公开(公告)号：US20180174804A1

公开(公告)日：2018-06-21

申请号：US15895367

申请日：2018-02-13

Applicant: LAM RESEARCH CORPORATION

Inventor： Darrell EHRLICH ,  Daniel Arthur Brown ,  Ian Kenworthy

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32541 ,  C23C16/4557 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32522 ,  H01L21/3065 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49098 ,  Y10T29/49117 ,  Y10T29/49803

Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.

公开(公告)号：US09689533B2

公开(公告)日：2017-06-27

申请号：US14472713

申请日：2014-08-29

Applicant: Lam Research Corporation

Inventor： Ian Kenworthy ,  Duane Outka ,  Fangli Hao ,  Leonard Sharpless ,  Yijun Du

IPC: F17D5/00 ,  B05D7/22 ,  B05D1/30 ,  F17D1/04 ,  H01J37/32 ,  H01L21/67

CPC classification number: F17D5/005 ,  B05D1/30 ,  B05D7/222 ,  F17D1/04 ,  H01J37/3244 ,  H01J37/32495 ,  H01J2237/3341 ,  H01L21/67069 ,  Y10T137/8593

Abstract: A gas delivery system for a plasma process system such as a plasma etching system wherein inner surfaces of gas passages are coated with a corrosion-resistant material coating formed by curing a layer of fluidic precursor deposited on the inner surfaces. The coating can be formed by (a) flowing a fluidic precursor of a corrosion-resistant material through the gas passages and depositing a layer of the fluidic precursor to completely coat the inner surfaces of the gas passages; (b) removing excess fluidic precursor from the inner surfaces; (c) curing the deposited layer of the fluidic precursor to form a corrosion-resistant material coating.

公开(公告)号：US20190371579A1

公开(公告)日：2019-12-05

申请号：US16538637

申请日：2019-08-12

Applicant: Lam Research Corporation

Inventor： Daniel Arthur Brown ,  John Patrick Holland ,  Michael C. Kellogg ,  James E. Tappan ,  Jerrel K. Antolik ,  Ian Kenworthy ,  Theo Panagopoulos ,  Zhigang Chen

IPC: H01J37/32

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

公开(公告)号：US20180323044A1

公开(公告)日：2018-11-08

申请号：US16039229

申请日：2018-07-18

Applicant: Lam Research Corporation

Inventor： Daniel Arthur Brown ,  John Patrick Holland ,  Michael C. Kellogg ,  James E. Tappan ,  Jerrel K. Antolik ,  Ian Kenworthy ,  Theo Panagopoulos ,  Zhigang Chen

IPC: H01J37/32

CPC classification number: H01J37/32816 ,  H01J37/32082 ,  H01J37/32183 ,  H01J37/32651 ,  H01J37/32724

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

公开(公告)号：US20150243487A1

公开(公告)日：2015-08-27

申请号：US14710100

申请日：2015-05-12

Applicant: Lam Research Corporation

Inventor： Darrell Ehrlich ,  Daniel Arthur Brown ,  Ian Kenworthy

IPC: H01J37/32 ,  H01L21/3065

CPC classification number: H01J37/32541 ,  C23C16/4557 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32522 ,  H01L21/3065 ,  Y10T29/49002 ,  Y10T29/49083 ,  Y10T29/49098 ,  Y10T29/49117 ,  Y10T29/49803

Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.

Abstract translation: 一种用于电容耦合等离子体室的喷头电极组件中的压缩构件。 该构件对与热控制板的上表面相邻的电源罩的薄膜加热器的一部分施加压缩力，并且位于热控制板和温度控制的顶板之间。 该构件由电绝缘的弹性体材料组成，其可在大范围的压缩和温度下工作。

公开(公告)号：US10985078B2

公开(公告)日：2021-04-20

申请号：US14934624

申请日：2015-11-06

Applicant: Lam Research Corporation

Inventor： Ian Kenworthy

IPC: H01L21/66 ,  H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  G05B15/02 ,  H01L21/3065 ,  H01J37/32

Abstract: An apparatus for use in a processing chamber is provided. A consumable is within the processing chamber. A scale is positioned to measure a mass of the consumable.

公开(公告)号：US10332729B2

公开(公告)日：2019-06-25

申请号：US15895367

申请日：2018-02-13

Applicant: LAM RESEARCH CORPORATION

Inventor： Darrell Ehrlich ,  Daniel Arthur Brown ,  Ian Kenworthy

IPC: H01J37/32 ,  H01L21/3065 ,  C23C16/455

Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.

公开(公告)号：US10049862B2

公开(公告)日：2018-08-14

申请号：US15068508

申请日：2016-03-11

Applicant: Lam Research Corporation

Inventor： Daniel Arthur Brown ,  John Patrick Holland ,  Michael C. Kellogg ,  James E. Tappan ,  Jerrel K. Antolik ,  Ian Kenworthy ,  Theo Panagopoulos ,  Zhigang Chen

IPC: H01J37/32

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

公开(公告)号：US20160307743A1

公开(公告)日：2016-10-20

申请号：US15068508

申请日：2016-03-11

Applicant: Lam Research Corporation

Inventor： Daniel Arthur Brown ,  John Patrick Holland ,  Michael C. Kellogg ,  James E. Tappan ,  Jerrel K. Antolik ,  Ian Kenworthy ,  Theo Panagopoulos ,  Zhigang Chen

IPC: H01J37/32

CPC classification number: H01J37/32816 ,  H01J37/32082 ,  H01J37/32183 ,  H01J37/32651 ,  H01J37/32724

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

Abstract translation: 提供等离子体室以增加等离子体室内的电导并增加电导的均匀性。 用于向等离子体室供电的射频（RF）路径相对于等离子体室的中心轴对称。 此外，用于从等离子体室移除材料的泵相对于中心轴线对称。 RF路径和泵的对称布置有助于提高等离子体室内的电导均匀性。

公开(公告)号：US20140366968A1

公开(公告)日：2014-12-18

申请号：US14472713

申请日：2014-08-29

Applicant: Lam Research Corporation

Inventor： Ian Kenworthy ,  Duane Outka ,  Fangli Hao ,  Leonard Sharpless ,  Yijun Du

IPC: F17D5/00 ,  H01L21/67 ,  H01J37/32 ,  B05D1/30 ,  F17D1/04

CPC classification number: F17D5/005 ,  B05D1/30 ,  B05D7/222 ,  F17D1/04 ,  H01J37/3244 ,  H01J37/32495 ,  H01J2237/3341 ,  H01L21/67069 ,  Y10T137/8593

Abstract: A gas delivery system for a plasma process system such as a plasma etching system wherein inner surfaces of gas passages are coated with a corrosion-resistant material coating formed by curing a layer of fluidic precursor deposited on the inner surfaces. The coating can be formed by (a) flowing a fluidic precursor of a corrosion-resistant material through the gas passages and depositing a layer of the fluidic precursor to completely coat the inner surfaces of the gas passages; (b) removing excess fluidic precursor from the inner surfaces; (c) curing the deposited layer of the fluidic precursor to form a corrosion-resistant material coating.

Abstract translation: 一种用于等离子体处理系统的气体输送系统，例如等离子体蚀刻系统，其中气体通道的内表面涂覆有通过固化沉积在内表面上的流体前体层形成的耐腐蚀材料涂层。 涂层可以通过以下方法形成：（a）使耐腐蚀材料的流体前体流过气体通道并沉积一层流体前体以完全涂覆气体通道的内表面; （b）从内表面除去多余的流体前体; （c）固化流体前体的沉积层以形成耐腐蚀材料涂层。