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    Heat-dissipating member, manufacturing method and installation method
    5.
    发明授权
    Heat-dissipating member, manufacturing method and installation method 失效
    散热构件，制造方法和安装方法

    公开(公告)号：US06940722B2

    公开(公告)日：2005-09-06

    申请号：US10347599

    申请日：2003-01-22

    申请人： Hiroaki Tetsuka ,  Kunihiko Mita ,  Kunihiro Yamada ,  Yoshitaka Aoki ,  Tsutomu Yoneyama

    发明人： Hiroaki Tetsuka ,  Kunihiko Mita ,  Kunihiro Yamada ,  Yoshitaka Aoki ,  Tsutomu Yoneyama

    IPC分类号： H01L23/427 ,  H05K7/20

    CPC分类号： H01L23/427 ,  F28F2013/006 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

    摘要： A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 μm and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 μm. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0.

    摘要翻译： 夹在由于操作而达到比室温高的温度的散热电子部件之间的散热部件，以及用于散发由该散热电子部件产生的热量的散热部件。 本发明的散热构件具有中间层，其包含厚度为1-50μm，导热率为10-500W / mK的金属箔和/或金属网，以及包括含有100 重量份硅树脂和1000-3,000重量份形成在中间层的两个表面上的导热填料，使得总厚度在40-500μm的范围内。 该散热构件在室温下为非流体，但是由于电子部件运转时发出的热量的作用，其粘度降低，并且基于树脂和低熔点金属的相变而软化或熔化，因此 它有效地与电子部件和散热部件之间的边界紧密接触而没有任何间隙。 导热性填料含有熔融温度为40〜250℃，粒径为0.1〜100μm的低熔点金属粉末（1），以及具有熔融温度的导热性粉末（2） 超过250℃，平均粒径为0.1-100μm，使得（1）/ [（1）+（2）] = 0.2-1.0。

    Electroconductive silicone rubber composition and cured silicone rubber article thereof
    7.
    发明授权
    Electroconductive silicone rubber composition and cured silicone rubber article thereof 失效
    电绝缘硅橡胶组合物及其固化硅橡胶制品

    公开(公告)号：US5082596A

    公开(公告)日：1992-01-21

    申请号：US416379

    申请日：1989-10-03

    申请人： Takeshi Fukuda ,  Kunihiko Mita

    发明人： Takeshi Fukuda ,  Kunihiko Mita

    IPC分类号： C08K3/04 ,  C08L83/04 ,  H01B1/24

    CPC分类号： H01B1/24 ,  C08K3/04 ,  C08L83/04 ,  C08G77/20 ,  C08G77/70

    摘要： An electroconductive silicone rubber having a high electroconductivity and retaining the good workability in compounding and molding and excellent properties inherent in silicone rubbers in general can be obtained by compounding a curable organopolysiloxane composition comprising a gum-like diorganopolysiloxane, carbon black as a conductivity-imparting agent and a curing agent with a cured silicone rubber powder of spherical particle configuration having specified particle diameter and specified sphericity which partially replaces the diorganopolysiloxane gum.

    摘要翻译： 通常，通过将包含胶状二有机聚硅氧烷，炭黑的可固化的有机基聚硅氧烷组合物作为导电性赋予剂，可以获得具有高导电性并且在复合和模制中保持良好可加工性和优异的硅橡胶固有性能的导电硅橡胶 以及固化剂，其具有球形颗粒构型的固化的硅橡胶粉末，其具有特定的粒径和特定的球形度，其部分替代二有机聚硅氧烷胶。

    Heat dissipating member
    10.
    发明申请
    Heat dissipating member 有权
    散热构件

    公开(公告)号：US20070023179A1

    公开(公告)日：2007-02-01

    申请号：US11527641

    申请日：2006-09-27

    申请人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

    发明人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

    IPC分类号： H05K7/20

    CPC分类号： C09K5/06 ,  H01L23/3737 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10S165/905 ,  H01L2924/00

    摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

    摘要翻译： 一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体， 电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及 散热构件由包含硅树脂和导热填料的组合物形成。