公开(公告)号：US20050050767A1

公开(公告)日：2005-03-10

申请号：US10859748

申请日：2004-06-03

申请人： Kyle Hanson ,  Kert Dolechek ,  Paul McHugh ,  Gregory Wilson ,  Jeffry Davis ,  Randy Harris

发明人： Kyle Hanson ,  Kert Dolechek ,  Paul McHugh ,  Gregory Wilson ,  Jeffry Davis ,  Randy Harris

IPC分类号： B65G49/07 ,  C12N15/31 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  F26B5/04 ,  H01L20060101

CPC分类号： C25D17/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/008 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196

摘要： A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.

摘要翻译： 一种湿化学处理室，包括固定单元，可释放地联接到固定单元的可拆卸单元，接触固定单元和可拆卸单元的密封件，以及设置在固定单元和/或可拆卸单元中的处理部件。 固定单元可以具有构造成引导处理流体通过固定单元的第一流动系统和用于将固定单元固定地附接到集成处理工具的平台或甲板的安装夹具。 可拆卸单元可以包括构造成将处理流体引导到和/或从固定单元的第一流动系统引导的第二流动系统。 密封件具有孔口，处理流体可以通过该孔口在第一和第二流动系统之间流动，并且处理部件可以赋予处理流体以处理具有亚微米特征的微特征工件上的表面的性质。

公开(公告)号：US20050034977A1

公开(公告)日：2005-02-17

申请号：US10859749

申请日：2004-06-03

申请人： Kyle Hanson ,  Kert Dolechek ,  Paul McHugh ,  Gregory Wilson

发明人： Kyle Hanson ,  Kert Dolechek ,  Paul McHugh ,  Gregory Wilson

IPC分类号： B01D63/00 ,  C23F1/00 ,  C25D17/00 ,  G01M3/04

CPC分类号： H01L21/6723 ,  B01D61/425 ,  C25D17/00 ,  H01L21/67005 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/68707

摘要： An electrochemical deposition chamber comprises a head assembly and a vessel under the head assembly. The head assembly includes a workpiece holder configured to position a microfeature workpiece at a processing location and electrical contacts arranged to provide electrical current to a layer on the workpiece. The vessel has a fixed unit including a mounting fixture to attach the fixed unit to a deck of a tool, a detachable unit releasably attachable to the fixed unit below the mounting fixture to be positioned below the deck of the tool, an interface element between the fixed unit and the detachable unit to control processing fluid between the fixed unit and the detachable unit, and an attachment system releasably coupling the detachable unit to the fixed unit. The electrochemical deposition chamber also includes an electrode in the detachable unit.

摘要翻译： 电化学沉积室包括头组件和头组件下的容器。 头部组件包括工件保持器，该工件保持器构造成将微特征工件定位在处理位置处，并且布置成向工件上的层提供电流的电触点。 容器具有固定单元，其包括将固定单元附接到工具的甲板上的安装固定装置，可拆卸的单元，其可释放地附接到安装夹具下方的固定单元以定位在工具的甲板下方， 固定单元和可拆卸单元，用于控制固定单元和可拆卸单元之间的处理流体;以及附接系统，其将可拆卸单元可释放地联接到固定单元。 电化学沉积室还包括可拆卸单元中的电极。

公开(公告)号：US20080217167A9

公开(公告)日：2008-09-11

申请号：US11096630

申请日：2005-03-29

申请人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

IPC分类号： C25C7/00

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67103 ,  H01L21/6723

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

摘要翻译： 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及 所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。

公开(公告)号：US20080217166A9

公开(公告)日：2008-09-11

申请号：US11096495

申请日：2005-03-29

申请人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

IPC分类号： C25C7/00

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67103 ,  H01L21/6723

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

公开(公告)号：US20070261964A1

公开(公告)日：2007-11-15

申请号：US11432164

申请日：2006-05-10

申请人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson ,  Rajesh Baskaran

发明人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson ,  Rajesh Baskaran

IPC分类号： C25D5/20 ,  C25B9/00

CPC分类号： C25D5/08 ,  C25D17/002

摘要： Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber. More specifically, the ion exchange membrane prevents nascent oxygen that evolves from the inert counter electrode from reaching the catholyte to reduce oxidation of constituents of the catholyte, consumption of organic additives in the anolyte, and/or accumulation of bubbles and particulates at the workpiece.

摘要翻译： 用于电镀和/或电蚀蚀微型工件的反应器，系统和方法。 根据本发明的反应器具有被配置为将第一处理溶液引导到处理区的第一室，被配置为容纳不同于第一处理溶液的第二处理溶液的第二室以及第一室与第一室之间的离子交换膜 第二室。 反应器还包括（a）在第一室中的与膜的表面接触离子交换膜的支撑构件，和（b）第二室中的对电极。 离子交换膜使得能够在第一室中使用低导电性阴极电解液，并且在第二室中使用惰性对电极。 更具体地，离子交换膜防止从惰性对电极逸出的新生氧气到达阴极电解液，以减少阴极电解液的组分的氧化，阳极电解液中的有机添加剂的消耗和/或工件上的气泡和微粒的积聚。

公开(公告)号：US20050205419A1

公开(公告)日：2005-09-22

申请号：US11096495

申请日：2005-03-29

申请人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

IPC分类号： C25D7/12 ,  C10B1/00 ,  C25C7/00 ,  C25D3/00 ,  C25D5/00 ,  C25D17/00 ,  C25D21/00 ,  H01L21/00

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67103 ,  H01L21/6723

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

公开(公告)号：US20050109633A1

公开(公告)日：2005-05-26

申请号：US10975202

申请日：2004-10-28

申请人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson

发明人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson

IPC分类号： C25D7/12 ,  B05C3/00 ,  B05C3/20 ,  B23H3/00 ,  C02F20060101 ,  C25B9/00 ,  C25C7/00 ,  C25D3/02 ,  C25D5/00 ,  C25D5/04 ,  C25D5/08 ,  C25D7/00 ,  C25D11/32 ,  C25D17/00 ,  C25D17/02 ,  C25D17/12 ,  C25D21/00

CPC分类号： C25D17/02 ,  C25D5/08 ,  C25D17/001 ,  Y10S204/07

摘要： A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container having a plurality of nozzles angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at difference distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also related to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.

公开(公告)号：US20050061676A1

公开(公告)日：2005-03-24

申请号：US10975857

申请日：2004-10-28

申请人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson

发明人： Gregory Wilson ,  Paul McHugh ,  Kyle Hanson

IPC分类号： C25B9/00 ,  C25C7/00 ,  C25D5/00 ,  C25D5/08 ,  C25D7/12 ,  C25F7/00

CPC分类号： C25D5/08 ,  C25D11/005 ,  C25D17/001 ,  C25D17/008 ,  C25D17/12 ,  C25F7/00

摘要： A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container having a plurality of nozzles angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at difference distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also related to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.

公开(公告)号：US20050194248A1

公开(公告)日：2005-09-08

申请号：US11096630

申请日：2005-03-29

申请人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

IPC分类号： C25D7/12 ,  C10B1/00 ,  C25C7/00 ,  C25D3/00 ,  C25D5/00 ,  C25D17/00 ,  C25D21/00 ,  H01L21/00

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67103 ,  H01L21/6723

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

公开(公告)号：US20050189215A1

公开(公告)日：2005-09-01

申请号：US11096477

申请日：2005-03-29

申请人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Thomas Ritzdorf ,  Gregory Wilson ,  Paul McHugh

IPC分类号： C10B1/00 ,  C25C7/00

CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/10

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.