THIN FILM TRANSISTOR
    1.
    发明申请
    THIN FILM TRANSISTOR 有权
    薄膜晶体管

    公开(公告)号:US20090267068A1

    公开(公告)日:2009-10-29

    申请号:US12429486

    申请日:2009-04-24

    IPC分类号: H01L29/786

    摘要: The thin film transistor includes a gate insulating layer covering a gate electrode, over a substrate having an insulating surface; a semiconductor layer forming a channel formation region, in which a plurality of crystal regions is included in an amorphous structure; an impurity semiconductor layer imparting one conductivity type which forms a source region and a drain region; and a buffer layer formed from an amorphous semiconductor, which is located between the semiconductor layer and the impurity semiconductor layer. The thin film transistor includes the crystal region which includes minute crystal grains and inverted conical or inverted pyramidal grain each of which grows approximately radially from a position away from an interface between the gate insulating layer and the semiconductor layer toward a direction in which the semiconductor layer is deposited in a region which does not reach the impurity semiconductor layer.

    摘要翻译: 薄膜晶体管包括覆盖栅电极的栅极绝缘层,在具有绝缘表面的基板上; 形成在非晶结构中包含多个晶体区域的沟道形成区域的半导体层; 赋予形成源极区域和漏极区域的一种导电型的杂质半导体层; 以及由位于半导体层和杂质半导体层之间的非晶半导体形成的缓冲层。 薄膜晶体管包括晶体区域,其包括微小晶粒和倒圆锥形或倒棱锥晶粒,其每个从远离栅极绝缘层和半导体层之间的界面的位置朝向半导体层的方向大致径向地生长 沉积在不到达杂质半导体层的区域中。

    THIN FILM TRANSISTOR
    2.
    发明申请
    THIN FILM TRANSISTOR 有权
    薄膜晶体管

    公开(公告)号:US20100127261A1

    公开(公告)日:2010-05-27

    申请号:US12467005

    申请日:2009-05-15

    IPC分类号: H01L29/786

    摘要: The thin film transistor includes, over a substrate having an insulating surface, a gate insulating layer covering a gate electrode, an amorphous semiconductor layer over the gate insulating layer, a semiconductor layer including an impurity element imparting one conductivity type over the amorphous semiconductor layer. The amorphous semiconductor layer comprises an NH radical. Defects of the amorphous semiconductor layer are reduced by cross-linking dangling bonds with the NH radical in the amorphous semiconductor layer.

    摘要翻译: 薄膜晶体管包括在具有绝缘表面的衬底上,覆盖栅电极的栅极绝缘层,栅极绝缘层上的非晶半导体层,包括在非晶半导体层上赋予一种导电类型的杂质元素的半导体层。 非晶半导体层包含NH自由基。 通过与非晶半导体层中的NH自由基交联悬挂键来减少非晶半导体层的缺陷。

    THIN FILM TRANSISTOR
    3.
    发明申请
    THIN FILM TRANSISTOR 有权
    薄膜晶体管

    公开(公告)号:US20090321737A1

    公开(公告)日:2009-12-31

    申请号:US12490447

    申请日:2009-06-24

    IPC分类号: H01L29/04

    摘要: A thin film transistor includes, as a buffer layer, a semiconductor layer which contains nitrogen and includes crystal regions in an amorphous structure between a gate insulating layer and source and drain regions, at least on the source and drain regions side. As compared to a thin film transistor in which an amorphous semiconductor is included in a channel formation region, on-current of a thin film transistor can be increased. In addition, as compared to a thin film transistor in which a microcrystalline semiconductor is included in a channel formation region, off-current of a thin film transistor can be reduced.

    摘要翻译: 至少在源区和漏区侧,薄膜晶体管包括作为缓冲层的半导体层,该半导体层含有氮并且包括在栅极绝缘层和源极和漏极区之间的非晶结构中的晶体区域。 与在沟道形成区域中包含非晶半导体的薄膜晶体管相比,可以提高薄膜晶体管的导通电流。 此外,与在沟道形成区域中包含微晶半导体的薄膜晶体管相比,可以减小薄膜晶体管的截止电流。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20100032667A1

    公开(公告)日:2010-02-11

    申请号:US12535714

    申请日:2009-08-05

    IPC分类号: H01L29/786 H01L21/336

    CPC分类号: H01L29/7869 H01L29/78618

    摘要: One of the objects of the present invention is to provide a thin film transistor using an oxide semiconductor film containing indium (In), gallium (Ga), and zinc (Zn), in which the contact resistance between the oxide semiconductor layer and a source and drain electrodes is reduced, and to provide a method for manufacturing the thin film transistor. An ohmic contact is formed by intentionally providing a buffer layer having a higher carrier concentration than the IGZO semiconductor layer between the IGZO semiconductor layer and the source and drain electrode layers.

    摘要翻译: 本发明的目的之一是提供一种使用含有铟(In),镓(Ga)和锌(Zn))的氧化物半导体膜的薄膜晶体管,其中氧化物半导体层和源极之间的接触电阻 并且减少了漏电极,并且提供了制造薄膜晶体管的方法。 通过有意地提供具有比IGZO半导体层和源极和漏极电极层之间的IGZO半导体层更高的载流子浓度的缓冲层来形成欧姆接触。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20100025676A1

    公开(公告)日:2010-02-04

    申请号:US12511252

    申请日:2009-07-29

    IPC分类号: H01L29/786 H01L21/336

    摘要: To offer a semiconductor device including a thin film transistor having excellent characteristics and high reliability and a method for manufacturing the semiconductor device without variation. The summary is to include an inverted-staggered (bottom-gate structure) thin film transistor in which an oxide semiconductor film containing In, Ga, and Zn is used for a semiconductor layer and a buffer layer is provided between the semiconductor layer and source and drain electrode layers. An ohmic contact is formed by intentionally providing a buffer layer containing In, Ga, and Zn and having a higher carrier concentration than the semiconductor layer between the semiconductor layer and the source and drain electrode layers.

    摘要翻译: 提供一种包括具有优异特性和高可靠性的薄膜晶体管的半导体器件以及不改变半导体器件的制造方法。 总结在于包括反向交错(底栅结构)薄膜晶体管,其中包含In,Ga和Zn的氧化物半导体膜用于半导体层,并且在半导体层和源之间提供缓冲层, 漏电极层。 通过有意地提供包含In,Ga和Zn的缓冲层并且具有比半导体层和源极和漏极电极层之间的半导体层更高的载流子浓度来形成欧姆接触。