公开(公告)号：US20050087849A1

公开(公告)日：2005-04-28

申请号：US10737122

申请日：2003-12-17

申请人： Koji Morita ,  Takao Yoshikawa ,  Takayuki Murai

发明人： Koji Morita ,  Takao Yoshikawa ,  Takayuki Murai

IPC分类号： H01L25/07 ,  H01L23/02

CPC分类号： H01L25/072 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.

摘要翻译： 电子基板用于在其上安装多个半导体芯片。 衬底包括第一导电构件，第二导电构件和绝缘层。 第一导电构件电连接到半导体芯片之一。 第二导电构件电连接到另一个半导体芯片。 绝缘层被布置成将第二导电构件与第一导电构件电隔离。 第一导电构件是在其上支撑绝缘层，半导体芯片和第二导电构件的导电基底。

公开(公告)号：US06798078B2

公开(公告)日：2004-09-28

申请号：US10022297

申请日：2001-12-12

申请人： Koji Morita ,  Takayuki Murai ,  Takao Yoshikawa

发明人： Koji Morita ,  Takayuki Murai ,  Takao Yoshikawa

IPC分类号： H01L2328

CPC分类号： H01L23/544 ,  H01L23/3121 ,  H01L24/40 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/40225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85399 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device for power control includes a substrate made of aluminum. Lands of copper are formed on the substrate. Semiconductor chips, such as FETs, are mounted on the lands. The semiconductor chips are joined with the lands only through solder layers. A synthetic resin, which includes epoxide, covers the lands, the solder layers and the semiconductor chips on the substrate. Preferably, a coefficient of expansion of the synthetic resin is generally less than a coefficient of expansion of the substrate or a coefficient of expansion of the lands. Each semiconductor chip defines at least two corners positioned generally opposite to each other. Each land defines at least two corners disposed in proximity to the corners of the semiconductor chip. The corners of the land generally confine the corners of the semiconductor chip therein.

摘要翻译： 用于功率控制的半导体器件包括由铝制成的衬底。 在基板上形成铜的区域。 诸如FET的半导体芯片安装在焊盘上。 半导体芯片仅通过焊料层与焊盘接合。 包括环氧化物的合成树脂覆盖基板上的焊盘，焊料层和半导体芯片。 优选地，合成树脂的膨胀系数通常小于基材的膨胀系数或者焊盘的膨胀系数。 每个半导体芯片限定至少两个通常彼此相对定位的角。 每个区域限定了靠近半导体芯片的拐角设置的至少两个拐角。 地面的拐角通常将半导体芯片的角部限制在其中。

公开(公告)号：US07119437B2

公开(公告)日：2006-10-10

申请号：US10737122

申请日：2003-12-17

申请人： Koji Morita ,  Takao Yoshikawa ,  Takayuki Murai

发明人： Koji Morita ,  Takao Yoshikawa ,  Takayuki Murai

IPC分类号： H01L23/34

CPC分类号： H01L25/072 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48699 ,  H01L2224/48747 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The first conductive member is electrically connected to one of the semiconductor chips. The second conductive member is electrically connected to another one of the semiconductor chips. The insulating layer is arranged to electrically isolate the second conductive member from the first conductive member. The first conductive member is a conductive base that supports the insulating layer, the semiconductor chips and the second conductive member thereon.

摘要翻译： 电子基板用于在其上安装多个半导体芯片。 衬底包括第一导电构件，第二导电构件和绝缘层。 第一导电构件电连接到半导体芯片之一。 第二导电构件电连接到另一个半导体芯片。 绝缘层被布置成将第二导电构件与第一导电构件电隔离。 第一导电构件是在其上支撑绝缘层，半导体芯片和第二导电构件的导电基底。

公开(公告)号：US20050253233A1

公开(公告)日：2005-11-17

申请号：US11113079

申请日：2005-04-22

申请人： Takayuki Murai ,  Koji Morita

发明人： Takayuki Murai ,  Koji Morita

IPC分类号： H01L23/02 ,  H01L25/16 ,  H02P7/00 ,  H05K1/02 ,  H05K3/34

CPC分类号： H05K1/0263 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K3/341 ,  H05K2201/1028 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A power module includes a substrate having an insulative surface and a conductive pattern disposed on the insulative surface, a semiconductor device disposed on the substrate, a plate conductor provided on the conductive pattern with an insulating layer interposed therebetween, and a wire arranged to electrically connect the plate conductor and the semiconductor device.

摘要翻译： 功率模块包括具有绝缘表面和布置在绝缘表面上的导电图案的基板，设置在基板上的半导体器件，设置在导体图案上的绝缘层的板状导体和布置成电连接的导线 板导体和半导体器件。

公开(公告)号：US20060022355A1

公开(公告)日：2006-02-02

申请号：US11189046

申请日：2005-07-25

申请人： Takayuki Murai ,  Koji Morita

发明人： Takayuki Murai ,  Koji Morita

IPC分类号： H01L29/76

CPC分类号： H01L25/071 ,  H01L2924/0002 ,  H02M7/003 ,  H01L2924/00

摘要： A power module includes a plurality of first semiconductor devices disposed so as to define a first layer in a substantially common plane, a plurality of second semiconductor devices disposed so as to define a second layer in a substantially same plane, and at least one metal plate electrically connected to at least two semiconductor devices selected from among the plurality of first and second semiconductor devices. The first layer and second layer are stacked such that the plurality of second semiconductor devices do not overlap the plurality of first semiconductor devices.

摘要翻译： 功率模块包括多个第一半导体器件，其被设置为在基本共同的平面中限定第一层，多个第二半导体器件被设置为在基本相同的平面中限定第二层，以及至少一个金属板 电连接到从多个第一和第二半导体器件中选择的至少两个半导体器件。 层叠第一层和第二层，使得多个第二半导体器件不与多个第一半导体器件重叠。

公开(公告)号：US20130120481A1

公开(公告)日：2013-05-16

申请号：US13812146

申请日：2011-04-20

申请人： Takayuki Murai ,  Kohji Fujiwara ,  Toshiyuki Gotoh

发明人： Takayuki Murai ,  Kohji Fujiwara ,  Toshiyuki Gotoh

IPC分类号： G09G3/34 ,  G09G5/10

CPC分类号： G09G3/3406 ,  G09G3/3413 ,  G09G5/10 ,  G09G2310/0235 ,  G09G2310/024 ,  G09G2320/064

摘要： An image display apparatus comprising: a driver apparatus; and a total of N device groups of a first group to an N-th group (2≦N) each of which includes one or a plurality of light emitting devices, the image display apparatus uses the driver apparatus to make each of the device groups emit light preventing light emission capable periods from overlapping one another and displays an image by using the obtained light as backlight; wherein the driver apparatus includes: a power output circuit that outputs light emission power used for the light emission of the light emitting device; and a switch mechanism that switches, in accordance with arrival of the light emission capable period of a device group K (1≦K≦N), an output destination of the light emission power output from the power output circuit to the device group K.

摘要翻译： 一种图像显示装置，包括：驱动器装置; 以及包括一个或多个发光装置的第一组的N个装置组到第N组（2 @ N），图像显示装置使用驱动器装置来使每个装置组 防止发光能力的时段彼此重叠，并通过使用所获得的光作为背光来显示图像; 其中所述驱动器装置包括：功率输出电路，其输出用于所述发光器件的发光的发光功率; 以及根据设备组K（1 @ K @ N）的发光能力期间的到达将从功率输出电路输出的发光功率的输出目的地切换到设备组K的开关机构。

公开(公告)号：US08378116B2

公开(公告)日：2013-02-19

申请号：US13449006

申请日：2012-04-17

申请人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

发明人： Hirohiko Hirao ,  Yoshimasa Kikukawa ,  Takayuki Murai

IPC分类号： C07D233/56 ,  C23C22/05

CPC分类号： C07D233/64 ,  B23K35/007 ,  C23C22/52 ,  H05K3/282 ,  H05K2203/124

摘要： A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.

摘要翻译： 含有下式所示的新型苯基萘基咪唑化合物的表面处理剂与铜或铜合金的表面接触。 在该式中，当A 1为苯基时，A 2表示1-萘基或2-萘基，A 1为1-萘基或2-萘基时，A 2表示苯基。 R表示氢原子或甲基。

公开(公告)号：US20120147066A1

公开(公告)日：2012-06-14

申请号：US13390564

申请日：2010-03-10

申请人： Kohji Fujiwara ,  Takayuki Murai

发明人： Kohji Fujiwara ,  Takayuki Murai

IPC分类号： G09G3/36 ,  G09G3/32 ,  G09G5/10

CPC分类号： G09G3/3426 ,  G09G3/32 ,  G09G3/3413 ,  G09G2310/0235 ,  G09G2310/0237 ,  G09G2310/024 ,  G09G2310/08 ,  G09G2320/0242 ,  G09G2320/0247 ,  G09G2320/0261 ,  G09G2320/064 ,  G09G2320/103 ,  H05B33/0818 ,  H05B33/086

摘要： Disclosed is a backlight unit (16) for supplying backlight to a liquid crystal panel (15a), the backlight unit being provided with a plurality of LEDs (16b) that function as a light source of the backlight, and an LED driver (5) that comprises a plurality of control channels (1-12 ch) to each of which one or more of the LEDs are connected, and that PWM-controls lighting of the connected LEDs. The LED driver (5) can set the frequency or phase of the PWM control independently for each of the control channels (1-12 ch). Consequently, the flexibility of control of LEDs can be increased while the number of necessary LED drivers is reduced to a minimum.

摘要翻译： 公开了一种用于向液晶面板（15a）提供背光的背光单元（16），背光单元设置有用作背光源的光源的多个LED（16b）和LED驱动器（5） 其包括多个控制通道（1-12ch），其中一个或多个LED连接到其中的每一个，并且PWM控制连接的LED的点亮。 LED驱动器（5）可以为每个控制通道（1-12ch）单独设置PWM控制的频率或相位。 因此，可以增加控制LED的灵活性，同时将必要的LED驱动器的数量减少到最小。

公开(公告)号：US20120086740A1

公开(公告)日：2012-04-12

申请号：US13378227

申请日：2010-03-03

申请人： Takayuki Murai ,  Kohji Fujiwara ,  Hideki Ichioka

发明人： Takayuki Murai ,  Kohji Fujiwara ,  Hideki Ichioka

IPC分类号： G09G3/36 ,  G09G5/10

CPC分类号： G09G3/3648 ,  G02F2201/58 ,  G09G3/3406 ,  G09G2300/0434 ,  G09G2310/0237 ,  G09G2310/08 ,  G09G2320/041 ,  G09G2320/064 ,  G09G2340/0435

摘要： In at least one example embodiment, the present invention includes a liquid crystal display panel for displaying an image by virtue of having liquid crystals whose orientation changes in response to application of a voltage; a backlight unit with a built-in PWM light modulation type LED for emitting light to be supplied to the liquid crystal display panel; and a control unit for controlling the liquid crystal display panel and the backlight unit. In cases where the response speed of liquid crystal molecules is relatively high, the LED is driven at a relatively low drive frequency, whereas in cases where the response speed of the liquid crystal molecules is relatively low, the LED is driven at a relatively high drive frequency. According to the present invention, problems with image quality that tend to occur depending on the degree of tilting of the liquid crystal molecules (ghost outlines) are prevented.

摘要翻译： 在至少一个示例性实施例中，本发明包括一种液晶显示面板，用于通过具有响应于施加电压的方向改变的液晶来显示图像; 具有内置PWM调制型LED的背光单元，用于发射供给到液晶显示面板的光; 以及用于控制液晶显示面板和背光单元的控制单元。 在液晶分子的响应速度相对较高的情况下，以相对低的驱动频率驱动LED，而在液晶分子的响应速度相对较低的情况下，LED以较高的驱动速度驱动 频率。 根据本发明，防止了根据液晶分子的倾斜度（鬼影轮廓）倾向于发生的图像质量的问题。

公开(公告)号：US20110248974A1

公开(公告)日：2011-10-13

申请号：US12998924

申请日：2010-01-29

申请人： Takayuki Murai ,  Kohji Fujiwara

发明人： Takayuki Murai ,  Kohji Fujiwara

IPC分类号： G09G5/10 ,  H05B37/02

CPC分类号： G09G3/3426 ,  G02F1/133603 ,  G02F2001/133612 ,  G09G2320/041 ,  G09G2320/0626 ,  G09G2360/145 ,  H05B37/0254

摘要： Backlight drive units included in a backlight drive device of at least one embodiment of the present invention each have a plurality of metal pads functioning as a plurality of address setting terminals. To provide a potential for setting a unique address by coming into contact with the metal pads, metal protrusions are provided at corresponding locations of a backlight housing. A backlight drive control unit is directly connected to each unit through an IIC bus by a bus scheme and receives, via the IIC bus, a detected amount of light and temperature from each unit identified by the address. With such a simple configuration, a unique address can be automatically set for each unit, obtaining the commonization of backlight drive units.

摘要翻译： 包括在本发明的至少一个实施例的背光驱动装置中的背光驱动单元各自具有用作多个地址设置端子的多个金属焊盘。 为了提供通过与金属焊盘接触来设置唯一地址的可能性，在背光外壳的相应位置处提供金属突起。 背光驱动控制单元通过总线方案通过IIC总线直接连接到每个单元，并通过IIC总线接收来自由该地址识别的每个单元的检测到的光量和温度。 通过这样简单的配置，可以为每个单元自动设置唯一的地址，从而获得背光驱动单元的通用性。