公开(公告)号：US08711280B2

公开(公告)日：2014-04-29

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

摘要翻译： 固体摄像装置包括固体摄像装置，信号处理电路装置以及多层布线包装体。 固态图像感测装置在其图像感测区域中具有像素。 像素接收入射光并产生信号电荷。 信号处理电路装置被配置为面对图像感测区域，并且对从固态图像感测装置输出的信号进行信号处理。 多层布线封装具有布线层，固态图像感测装置和信号处理电路装置。 每个布线层通过绝缘体层叠。 多层布线封装被形成为使得设置在固态图像感测装置和信号处理电路装置之间的第一布线层具有比第二布线层更大的厚度，并且导热率高于或等于 第二布线层。

公开(公告)号：US08390133B2

公开(公告)日：2013-03-05

申请号：US13534078

申请日：2012-06-27

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装半导体芯片的突片，通过树脂密封半导体芯片形成的密封部分，多个引线，每个引线具有暴露于密封部分的后表面的周边部分的安装表面，以及 密封部分形成表面设置在其相对侧上，以及导线，用于连接半导体芯片的焊盘和引线，其中引线的密封部分形成表面的内端之间的长度设置为与每个 另一个形成为大于安装表面的内端之间的长度。 由此，能够扩大由各引线的密封部形成面的内端包围的芯片安装区域，能够增大安装芯片的尺寸。

公开(公告)号：US20120008025A1

公开(公告)日：2012-01-12

申请号：US13162060

申请日：2011-06-16

申请人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

发明人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

IPC分类号： H04N5/335

CPC分类号： H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

摘要翻译： 固态成像装置包括电连接的图像传感器芯片和信号处理芯片。 低导热率区域位于图像传感器芯片和信号处理芯片之间。 低热导率区域被配置为使图像传感器芯片与由信号处理芯片产生的热量隔离。

公开(公告)号：US07339261B2

公开(公告)日：2008-03-04

申请号：US11653402

申请日：2007-01-16

申请人： Yoshihiko Shimanuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Koji Tsuchiya

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper surface, and side faces which connect the upper and lower surfaces with each other; an electrically conductive tab sealed within the sealing body; tab suspending leads contiguous to the tab and partially exposed to the lower surface and the side faces of the sealing body; a semiconductor chip fixed to a lower surface of the tab; a plurality of electrically conductive leads, the electrically conductive leads each having an inner end portion positioned within the sealing body, an outer end portion exposed to the lower surface and a side face of the sealing body, and a projecting portion projecting into the sealing body from a side face of each of the electrically conductive leads; a projecting portion projecting from a side face of each of the tab suspending leads and positioned within the sealing body; and electrically conductive wires positioned within the sealing body and connecting electrodes formed on a lower surface of the semiconductor chip with the projecting portions of the electrically conductive leads and the tab suspending leads.

摘要翻译： 提供了允许减少引脚数和尺寸的半导体器件。 半导体器件包括由绝缘树脂形成的密封体，密封体具有上表面，与上表面相对的下表面和将上下表面相互连接的侧面; 密封在密封体内的导电片; 突片悬挂引线邻接突片并且部分地暴露于密封体的下表面和侧面; 固定在突片的下表面的半导体芯片; 多个导电引线，所述导电引线各自具有位于所述密封体内的内端部，暴露于所述下表面的外端部和所述密封体的侧面，以及突出部，所述突出部突出到所述密封体 从每个导电引线的侧面; 突出部分，其从每个突片悬挂引线的侧面突出并定位在密封体内; 以及定位在密封体内的导电线和形成在半导体芯片的下表面上的电极与导电引线和突片悬挂引线的突出部分。

公开(公告)号：US5686442A

公开(公告)日：1997-11-11

申请号：US522263

申请日：1995-10-26

申请人： Yasuo Ohtsuka ,  Takashi Shishikura ,  Hiroko Ogino ,  Kenichi Fushihara ,  Mami Kawaguchi ,  Seiji Tsutsumi ,  Megumi Imai ,  Keiko Shito ,  Koji Tsuchiya ,  Junko Tanaka ,  Takako Iwasaki ,  Shigeru Hoshiko ,  Takashi Tsuruoka

发明人： Yasuo Ohtsuka ,  Takashi Shishikura ,  Hiroko Ogino ,  Kenichi Fushihara ,  Mami Kawaguchi ,  Seiji Tsutsumi ,  Megumi Imai ,  Keiko Shito ,  Koji Tsuchiya ,  Junko Tanaka ,  Takako Iwasaki ,  Shigeru Hoshiko ,  Takashi Tsuruoka

IPC分类号： C07D249/04 ,  C07D487/04 ,  C07D513/04 ,  A61K31/55

CPC分类号： C07D487/04 ,  C07D249/04 ,  C07D513/04 ,  Y02P20/55

摘要： The tricyclic benzazepine and benzothiazepine derivatives represented by the formula (I) and pharmacologically acceptable salts thereof are disclosed. ##STR1## wherein Z represents CO, --CR.sup.6 R.sup.7 -- or --S(O).sub.n, R represents hydrogen, alkyl, phenylalkyl, or a protective group of a triazole ring, R.sup.1 -R.sup.5 represent hydrogen, alkyl, alkenyl, alkoxy, amino, oxim or hydroxyl. These compounds have anti-allergic effect and are useful for the treatment and prophylaxis of allergic diseases.

摘要翻译： PCT No.PCT / JP94 / 02282 Sec。 371 1995年10月26日第 102（e）日期1995年10月26日PCT 1994年12月28日PCT公布。 公开号WO95 / 18130 日期：1995年7月6日公开了由式（I）表示的三环苯并氮杂和苯并硫氮杂衍生物及其药理学上可接受的盐。 （I）其中Z表示CO，-CR 6 R 7 - 或-S（O）n，R表示氢，烷基，苯基烷基或三唑环的保护基，R 1 -R 5表示氢，烷基，烯基，烷氧基 ，氨基，羟基或羟基。 这些化合物具有抗过敏作用，可用于治疗和预防过敏性疾病。

公开(公告)号：US5679433A

公开(公告)日：1997-10-21

申请号：US838559

申请日：1992-02-19

申请人： Kenzo Hayashi ,  Kozo Hayashi ,  Akio Ito ,  Koji Tsuchiya ,  Kyoichi Fujimoto

发明人： Kenzo Hayashi ,  Kozo Hayashi ,  Akio Ito ,  Koji Tsuchiya ,  Kyoichi Fujimoto

IPC分类号： B32B15/04 ,  C04B26/04 ,  D21H13/38 ,  D21H13/40 ,  D21H17/37 ,  D21H17/55 ,  B32B9/00

CPC分类号： C04B26/04 ,  B32B15/04 ,  D21H13/38 ,  D21H13/40 ,  D21H17/375 ,  D21H17/55 ,  C04B2111/00612 ,  C04B2111/27 ,  C04B2111/28 ,  Y10S428/91 ,  Y10S428/92 ,  Y10T428/236 ,  Y10T428/24149 ,  Y10T428/24157 ,  Y10T428/249953 ,  Y10T428/249986 ,  Y10T428/2927 ,  Y10T442/696

摘要： A noncombsutible material is produced by making paper from a slurry essentially consisting of a sepiolite as a main material, an inorganic fiber or a glass fiber as a reinforcer, a first binder composed of PAA (polyacrylamide) as a thermoplastic resin, and a second binder composed of EPA (polyamide-polyamine-epichlorohydrine) as a thermosetting resin. The noncombustible material is given incombustibility and water resistance by the main material of the sepiolite, so that its productivity is improved thereby enabling a paper making of low costs.

摘要翻译： 通过由主要由海泡石作为主要材料的浆料制成纸，作为增强剂的无机纤维或玻璃纤维，作为热塑性树脂的PAA（聚丙烯酰胺）和第二粘合剂组成的第一粘合剂来制造不溶性材料 由EPA（聚酰胺 - 多胺 - 表氯醇）作为热固性树脂组成。 不燃材料由海泡石的主要材料赋予不燃性和耐水性，从而提高其生产率，从而能够实现低成本的造纸。

公开(公告)号：US4521296A

公开(公告)日：1985-06-04

申请号：US393464

申请日：1982-06-29

申请人： Takatoshi Kunihiro ,  Koji Tsuchiya

发明人： Takatoshi Kunihiro ,  Koji Tsuchiya

IPC分类号： C10G45/60 ,  C08L21/00 ,  C10G67/04 ,  C10G67/06 ,  C10G67/14 ,  C10M101/02 ,  C10N40/06

CPC分类号： C10G67/06

摘要： A process for producing a high quality refrigerator oil from an oil fraction boiling at a temperature within boiling point of lubricating oil by contacting said oil fraction with a solvent to extract undesirable components thereby lowering % C.sub.A of said oil fraction, hydrogenating said solvent extracted fraction under the specific conditions, and then contacting said hydrogenated oil with a solid absorbant to remove impurities; said oil fraction being obtained from a low grade naphthenic crude oil.

摘要翻译： 通过使所述油馏分与溶剂接触来提取不需要的组分从而降低所述油馏分的％CA，将所述溶剂萃取馏分进行氢化，从而在从润滑油的沸点温度下沸腾的油馏分中生产高质量的冷冻机油的方法 特定条件，然后使所述氢化油与固体吸收剂接触以除去杂质; 所述油馏分由低级环烷烃原油获得。

公开(公告)号：US20110089548A1

公开(公告)日：2011-04-21

申请号：US12953499

申请日：2010-11-24

申请人： YOSHIHIKO SHIMANUKI ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： YOSHIHIKO SHIMANUKI ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US07843049B2

公开(公告)日：2010-11-30

申请号：US12408890

申请日：2009-03-23

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US20050212116A1

公开(公告)日：2005-09-29

申请号：US11038070

申请日：2005-01-21

申请人： Yoshihiko Shimanuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Koji Tsuchiya

IPC分类号： H01L23/29 ,  H01L21/60 ,  H01L23/14 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/52

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper surface, and side faces which connect the upper and lower surfaces with each other; an electrically conductive tab sealed within the sealing body; tab suspending leads contiguous to the tab and partially exposed to the lower surface and the side faces of the sealing body; a semiconductor chip fixed to a lower surface of the tab; a plurality of electrically conductive leads, the electrically conductive leads each having an inner end portion positioned within the sealing body, an outer end portion exposed to the lower surface and a side face of the sealing body, and a projecting portion projecting into the sealing body from a side face of each of the electrically conductive leads; a projecting portion projecting from a side face of each of the tab suspending leads and positioned within the sealing body; and electrically conductive wires positioned within the sealing body and connecting electrodes formed on a lower surface of the semiconductor chip with the projecting portions of the electrically conductive leads and the tab suspending leads.

摘要翻译： 提供了允许减少引脚数和尺寸的半导体器件。 半导体器件包括由绝缘树脂形成的密封体，密封体具有上表面，与上表面相对的下表面和将上下表面相互连接的侧面; 密封在密封体内的导电片; 突片悬挂引线邻接突片并且部分地暴露于密封体的下表面和侧面; 固定在突片的下表面的半导体芯片; 多个导电引线，所述导电引线各自具有位于所述密封体内的内端部，暴露于所述下表面的外端部和所述密封体的侧面，以及突出部，所述突出部突出到所述密封体 从每个导电引线的侧面; 突出部分，其从每个突片悬挂引线的侧面突出并定位在密封体内; 以及定位在密封体内的导电线和形成在半导体芯片的下表面上的电极与导电引线和突片悬挂引线的突出部分。