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    WIRING SUBSTRATE AND PROBE CARD
    5.
    发明申请
    WIRING SUBSTRATE AND PROBE CARD 有权
    接线基板和探头卡

    公开(公告)号：US20100327897A1

    公开(公告)日：2010-12-30

    申请号：US12735929

    申请日：2009-02-26

    申请人： Toshio Kazama ,  Hiroshi Nakayama ,  Shinya Miyaji ,  Kohei Suzuki

    发明人： Toshio Kazama ,  Hiroshi Nakayama ,  Shinya Miyaji ,  Kohei Suzuki

    IPC分类号： G01R1/073 ,  G01R31/26 ,  H05K1/00

    CPC分类号： G01R1/07378 ,  G01R31/2889 ,  H05K3/4605 ,  H05K3/467 ,  H05K2201/068

    摘要： A wiring substrate that allows wiring at a fine pitch and has a coefficient of thermal expansion close to the coefficient of thermal expansion of silicone, and a probe card that includes the wiring substrate are provided. To this end, there are provided a wiring substrate that includes a ceramic substrate having a coefficient of thermal expansion of 3×10−6 to 5×10−6/° C. and one or more thin-film wiring sheets stacked on one surface of the ceramic substrate, and a probe head on which a plurality of conductive proves are arranged in accordance with wiring on the thin-film wiring sheet, which holds individual probes while preventing the probes from coming off and allowing both ends of each probe to be exposed, and which is stacked on the wiring substrate while one end of each probe is brought into contact with the thin-film wiring sheet.

    摘要翻译： 提供允许以细间距布线并且具有接近硅树脂的热膨胀系数的热膨胀系数的布线基板和包括布线基板的探针卡。 为此，提供一种布线基板，其包括具有3×10-6〜5×10-6 /℃的热膨胀系数的陶瓷基板和在一个面上堆叠的一个以上的薄膜布线片 的陶瓷基板，以及探针头，根据薄膜布线片上的布线布置有多个导电证明物，该探针头保持各个探针，同时防止探针脱落并且允许每个探针的两端为 暴露，并且在每个探针的一端与薄膜布线片接触的同时在布线基板上层叠。

    Ceramic member, probe holder, and method of manufacturing ceramic member
    6.
    发明授权
    Ceramic member, probe holder, and method of manufacturing ceramic member 有权
    陶瓷构件，探针架，以及陶瓷构件的制造方法

    公开(公告)号：US08806969B2

    公开(公告)日：2014-08-19

    申请号：US12309537

    申请日：2007-07-23

    申请人： Shinya Miyaji ,  Shinji Saito

    发明人： Shinya Miyaji ,  Shinji Saito

    IPC分类号： C03C10/00 ,  G01D21/00

    CPC分类号： G01R3/00 ,  C04B35/20 ,  C04B35/645 ,  C04B2235/3418 ,  C04B2235/3427 ,  C04B2235/652 ,  C04B2235/656 ,  C04B2235/658 ,  C04B2235/6581 ,  C04B2235/787 ,  C04B2235/9607 ,  G01R1/07314 ,  G01R1/07371 ,  G01R1/44

    摘要： To provide a ceramic member having a thermal expansion coefficient close to that of silicon and has satisfactory workability, a probe holder formed by using this ceramic member, and a method of manufacturing the ceramic member. For this purpose, at least mica and silicon dioxide are mixed and an external force oriented in one direction is caused to act on this mixed mixture to sinter the mixture. It is more preferable that, in the mixture, a volume content of the mica is 70 to 90 volume % and a volume content of the silicon dioxide is 10 to 30 volume %.

    摘要翻译： 为了提供具有接近于硅的热膨胀系数的陶瓷构件，并且具有令人满意的可加工性，通过使用该陶瓷构件形成的探针保持架以及陶瓷构件的制造方法。 为此目的，至少将云母和二氧化硅混合，并使在一个方向上取向的外力作用于该混合混合物以烧结混合物。 更优选的是，在混合物中，云母的体积含量为70〜90体积％，二氧化硅的体积含量为10〜30体积％。

    Wiring substrate and probe card
    7.
    发明授权
    Wiring substrate and probe card 有权
    接线基板和探针卡

    公开(公告)号：US08378705B2

    公开(公告)日：2013-02-19

    申请号：US12735929

    申请日：2009-02-26

    申请人： Toshio Kazama ,  Hiroshi Nakayama ,  Shinya Miyaji ,  Kohei Suzuki

    发明人： Toshio Kazama ,  Hiroshi Nakayama ,  Shinya Miyaji ,  Kohei Suzuki

    IPC分类号： G01R31/00

    CPC分类号： G01R1/07378 ,  G01R31/2889 ,  H05K3/4605 ,  H05K3/467 ,  H05K2201/068

    摘要： A wiring substrate that allows wiring at a fine pitch and has a coefficient of thermal expansion close to the coefficient of thermal expansion of silicone, and a probe card that includes the wiring substrate are provided. To this end, there are provided a wiring substrate that includes a ceramic substrate having a coefficient of thermal expansion of 3×10−6 to 5×10−6/° C. and one or more thin-film wiring sheets stacked on one surface of the ceramic substrate, and a probe head on which a plurality of conductive proves are arranged in accordance with wiring on the thin-film wiring sheet, which holds individual probes while preventing the probes from coming off and allowing both ends of each probe to be exposed, and which is stacked on the wiring substrate while one end of each probe is brought into contact with the thin-film wiring sheet.

    摘要翻译： 提供允许以细间距布线并且具有接近硅树脂的热膨胀系数的热膨胀系数的布线基板和包括布线基板的探针卡。 为此，提供一种布线基板，其包括具有3×10-6〜5×10-6 /℃的热膨胀系数的陶瓷基板和在一个面上堆叠的一个以上的薄膜布线片 的陶瓷基板，以及探针头，根据薄膜布线片上的布线布置有多个导电证明物，该探针头保持各个探针，同时防止探针脱落并且允许每个探针的两端为 暴露，并且在每个探针的一端与薄膜布线片接触的同时在布线基板上层叠。

    Ceramic Member, Probe Holder, and Method of Manufacturing Ceramic Member
    8.
    发明申请
    Ceramic Member, Probe Holder, and Method of Manufacturing Ceramic Member 有权
    陶瓷构件，探头支架和陶瓷构件的制造方法

    公开(公告)号：US20100000347A1

    公开(公告)日：2010-01-07

    申请号：US12309537

    申请日：2007-07-23

    申请人： Shinya Miyaji ,  Shinji Saito

    发明人： Shinya Miyaji ,  Shinji Saito

    IPC分类号： G01D21/00 ,  C03C10/00

    CPC分类号： G01R3/00 ,  C04B35/20 ,  C04B35/645 ,  C04B2235/3418 ,  C04B2235/3427 ,  C04B2235/652 ,  C04B2235/656 ,  C04B2235/658 ,  C04B2235/6581 ,  C04B2235/787 ,  C04B2235/9607 ,  G01R1/07314 ,  G01R1/07371 ,  G01R1/44

    摘要： To provide a ceramic member having a thermal expansion coefficient close to that of silicon and has satisfactory workability, a probe holder formed by using this ceramic member, and a method of manufacturing the ceramic member. For this purpose, at least mica and silicon dioxide are mixed and an external force oriented in one direction is caused to act on this mixed mixture to sinter the mixture. It is more preferable that, in the mixture, a volume content of the mica is 70 to 90 volume % and a volume content of the silicon dioxide is 10 to 30 volume %.

    摘要翻译： 为了提供具有接近于硅的热膨胀系数的陶瓷构件，并且具有令人满意的可加工性，通过使用该陶瓷构件形成的探针保持架以及陶瓷构件的制造方法。 为此目的，至少将云母和二氧化硅混合，并使在一个方向上取向的外力作用于该混合混合物以烧结混合物。 更优选的是，在混合物中，云母的体积含量为70〜90体积％，二氧化硅的体积含量为10〜30体积％。

    INSULATION COATING METHOD FOR METAL BASE, INSULATION COATED METAL BASE, AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME
    9.
    发明申请
    INSULATION COATING METHOD FOR METAL BASE, INSULATION COATED METAL BASE, AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME 审中-公开
    金属基绝缘涂层方法，绝缘涂层金属基体及其半导体制造装置

    公开(公告)号：US20130052451A1

    公开(公告)日：2013-02-28

    申请号：US13661390

    申请日：2012-10-26

    申请人： Takamichi Sano ,  Shinya Miyaji ,  Shinji Saito

    发明人： Takamichi Sano ,  Shinya Miyaji ,  Shinji Saito

    IPC分类号： C23C4/10 ,  B32B15/04 ,  C23C4/18

    CPC分类号： C23C4/18 ,  C23C4/11 ,  C23C28/04 ,  Y10T428/24997

    摘要： An insulation coating method for a metal base comprises a thermal spraying step, an impregnation step, and a beam irradiation step. In the thermal spraying step, a first insulation coating is formed by thermally spraying a first metal oxide to the surface of the metal base. In the impregnation step, pores formed in the surface of the first insulation coating are impregnated with a sol that contains, as a dispersoid, a metal oxide, a hydrate of a metal oxide, or a metal hydroxide. In the beam irradiation step, a second insulation coating that is composed of a second metal oxide is formed by irradiating the first insulation coating and the sol with a high energy beam after the impregnation step.

    摘要翻译： 用于金属基底的绝缘涂覆方法包括热喷涂步骤，浸渍步骤和束照射步骤。 在热喷涂步骤中，通过将第一金属氧化物热喷涂到金属基底的表面上形成第一绝缘涂层。 在浸渍步骤中，在第一绝缘涂层的表面形成的孔被含有作为分散质的金属氧化物，金属氧化物的水合物或金属氢氧化物的溶胶浸渍。 在光束照射工序中，通过在浸渍工序后用高能量射束照射第一绝缘层和溶胶，形成由第二金属氧化物构成的第二绝缘膜。

    Electrostatic chuck and production method therefor
    10.
    发明授权
    Electrostatic chuck and production method therefor 失效
    静电吸盘及其制作方法

    公开(公告)号：US07265962B2

    公开(公告)日：2007-09-04

    申请号：US10814304

    申请日：2004-04-01

    申请人： Shinya Miyaji ,  Xinwei Chen ,  Shinji Saito

    发明人： Shinya Miyaji ,  Xinwei Chen ,  Shinji Saito

    IPC分类号： H01T23/00

    CPC分类号： H01L21/6831

    摘要： The present invention provides an electrostatic chuck comprising a substrate, a dielectric layer formed by thermal spraying on an upper face of the substrate, an internal electrode embedded in the dielectric layer, a feeder terminal portion extending from a lower face of the substrate to the internal electrode, and an electrode provided in the feeder terminal portion, wherein the feeder terminal portion and the substrate are fixed to each other by mechanical joining.

    摘要翻译： 本发明提供一种静电卡盘，其包括基板，通过在基板的上表面上的热喷涂形成的电介质层，嵌入在电介质层中的内部电极，从基板的下表面延伸到内部的馈电端子部 电极和设置在馈电端子部分中的电极，其中馈电端子部分和基板通过机械接合彼此固定。