-
公开(公告)号：US20100312933A1
公开(公告)日：2010-12-09
申请号：US12847965
申请日：2010-07-30
Applicant: Horng-Yee Chou , Szu-Kuang Chou , Kuang-Yu Wang , I-Kang Yu
Inventor： Horng-Yee Chou , Szu-Kuang Chou , Kuang-Yu Wang , I-Kang Yu
IPC: G06F13/42
CPC classification number: G06F13/385 , G06K19/07732 , G06K19/07733 , H01R13/26 , Y02D10/14 , Y02D10/151
Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.
Abstract translation: 公开了使用各种协议通过安全数字（SD）物理接口进行通信的系统和方法。 本发明尤其涉及单模和多模式主机，单模和多模式装置，以及用于初始化这些主机和装置以便于上述通信的技术。
-
公开(公告)号：US07394661B2
公开(公告)日：2008-07-01
申请号：US10882539
申请日：2004-06-30
Applicant: Kuang-Yu Wang , Charles C. Lee , Horng-Yee Chou
Inventor： Kuang-Yu Wang , Charles C. Lee , Horng-Yee Chou
IPC: H05K5/03
CPC classification number: H05K5/0278 , H01R13/447 , H05K1/181 , H05K1/182 , H05K2201/10189 , H05K2201/10446 , H05K2203/1572
Abstract: The present invention relates to a method and system for providing a flash memory assembly. The flash memory assembly includes a connector and a printed circuit board (PCB) coupled to the connector. The center of the PCB is positioned substantially at the center of the connector. An electronic component is coupled to one side of the PCB. In another aspect of the present invention, a second electronic component is coupled to a second side of the PCB. In another aspect of the present invention, the electronic components and the PCB are protected by covers joined using interference fitting or ultrasonic joining. In another aspect of the present invention, a cap protects the connector. The cap can be removably coupled to the connector.
Abstract translation: 本发明涉及一种用于提供闪存组件的方法和系统。 闪存组件包括连接器和耦合到连接器的印刷电路板（PCB）。 PCB的中心基本上位于连接器的中心。 电子部件耦合到PCB的一侧。 在本发明的另一方面，第二电子部件耦合到PCB的第二侧。 在本发明的另一方面，电子部件和PCB由使用干涉配合或超声波接合连接的盖保护。 在本发明的另一方面，帽保护连接器。 盖可以可拆卸地联接到连接器。
-
公开(公告)号：US07104807B1
公开(公告)日：2006-09-12
申请号：US10888105
申请日：2004-07-09
Applicant: Kuang-Yu Wang , Ren-Kang Chiou , Edward W. Lee
Inventor： Kuang-Yu Wang , Ren-Kang Chiou , Edward W. Lee
CPC classification number: H01R12/57 , H01R12/714 , H01R12/721 , H01R12/87
Abstract: A plug for coupling with an industry-standard EXPRESSCARD™ receptacle is described. The plug includes a plurality of plug-side metal contacts disposed on a bottom substrate. The plurality of plug-side metal contacts is configured to electrically couple with receptacle-side metal contacts in the industry-standard EXPRESSCARD™ receptacle. When the plug is disconnected from the industry-standard EXPRESSCARD™ receptacle, the surfaces of the plurality plug-side metal contacts are exposed by not being covered by a top housing.
Abstract translation: 描述了用于与行业标准EXPRESSCARD（TM）插座连接的插头。 插头包括设置在底部基板上的多个插头侧金属触点。 多个插塞侧金属触点被配置为与工业标准EXPRESSCARD TM插座中的插座侧金属触点电耦合。 当插头与行业标准的EXPRESSCARD TM插座断开连接时，多个插头侧金属触头的表面不被顶部外壳覆盖。
-
公开(公告)号：US07004794B2
公开(公告)日：2006-02-28
申请号：US10917672
申请日：2004-08-13
Applicant: Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou , Edward W. Lee , Tzu-Yih Chu
Inventor： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou , Edward W. Lee , Tzu-Yih Chu
IPC: H01R33/00
CPC classification number: G06K19/07732 , G06K19/07733 , H01R24/62
Abstract: A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.
Abstract translation: 一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。 摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。 在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。 低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。
-
公开(公告)号：US20050197017A1
公开(公告)日：2005-09-08
申请号：US10854004
申请日：2004-05-25
Applicant: Horng-Yee Chou , Szu-Kuang Chou , Kuang-Yu Wang , I-Kang Yu
Inventor： Horng-Yee Chou , Szu-Kuang Chou , Kuang-Yu Wang , I-Kang Yu
CPC classification number: G06F13/385 , G06K19/07732 , G06K19/07733 , H01R13/26 , Y02D10/14 , Y02D10/151
Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.
Abstract translation: 公开了使用各种协议通过安全数字（SD）物理接口进行通信的系统和方法。 本发明尤其涉及单模和多模式主机，单模和多模式装置，以及用于初始化这些主机和装置以便于上述通信的技术。
-
Patent Agency Ranking
公开(公告)号：US07836236B2
公开(公告)日：2010-11-16
申请号：US10854004
申请日：2004-05-25
Applicant: Horng-Yee Chou , Szu-Kuang Chou , Kuang-Yu Wang , I-Kang Yu
Inventor： Horng-Yee Chou , Szu-Kuang Chou , Kuang-Yu Wang , I-Kang Yu
CPC classification number: G06F13/385 , G06K19/07732 , G06K19/07733 , H01R13/26 , Y02D10/14 , Y02D10/151
Abstract: Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.
Abstract translation: 公开了使用各种协议通过安全数字（SD）物理接口进行通信的系统和方法。 本发明尤其涉及单模和多模式主机，单模和多模式装置，以及用于初始化这些主机和装置以便于上述通信的技术。
-
公开(公告)号：US07313921B2
公开(公告)日：2008-01-01
申请号：US10695318
申请日：2003-10-28
Applicant: Jorge Guillermo Milke-Rojo , Kuang-Yu Wang , David Conrad Neumann , Jeffrey Alan Kautzer
CPC classification number: F25B21/04 , F25B2321/0212
Abstract: A temperature regulator provides thermoelectric temperature control in a X-ray detector. The temperature regulator maintains the temperature within the X-ray detector by controlling current through a thermoelectric device. The temperature regulator can both heat and cool the X-ray detector.
Abstract translation: 温度调节器在X射线检测器中提供热电温度控制。 温度调节器通过控制通过热电装置的电流来维持X射线检测器内的温度。 温度调节器可以加热和冷却X射线检测器。
-
8.发明授权Memory module assembly including heat sink attached to integrated circuits by adhesive 有权内存模块组件，包括通过粘合剂连接到集成电路的散热片公开(公告)号：US07215551B2
公开(公告)日：2007-05-08
申请号：US10956893
申请日：2004-09-29
Applicant: Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
Inventor： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
CPC classification number: H01L23/42 , H01L23/3672 , H01L25/105 , H01L2924/0002 , H05K7/20509 , H01L2924/00
Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
Abstract translation: 存储器模块组件包括通过粘合剂连接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的双板散热器。 粘合剂是热活化或热固化的。 将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。 然后将夹具通过烘箱以激活/固化粘合剂。
-
9.发明申请Memory module assembly including heat sink attached to integrated circuits by adhesive 有权内存模块组件，包括通过粘合剂连接到集成电路的散热片公开(公告)号：US20060067054A1
公开(公告)日：2006-03-30
申请号：US10956893
申请日：2004-09-29
Applicant: Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
Inventor： Kuang-Yu Wang , Jim Ni , Ren-Kang Chiou
IPC: H05K7/20
CPC classification number: H01L23/42 , H01L23/3672 , H01L25/105 , H01L2924/0002 , H05K7/20509 , H01L2924/00
Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.
Abstract translation: 存储器模块组件包括通过粘合剂连接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的双板散热器。 粘合剂是热活化或热固化的。 将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。 然后将夹具通过烘箱以激活/固化粘合剂。
-
公开(公告)号：US20050279838A1
公开(公告)日：2005-12-22
申请号：US10871741
申请日：2004-06-18
Applicant: Kuang-Yu Wang , Jim Ni , Sun-Teck See
Inventor： Kuang-Yu Wang , Jim Ni , Sun-Teck See
IPC: G06K19/06 , G06K19/077 , H05K1/11
CPC classification number: G06K19/07732 , G06K19/077 , H05K1/0295 , H05K1/117 , H05K2201/094 , H05K2201/09409 , H05K2201/09954
Abstract: A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.
Abstract translation: 包括与现有13焊盘MMC机械外形尺寸一致的PCB组件的存储卡，以及与SD机械外形尺寸一致的外壳，从而提供单个PCBA和外壳布置，可用于生产MMC和 SD存储卡。 十三个接触垫支持所有MMC和SD接触焊盘图案，但是被修改以便于写保护开关。 壳体包括在多行中的每一行中暴露两个或更多个接触垫的放大窗口（或窗户），从而有助于存储卡可滑动地插入到主机系统的插座中。 对准凹口形成在PCB的侧边缘中，和/或对准销用于使PCBA在壳体内正确对准。
-
-
-
-
-
-
-
-
-
Search Results
30
records
(took 0.018 seconds)
