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    Side-view light emitting diode having protective device
    1.
    发明授权
    Side-view light emitting diode having protective device 有权
    具有保护装置的侧视发光二极管

    公开(公告)号：US07462871B2

    公开(公告)日：2008-12-09

    申请号：US11497232

    申请日：2006-08-02

    申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

    发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

    IPC分类号： H01L27/15

    CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S257/918 ,  H01L2924/00014

    摘要： In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

    摘要翻译： 在侧视图LED中，细长的第一和第二引线框架各自具有从其延伸的指状物。 第一引线框架的指状物与第二引线框架的手指平行设置。 LED芯片和保护装置分别安装在第一和第二引线框架的安装区域上，并且电连接到第一引线框架和第二引线框架。 包装体容纳第一和第二引线框架以形成第一和第二开放区域。 第一开放区域围绕LED芯片外部打开，第二开放区域在保护装置周围被外部打开，并且间隔壁形成在其间。 第一和第二密封剂分别提供给第一和第二开放区域以分别封装LED芯片和保护装置。 至少第一密封剂是透明的。

    Light emitting diode package having dual lens structure for lateral light emission
    4.
    发明授权
    Light emitting diode package having dual lens structure for lateral light emission 有权
    具有用于横向发光的双透镜结构的发光二极管封装

    公开(公告)号：US07458703B2

    公开(公告)日：2008-12-02

    申请号：US11488067

    申请日：2006-07-18

    申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Seong Yeon Han ,  Hun Joo Hahm ,  Chang Ho Song

    发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Seong Yeon Han ,  Hun Joo Hahm ,  Chang Ho Song

    IPC分类号： F21V7/00

    CPC分类号： H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.

    摘要翻译： 具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。 下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。 上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。 漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。 上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

    High power light emitting diode package
    5.
    再颁专利
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：USRE44811E1

    公开(公告)日：2014-03-18

    申请号：US13330239

    申请日：2011-12-19

    申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    IPC分类号： H01L21/00

    CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

    High power light emitting diode package
    7.
    发明授权
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：US07208772B2

    公开(公告)日：2007-04-24

    申请号：US11186971

    申请日：2005-07-22

    申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    IPC分类号： H01L29/22 ,  H01L23/48

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2224/0401

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

    High power light emitting diode package
    9.
    再颁专利
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：USRE43200E1

    公开(公告)日：2012-02-21

    申请号：US12029220

    申请日：2008-02-11

    申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L23/48

    CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在其凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并具有用于传送的传热部分 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

    LED housing and fabrication method thereof
    10.
    发明授权
    LED housing and fabrication method thereof 有权
    LED外壳及其制造方法

    公开(公告)号：US07678592B2

    公开(公告)日：2010-03-16

    申请号：US11680847

    申请日：2007-03-01

    申请人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

    发明人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

    摘要翻译： 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。