公开(公告)号：US09601451B2

公开(公告)日：2017-03-21

申请号：US14823021

申请日：2015-08-11

Applicant: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.

Inventor： Joseph Kuczynski ,  Melissa K. Miller ,  Heidi D. Williams ,  Jing Zhang

IPC: H01L23/48 ,  H01L23/00 ,  B23K1/00 ,  H05K3/34 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L24/17 ,  B23K1/0016 ,  B23K3/0623 ,  H01L23/3142 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16227 ,  H01L2224/81007 ,  H01L2224/81815 ,  H01L2924/06 ,  H01L2924/14 ,  H01L2924/1531 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613

Abstract: Example methods, apparatus, and products for creating an environmentally protective coating for integrated circuit assemblies are described herein. A preform plastic sheet is places over components of an integrated circuit such that during a reflow process, the preform plastic sheet melts to form a conformal coating over components of the integrated circuit assembly.