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    PLASMA SHIELD DEVICE AND PLASMA SOURCE APPARATUS
    1.
    发明申请
    PLASMA SHIELD DEVICE AND PLASMA SOURCE APPARATUS 审中-公开
    等离子体屏蔽装置和等离子体源装置

    公开(公告)号：US20130234597A1

    公开(公告)日：2013-09-12

    申请号：US13788005

    申请日：2013-03-07

    申请人： LASERTEC CORPORATION

    发明人： Haruhiko KUSUNOSE ,  Kiwamu TAKEHISA ,  Tomohiro SUZUKI ,  Hiroki MIYAI

    IPC分类号： H01J1/52 ,  H05H1/24

    CPC分类号： H01J1/52 ,  G03F7/70033 ,  G03F7/70916 ,  H05G2/003 ,  H05G2/005 ,  H05H1/24

    摘要： The plasma shield device (13) comprises a hollow structure (40) made of monocrystal body of silicon carbide and having an inside space (40a) and a first and second openings (40b,40c) which are opposed to each other across the inside space. During operation of the plasma generation apparatus, the internal space of the hollow structure forms a discharge zone in which the plasma is generated. Discharge gas is supplied to the internal space of the hollow structure through the first opening and the EUV radiation is mainly emitted through the second opening.

    摘要翻译： 等离子体屏蔽装置（13）包括由碳化硅单晶体制成的具有内部空间（40a）和第一和第二开口（40b，40c）的中空结构（40），所述内部空间（40a）和第二开口（40b，40c） 。 在等离子体产生装置的操作期间，中空结构的内部空间形成其中产生等离子体的放电区。 排出气体通过第一开口供应到中空结构的内部空间，并且EUV辐射主要通过第二开口排出。

    IMAGE PICKUP APPARATUS AND FOCUS ADJUSTMENT METHOD
    2.
    发明申请
    IMAGE PICKUP APPARATUS AND FOCUS ADJUSTMENT METHOD 有权

    公开(公告)号：US20210018832A1

    公开(公告)日：2021-01-21

    申请号：US16931208

    申请日：2020-07-16

    申请人： Lasertec Corporation

    发明人： Hiroki MIYAI ,  Yoshito FUJIWARA ,  Yoshihiro KATO

    IPC分类号： G03F1/84 ,  G03F1/24 ,  G03F1/44 ,  G03F1/66 ,  G03F1/76

    摘要： An image pickup apparatus includes a stage configured to support a sample at a plurality of support points, a bending data acquisition unit configured to acquire bending data corresponding to a bending of the sample supported on the stage, a height information detection unit configured to detect a height of the sample supported on the stage, a difference value calculation unit configured to calculate a difference value between a height indicated by height information and a height indicated by the bending data at each of a plurality of points on the sample, a correction data calculation unit configured to calculate correction data based on the difference value, and an estimation unit configured to calculate estimation data for estimating the height of the sample by correcting the bending data using the correction data.

    INSPECTION DEVICE AND INSPECTION METHOD
    5.
    发明申请
    INSPECTION DEVICE AND INSPECTION METHOD 有权

    公开(公告)号：US20210247323A1

    公开(公告)日：2021-08-12

    申请号：US17168053

    申请日：2021-02-04

    申请人： Lasertec Corporation

    发明人： Kiwamu TAKEHISA ,  Tsunehito KOHYAMA ,  Hiroki MIYAI ,  Haruhiko KUSUNOSE

    IPC分类号： G01N21/88 ,  G02B5/10 ,  G02B17/08 ,  G01N21/956

    摘要： An inspection device according to the present disclosure includes a spheroidal mirror configured to reflect illumination light as convergent light, a plane mirror configured to reflect the illumination light incident as the convergent light and cause the reflected illumination light to be incident on an object of inspection as incident light, a projection optical system configured to focus reflected light of the incident light reflected by the object of inspection, and a detector configured to detect reflected light focused by the projection optical system, wherein an angle of incidence of an incident optical axis being an optical axis of the incident light on the object of inspection is greater than 6 [deg], an angle of reflection of a reflected optical axis being an optical axis of the reflected light on the object of inspection is greater than 6 [deg].

    DEFECT COORDINATES MEASUREMENT DEVICE, DEFECT COORDINATES MEASUREMENT METHOD, MASK MANUFACTURING METHOD, AND REFERENCE MASK
    6.
    发明申请
    DEFECT COORDINATES MEASUREMENT DEVICE, DEFECT COORDINATES MEASUREMENT METHOD, MASK MANUFACTURING METHOD, AND REFERENCE MASK 有权
    缺陷坐标测量装置，缺陷坐标测量方法，掩模制造方法和参考掩模

    公开(公告)号：US20130245971A1

    公开(公告)日：2013-09-19

    申请号：US13791537

    申请日：2013-03-08

    申请人： LASERTEC CORPORATION

    发明人： Haruhiko KUSUNOSE ,  Hiroki MIYAI

    IPC分类号： G01R31/26

    CPC分类号： G01R31/26 ,  G03F1/24 ,  G03F1/84 ,  G03F7/70483 ,  G03F7/7065 ,  G03F7/7085

    摘要： A defect coordinates measurement method includes a step of detecting detected coordinates of a fiducial mark and a defect of a mask blank placed on support pins, a step of detecting detected coordinates of the alignment mark of a reference mask placed on the support pins, a step of extracting a reference mark near the detected coordinates of the defect among the plurality of reference marks based on the detected coordinates of the defect of the mask blank and the alignment mark of the reference mask, a step of detecting detected coordinates of the extracted reference mark, and a step of calculating coordinates of the defect based on the detected coordinates of the reference mark and the detected coordinates of the defect.

    摘要翻译： 缺陷坐标测量方法包括检测检测到的基准标记的坐标和放置在支撑销上的掩模毛坯的缺陷的步骤，检测放置在支撑销上的参考掩模的对准标记的检测坐标的步骤，步骤 基于检测到的掩模坯料的缺陷坐标和参考掩模的对准标记，在多个参考标记中检测到的缺陷坐标附近提取参考标记;检测所提取的参考标记的检测坐标的步骤 以及基于检测到的参考标记的坐标和检测到的缺陷的坐标来计算缺陷的坐标的步骤。