Imaging device
    2.
    发明授权

    公开(公告)号:US10061200B2

    公开(公告)日:2018-08-28

    申请号:US15363129

    申请日:2016-11-29

    IPC分类号: B41J2/385 G03F7/20

    摘要: An imaging device for projecting individually controllable laser beams onto an imaging surface movable in an X-direction. The device includes a plurality of semiconductor chips each comprising a plurality of laser beam emitting elements arranged in a main array of M·N. The chips are mounted such that each pair of adjacent chips in the Y-direction are offset from one another in the X-direction and, if activated continuously, the emitted laser beams of the two chips of said pair trace on the imaging surface a set of parallel lines that are substantially uniformly spaced in the Y-direction. In addition to the M·N elements of the main array, each chip comprises at least one additional column on one or each side, each additional column containing at least one selectively operable element capable of compensating for any misalignment in the Y-direction in the relative positioning of the adjacent chips on the support.

    Imaging device
    4.
    发明授权

    公开(公告)号:US10591822B2

    公开(公告)日:2020-03-17

    申请号:US16046973

    申请日:2018-07-26

    摘要: An imaging device for projecting individually controllable laser beams onto an imaging surface movable in an X-direction. The device includes a plurality of semiconductor chips each comprising a plurality of laser beam emitting elements arranged in a main array of M·N. The chips are mounted such that each pair of adjacent chips in the Y-direction are offset from one another in the X-direction and, if activated continuously, the emitted laser beams of the two chips of said pair trace on the imaging surface a set of parallel lines that are substantially uniformly spaced in the Y-direction. In addition to the M·N elements of the main array, each chip comprises at least one additional column on one or each side, each additional column containing at least one selectively operable element capable of compensating for any misalignment in the Y-direction in the relative positioning of the adjacent chips on the support.

    Thermal transfer printing
    6.
    发明授权

    公开(公告)号:US10913835B2

    公开(公告)日:2021-02-09

    申请号:US16464782

    申请日:2016-11-30

    摘要: A method and apparatus for thermal transfer printing onto selected regions of a substrate are disclosed. The method comprises: a) providing a transfer member having an imaging surface; b) coating the imaging surface with particles formed of, or coated with, a thermoplastic polymer; c) removing substantially all particles that are not in direct contact with the imaging surface to leave a uniform monolayer particle coating on the imaging surface; d) applying energy to selected regions of the imaging surface to heat and render tacky particles of corresponding regions of the monolayer coating; and e) pressing at least portions of the imaging surface and the substrate surface against one another, either during and/or after application of energy, to cause transfer to the surface of the substrate of the particles of the corresponding regions that have been rendered tacky. The monolayer coating can be replenished with new particles and the cycle repeated.