申请人： Kinya Nakatsu ,  Masataka Sasaki ,  Ryuichi Saito ,  Satoshi Ibori ,  Masato Takase

发明人： Kinya Nakatsu ,  Masataka Sasaki ,  Ryuichi Saito ,  Satoshi Ibori ,  Masato Takase

IPC分类号： H01C3/00 ,  H01C1/14 ,  H02M1/00 ,  H02M7/00 ,  H01C7/00

CPC分类号： H01C1/14 ,  H02M7/003

摘要： A power converter includes a shunt resistor constituted by a shunt resistance and a plurality of main electrodes made of a sheet-like resistive material. In the shunt resistor, plates lower in volume electric resistivity than the resistive material, higher in thermal conductivity than the resistive material and thicker in thickness than the resistive material are fixedly attached by solder, to the side surfaces of the main electrodes opposite to the side surfaces with which the main electrodes are fixedly attached to an insulating layer. At least one plate main electrode for electrically connecting with main circuit wiring is provided in each of the plates. At least one constricted portion is formed between each of the plate main electrodes and the shunt resistance. Plate detection electrodes for detecting a voltage between the opposite ends of the shunt resistance is provided on the plates near the shunt resistance portion.

摘要翻译： 功率转换器包括由分流电阻构成的分流电阻和由片状电阻材料制成的多个主电极。 在分流电阻器中，体积电阻率低于电阻材料的板材的导热系数比电阻材料高，电阻材料的厚度比电阻材料通过焊料固定在主电极的与侧面相反的侧面 主电极固定在绝缘层上的表面。 在每个板中设置有用于与主电路布线电连接的至少一个板主电极。 在每个板主电极和分流电阻之间形成至少一个收缩部分。 用于检测分流电阻的相对端之间的电压的板检测电极设置在分流电阻部分附近的板上。

公开(公告)号：US06794854B2

公开(公告)日：2004-09-21

申请号：US10290549

申请日：2002-11-07

申请人： Kinya Nakatsu ,  Masataka Sasaki ,  Ryuichi Saito ,  Satoshi Ibori ,  Masato Takase

发明人： Kinya Nakatsu ,  Masataka Sasaki ,  Ryuichi Saito ,  Satoshi Ibori ,  Masato Takase

IPC分类号： H02H726

CPC分类号： H01C1/14 ,  H02M7/003

摘要： A power converter includes a shunt resistor constituted by a shunt resistance and a plurality of main electrodes made of a sheet-like resistive material. In the shunt resistor, plates lower in volume electric resistivity than the resistive material, higher in thermal conductivity than the resistive material and thicker in thickness than the resistive material are fixedly attached by solder, to the side surfaces of the main electrodes opposite to the side surfaces with which the main electrodes are fixedly attached to an insulating layer. At least one plate main electrode for electrically connecting with main circuit wiring is provided in each of the plates. At least one constricted portion is formed between each of the plate main electrodes and the shunt resistance. Plate detection electrodes for detecting a voltage between the opposite ends of the shunt resistance is provided on the plates near the shunt resistance portion.

摘要翻译： 功率转换器包括由分流电阻构成的分流电阻和由片状电阻材料制成的多个主电极。 在分流电阻器中，体积电阻率低于电阻材料的板材的导热系数比电阻材料高，电阻材料的厚度比电阻材料通过焊料固定在主电极的与侧面相反的侧面 主电极固定在绝缘层上的表面。 在每个板中设置有用于与主电路布线电连接的至少一个板主电极。 在每个板主电极和分流电阻之间形成至少一个收缩部分。 用于检测分流电阻的相对端之间的电压的板检测电极设置在分流电阻部分附近的板上。

公开(公告)号：US08503209B2

公开(公告)日：2013-08-06

申请号：US13273162

申请日：2011-10-13

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H02M7/537 ,  H02M7/5387

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H05K7/209 ,  H01L2924/00

摘要： Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

摘要翻译： 提供了一种功率转换装置的尺寸减小的技术，其包括与提高生产率并提高商业生产所需的可靠性相关的冷却功能和技术。 包括逆变器电路的上臂和下臂的串联电路内置在单个半导体模块500中。半导体模块在两侧具有冷却金属。 上臂半导体芯片和下臂半导体芯片楔入冷却金属之间。 半导体模块插入通道壳体主单元214内。半导体模块中设置有直流正极端子532，直流负极端子572和半导体芯片的交流端子582。 直流端子532和572与电容器模块的端子电连接。 交流端子582经由AC连接器与电动发电机电连接。

公开(公告)号：US20120033475A1

公开(公告)日：2012-02-09

申请号：US13273162

申请日：2011-10-13

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H02M7/537

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H05K7/209 ,  H01L2924/00

摘要： Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

摘要翻译： 提供了一种功率转换装置的尺寸减小的技术，其包括与提高生产率并提高商业生产所需的可靠性相关的冷却功能和技术。 包括逆变器电路的上臂和下臂的串联电路内置在单个半导体模块500中。半导体模块在两侧具有冷却金属。 上臂半导体芯片和下臂半导体芯片楔入冷却金属之间。 半导体模块插入通道壳体主单元214内。半导体模块中设置有直流正极端子532，直流负极端子572和半导体芯片的交流端子582。 直流端子532和572与电容器模块的端子电连接。 交流端子582经由AC连接器与电动发电机电连接。

公开(公告)号：US08064234B2

公开(公告)日：2011-11-22

申请号：US12019990

申请日：2008-01-25

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H02M7/537 ,  H02M7/5387

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H02M7/003 ,  H02M7/537 ,  H02M7/5387 ,  H05K7/209 ,  H01L2924/00

摘要： Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

摘要翻译： 提供了一种功率转换装置的尺寸减小的技术，其包括与提高生产率并提高商业生产所需的可靠性相关的冷却功能和技术。 包括逆变器电路的上臂和下臂的串联电路内置在单个半导体模块500中。半导体模块在两侧具有冷却金属。 上臂半导体芯片和下臂半导体芯片楔入冷却金属之间。 半导体模块插入通道壳体主单元214内。半导体模块中设置有直流正极端子532，直流负极端子572和半导体芯片的交流端子582。 直流端子532和572与电容器模块的端子电连接。 交流端子582经由AC连接器与电动发电机电连接。

公开(公告)号：US07812443B2

公开(公告)日：2010-10-12

申请号：US12060629

申请日：2008-04-01

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H01L23/10

CPC分类号： H01L25/115 ,  H01L23/473 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/81 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.

摘要翻译： 具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。 在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。 栅电极端子和栅极导体线接合。 第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。 通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。

公开(公告)号：US20080198548A1

公开(公告)日：2008-08-21

申请号：US12019142

申请日：2008-01-24

申请人： Takayoshi Nakamura ,  Kinya Nakatsu ,  Hideki Miyazaki ,  Ryuichi Saito

发明人： Takayoshi Nakamura ,  Kinya Nakatsu ,  Hideki Miyazaki ,  Ryuichi Saito

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2924/19107

摘要： A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path.

摘要翻译： 本发明的功率转换器包括具有多个开关装置的至少两个功率半导体模块，至少两个具有用于冷却多个功率半导体模块并配备有功率半导体模块的冷却剂路径的冷却夹套， 在所述至少两个冷却套之间，以及设置在所述至少两个冷却套中的连接冷却剂路径的连接器。

公开(公告)号：US09433134B2

公开(公告)日：2016-08-30

申请号：US14126955

申请日：2012-06-15

申请人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

发明人： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Toshiya Satoh ,  Tokihito Suwa

IPC分类号： H05K7/20 ,  H05K7/14 ,  H01L25/11 ,  H01L25/18 ,  H01L23/367 ,  H01L23/433 ,  H01L23/00 ,  H02M7/00 ,  H01L23/473

CPC分类号： H05K7/2089 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/33 ,  H01L25/115 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H02M7/003 ,  H05K7/1432 ,  H05K7/209 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space.

摘要翻译： 功率半导体模块包括具有上臂电路部分的第一封装，具有下臂电路部分的第二封装，具有存储第一封装和第二封装的存储空间的金属外壳以及与存储空间连接的开口， 以及将上臂电路部分与下臂电路部分连接的中间连接导体; 壳体包括通过存储空间面向第一辐射部分的第一辐射部分和第二辐射部分; 第一包装被布置成使得第一和第二包装件的布置方向可以平行于面向第一和第二辐射部分的相应表面; 并且中间连接导体将从第一封装延伸的发射极侧端子与从存储空间中的第二封装延伸的集电极侧端子耦合。

公开(公告)号：US20110069455A1

公开(公告)日：2011-03-24

申请号：US12886904

申请日：2010-09-21

申请人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Ryuichi Saito

发明人： Takeshi TOKUYAMA ,  Kinya Nakatsu ,  Ryuichi Saito

IPC分类号： H05K7/20

CPC分类号： H01L25/115 ,  H01L23/473 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/81 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00

摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.

摘要翻译： 具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。 在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。 栅电极端子和栅极导体线接合。 第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。 通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。

公开(公告)号：US20080130223A1

公开(公告)日：2008-06-05

申请号：US11933690

申请日：2007-11-01

申请人： Takayoshi Nakamura ,  Kinya Nakatsu ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

发明人： Takayoshi Nakamura ,  Kinya Nakatsu ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

IPC分类号： H05K7/20 ,  H02M7/537

CPC分类号： H05K7/20927 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H01L2924/00

摘要： First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.

摘要翻译： 在功率转换器的中间部分设置有第一和第二基座并构成冷却剂路径结构，并且在冷却剂路径结构的两个表面上设置半导体模块和电容器。 此外，在第一和第二基座中形成通孔，并且通过通孔布置直流和交流电路的电缆。