公开(公告)号：US11760104B2

公开(公告)日：2023-09-19

申请号：US17732518

申请日：2022-04-29

申请人： Nanami Takano ,  Toshiya Satoh ,  Teiichiro Ishikawa ,  Yohsuke Konishi

发明人： Nanami Takano ,  Toshiya Satoh ,  Teiichiro Ishikawa ,  Yohsuke Konishi

IPC分类号： B41J2/175 ,  B41J2/045 ,  B41J2/14

CPC分类号： B41J2/17596 ,  B41J2/04581 ,  B41J2/14201 ,  B41J2202/12

摘要： A liquid discharge apparatus includes a head including a supply path and a discharge path circulating a liquid in a liquid circulation direction, the head configured to discharge the liquid, a circulation path coupled to the head, the liquid circulates through the head in the circulation path, a bypass coupled to a downstream end of the supply path of the head and an upstream end of the discharge path of the head in the liquid circulation direction, a pressure generator configured to generate and apply a circulation pressure to the liquid circulating through the circulation path, and a deaerator configured to remove gas in the liquid circulating the circulation path.

公开(公告)号：US20200276839A1

公开(公告)日：2020-09-03

申请号：US16804235

申请日：2020-02-28

申请人： Toshiya SATOH ,  Teiichiro ISHIKAWA ,  Masaya HAMAGUCHI ,  Yusuke KOMINE ,  Huizee THEN ,  Naohiro TODA ,  Hidehisa SHIBASAKI

发明人： Toshiya SATOH ,  Teiichiro ISHIKAWA ,  Masaya HAMAGUCHI ,  Yusuke KOMINE ,  Huizee THEN ,  Naohiro TODA ,  Hidehisa SHIBASAKI

IPC分类号： B41J13/00

摘要： An apparatus according to one aspect of the present disclosure includes a temperature controlling member configured to heat or cool a conveyed substrate to which a liquid is applied, the conveyed substrate contacting an outer peripheral surface of the temperature controlling member; and an upstream inlet air unit configured to draw air between the substrate and the temperature controlling member, the upstream inlet air unit being provided upstream of a contact location of the substrate with the temperature controlling member, in a conveying direction.

公开(公告)号：US20160306318A1

公开(公告)日：2016-10-20

申请号：US15131949

申请日：2016-04-18

申请人： Daisuke TOMITA ,  Toshiya SATOH ,  Satoshi HATORI ,  Takeshi FUKAO ,  Hajime TERAJI ,  Norio KUDOH ,  Hiroyuki UENISHI

发明人： Daisuke TOMITA ,  Toshiya SATOH ,  Satoshi HATORI ,  Takeshi FUKAO ,  Hajime TERAJI ,  Norio KUDOH ,  Hiroyuki UENISHI

IPC分类号： G03G15/08 ,  G03G21/00

CPC分类号： G03G21/105 ,  G03G15/0879 ,  H04N1/00909 ,  H04N2201/0094

摘要： A toner conveyance device includes a toner conveyance path through which toner is transported. The toner conveyance path includes a flexible portion, a toner conveyor inside the conveyance path to convey the toner, and a restrictor outside the toner conveyance path to restrict deformation of the toner conveyance path.

摘要翻译： 调色剂输送装置包括调色剂输送路径，调色剂通过该输送路径被输送。 调色剂输送路径包括柔性部分，输送路径内的调色剂传送器，用于输送调色剂，以及限制器在调色剂输送路径外部，以限制调色剂输送路径的变形。

公开(公告)号：US20160231689A1

公开(公告)日：2016-08-11

申请号：US15016372

申请日：2016-02-05

申请人： Daisuke TOMITA ,  Toshiya SATOH ,  Norio KUDOH ,  Hiroyuki UENISHI ,  Tomohiko SAITO

发明人： Daisuke TOMITA ,  Toshiya SATOH ,  Norio KUDOH ,  Hiroyuki UENISHI ,  Tomohiko SAITO

IPC分类号： G03G15/00

CPC分类号： G03G21/00 ,  G03G21/0005 ,  G03G21/0035 ,  G03G21/203

摘要： An image forming apparatus includes an image bearer; a charger to charge a surface of the image bear; a developing device to develop a toner image on the surface of the image bearer; an image bearer cleaner to remove residual toner remaining on the surface of the image bearer after a transfer process; and a controller to cause the image forming apparatus to perform, before a start of printing operation, a corona products removal mode. In the image forming apparatus further including a temperature and humidity sensor to measure temperature and humidity of an ambient environment of the image bearer, the controller to cause the image forming apparatus to perform, before a start of an image forming operation, a corona products removal mode based on an absolute humidity obtained by the temperature and humidity detected by the temperature and humidity sensor.

摘要翻译： 图像形成装置包括图像载体; 充电器对图像的表面进行充电; 显影装置，用于在图像载体的表面上显影调色剂图像; 图像载体清洁器，用于去除在传送处理之后残留在图像承载体的表面上的残留调色剂; 以及控制器，用于使图像形成装置在开始打印操作之前执行电晕产品移除模式。 在还包括温度和湿度传感器以测量图像承载体的周围环境的温度和湿度的图像形成装置中，控制器使图像形成装置在图像形成操作开始之前执行电晕产物去除 基于由温度和湿度传感器检测到的温度和湿度获得的绝对湿度的模式。

公开(公告)号：US20140126942A1

公开(公告)日：2014-05-08

申请号：US14026263

申请日：2013-09-13

申请人： Takeshi KOJIMA ,  Hirotaka HATTA ,  Toshiya SATOH ,  Akira ASAOKA ,  Hiroyuki UENISHI ,  Yusuke ISHIZUKA

发明人： Takeshi KOJIMA ,  Hirotaka HATTA ,  Toshiya SATOH ,  Akira ASAOKA ,  Hiroyuki UENISHI ,  Yusuke ISHIZUKA

IPC分类号： G03G21/00

CPC分类号： G03G21/0035 ,  G03G21/0023

摘要： An image forming apparatus includes a first image forming device, a plurality of second image forming devices, a first bias voltage supply device, and a second bias voltage supply device. The first image forming device and the second image forming device form a toner image. The first bias voltage supply device applies a bias voltage to a first component of the first image forming device. The second bias voltage supply device applies a bias voltage to a second component of each of the plurality of second image forming devices.

摘要翻译： 图像形成装置包括第一图像形成装置，多个第二图像形成装置，第一偏置电压供给装置和第二偏置电压供给装置。 第一图像形成装置和第二图像形成装置形成调色剂图像。 第一偏置电压供给装置向第一图像形成装置的第一部件施加偏置电压。 第二偏置电压供给装置对多个第二图像形成装置中的每一个的第二分量施加偏置电压。

公开(公告)号：USD651170S1

公开(公告)日：2011-12-27

申请号：US29354621

申请日：2010-01-27

申请人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

设计人： Masashi Yura ,  Shinichi Fujino ,  Yusuke Takagi ,  Toshiya Satoh ,  Kinya Nakatsu ,  Takeshi Tokuyama

公开(公告)号：US20110299265A1

公开(公告)日：2011-12-08

申请号：US12920296

申请日：2009-10-30

申请人： Kinya Nakatsu ,  Hiroshi Hozoji ,  Takeshi Tokuyama ,  Yusuke Takagi ,  Toshiya Satoh ,  Taku Oyama ,  Takanori Ninomiya

发明人： Kinya Nakatsu ,  Hiroshi Hozoji ,  Takeshi Tokuyama ,  Yusuke Takagi ,  Toshiya Satoh ,  Taku Oyama ,  Takanori Ninomiya

IPC分类号： H05K7/00

CPC分类号： H02M7/003 ,  B60L11/14 ,  B60L11/18 ,  B60L11/1803 ,  B60L2200/26 ,  B60L2210/40 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H02M7/44 ,  H02M7/5395 ,  H02M2001/327 ,  H02P27/08 ,  H05K7/20409 ,  H05K7/205 ,  H05K7/209 ,  H05K7/20927 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7077 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.

摘要翻译： 包括功率模块的功率模块和功率转换器装置包括：两个基板，它们的主表面相互面对; 设置在所述两个基板之间的半导体电路单元; 连接构件，其连接到所述两个基板并形成容纳所述半导体电路单元的壳体区域; 以及绝缘构件，其设置在所述基板和所述半导体电路单元之间，并且确保所述基板和所述半导体电路单元的电绝缘。 连接构件的刚性或厚度小于基板的刚度或厚度。

公开(公告)号：US07542317B2

公开(公告)日：2009-06-02

申请号：US11501784

申请日：2006-08-10

申请人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

发明人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

IPC分类号： H02M7/537

CPC分类号： H05K7/1432 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/40091 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2224/37099

摘要： The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected between a second potential and the third potential, and a third group of power semiconductor elements at least one of which is electrically connected between the first potential and the third potential. The second group is disposed between the first group and third group.Thereby, a low-loss semiconductor device having both inductance reducibility and heat generation balancing capability and also an electric power conversion apparatus using the same is provided.

摘要翻译： 电力转换装置使用半导体装置。 所述半导体器件包括第一组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间，第二组功率半导体元件，其中至少一个功率半导体元件电连接在第二电位与第三电位之间 电位和第三组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间。 第二组置于第一组和第三组之间。 因此，提供了具有电感还原性和发热平衡能力的低损耗半导体器件以及使用其的电力转换装置。

公开(公告)号：US20080174976A1

公开(公告)日：2008-07-24

申请号：US11834452

申请日：2007-08-06

申请人： Toshiya SATOH ,  Masahiko OGINO ,  Takao MIWA ,  Takashi NAITOU ,  Takashi NAMEKAWA ,  Toshihide NABATAME ,  Shigehisa MOTOWAKI

发明人： Toshiya SATOH ,  Masahiko OGINO ,  Takao MIWA ,  Takashi NAITOU ,  Takashi NAMEKAWA ,  Toshihide NABATAME ,  Shigehisa MOTOWAKI

IPC分类号： H05K1/18

CPC分类号： H01L27/13 ,  H01F17/0006 ,  H01L23/49822 ,  H01L23/49827 ,  H01L27/016 ,  H01L27/0676 ,  H01L27/08 ,  H01L2224/16 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/19011 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09536 ,  H05K2201/09827 ,  H01L2924/00

摘要： Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost.The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

摘要翻译： 通过在基板上安装单个无源元件并增加安装成本来改善模块尺寸增加，提供高可靠性，高性能和小尺寸的电子电路元件，其允许将各种电子部件如 电容器，电感器和电阻器，高密度，低成本。 电子电路部件包括绝缘体基板，设置在绝缘体基板上的具有不同区域的多个电极，从夹在电极之间的电介质材料的电容器元件中选择的一个或多个元件，电感器元件和电阻元件，连接 所述元件，所述金属布线的一部分的金属端子部分和覆盖所述元件的有机绝缘体材料以及除了所述金属端子部分之外的所述金属布线部分的周边。

公开(公告)号：US07217992B2

公开(公告)日：2007-05-15

申请号：US10861523

申请日：2004-06-07

申请人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

发明人： Masahiko Ogino ,  Takumi Ueno ,  Shuji Eguchi ,  Akira Nagai ,  Toshiya Satoh ,  Toshiaki Ishii ,  Hiroyoshi Kokaku ,  Tadanori Segawa ,  Nobutake Tsuyuno ,  Asao Nishimura ,  Ichiro Anjoh

IPC分类号： H01L23/02 ,  H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3171 ,  H01L23/3114 ,  H01L23/3164 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2924/00012

摘要： Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility.The semiconductor device 17 comprising: a semiconductor chip 64; a porous stress relaxing layer 3 provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer 2 provided on the stress relaxing layer and connected to the electrodes; and external terminals 10 provided on the circuit layer; wherein an organic protecting film 7 is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip 6, and the protecting film 7 are exposed outside on a same plane.

摘要翻译： 提供半导体器件，半导体晶片和半导体模块：其中半导体器件具有小的翘曲; 几乎不产生芯片边缘的损坏和跌落试验中的裂纹; 半导体装置的安装可靠性和大规模生产性优异。 半导体器件17包括：半导体芯片64; 设置在半导体芯片的形成有电路和电极的平面上的多孔应力缓和层3; 设置在应力缓和层上并与电极连接的电路层2; 和设置在电路层上的外部端子10; 其中在半导体芯片的与应力缓和层相反的平面上形成有机保护膜7，并且应力缓和层，半导体芯片6和保护膜7的各个侧面在外部暴露在外部 飞机