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    High density, separable connector and contact for use therein
    1.
    发明授权
    High density, separable connector and contact for use therein 失效
    高密度，可分离的连接器和接触件用于其中

    公开(公告)号：US5137456A

    公开(公告)日：1992-08-11

    申请号：US787285

    申请日：1991-11-04

    申请人： Kishor V. Desai ,  Thomas G. Macek ,  Maganlal S. Patel ,  Edwin L. Thomas

    发明人： Kishor V. Desai ,  Thomas G. Macek ,  Maganlal S. Patel ,  Edwin L. Thomas

    IPC分类号： H01R4/50 ,  G01R31/28 ,  H01R11/01 ,  H01R12/52 ,  H01R12/71 ,  H01R13/24 ,  H05K1/14

    CPC分类号： H01R12/714 ,  H01R12/52

    摘要： An electrical connector for interconnecting a pair of circuit members (e.g., printed circuit boards) wherein the connector includes a plurality of electrical contacts, these contacts including at least one semi-spherical end portion for engaging a respective conductor on one of the circuit members. Significantly, the semi-spherical end portion is capable of moving in two different directions of rotation during such engagement to provide an effective wiping motion against the surfaces of the member's conductor. In one embodiment, the connector includes contacts with opposed, semi-spherical end portions, while in another embodiment, a singular semi-spherical end portion is taught.

    摘要翻译： 一种用于互连一对电路构件（例如印刷电路板）的电连接器，其中连接器包括多个电触点，这些触点包括至少一个半球形端部，用于与一个电路构件上的相应导体接合。 重要的是，半球形端部能够在这种接合期间在两个不同的旋转方向上移动，以对构件导体的表面提供有效的擦拭运动。 在一个实施例中，连接器包括具有相对的半球形端部的触点，而在另一个实施例中，教导了单个半球形端部。

    Method of making an electronic package with enhanced heat sinking
    4.
    发明授权
    Method of making an electronic package with enhanced heat sinking 失效
    制造具有增强散热的电子封装的方法

    公开(公告)号：US5263245A

    公开(公告)日：1993-11-23

    申请号：US19408

    申请日：1993-02-16

    申请人： Maganlal S. Patel ,  John J. Zopff

    发明人： Maganlal S. Patel ,  John J. Zopff

    IPC分类号： H01L23/31 ,  H01L23/367 ,  H05K1/02 ,  H05K7/20 ,  H05K3/34

    CPC分类号： H05K1/0204 ,  H01L23/3121 ,  H01L23/367 ,  H01L2224/32188 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/181 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2203/049 ,  Y10T29/4913 ,  Y10T29/49144

    摘要： An electronic package which includes a substrate having a dielectric layer, a circuitized layer located on one surface of the dielectric and a thermally and electrically conductive layer located on a second surface of the dielectric, this thermally and conductive layer designed for providing enhanced heat removal from the package's semiconductor device. A pedestal element is located on or formed as part of the thermal and electrically conductive layer, and extends through the dielectric and circuitized layers for having the semiconductor device positioned thereon. The semiconductor device is thus in substantially direct thermal communication with the pedestal element and thus the adjacent, thick thermal conductive layer which functions as the package's heat sink. In one embodiment, solder is provided on the pedestal element to interconnect desired portions of the circuitized layer with the pedestal element (e.g., to provide electrical ground). A method of making such an electronic package is also defined herein.

    摘要翻译： 一种电子封装，其包括具有电介质层的基板，位于电介质的一个表面上的电路层，以及位于电介质的第二表面上的导热层，该导热层被设计用于提供从 封装的半导体器件。 基座元件位于或形成为导热层的一部分，并且延伸穿过介电层和电路层，以使半导体器件位于其上。 因此，半导体器件与基座元件基本上直接热连通，并且因此与用作封装散热器的相邻厚的导热层基本上直接热连通。 在一个实施例中，在基座元件上提供焊料以将电路化层的所需部分与基座元件（例如，以提供电接地）相互连接。 制造这样的电子封装的方法也在本文中定义。