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    LIGHT-EMITTING DIODE DEVICE
    1.
    发明申请
    LIGHT-EMITTING DIODE DEVICE 审中-公开
    发光二极管装置

    公开(公告)号：US20160365493A1

    公开(公告)日：2016-12-15

    申请号：US15054065

    申请日：2016-02-25

    Applicant: LEXTAR ELECTRONICS CORPORATION

    Inventor： Hsin-Lun SU ,  Chih-Hao LIN ,  Fang-Chang HSUEH ,  Tzong-Liang TSAI ,  Yi-Jyun CHEN

    IPC: H01L33/56

    CPC classification number: H01L33/486 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012

    Abstract: A light-emitting diode device includes a shell with a recess, wherein the shell does not contain metal oxide. A plurality of lead frames extends from the bottom of the recess to the outside of the shell. At least an UV light-emitting diode (LED) chip is disposed on the bottom of the recess and is electrically connected to the lead frames, wherein the UV LED chip has a wavelength range of 200 nm-400 nm. In addition, an encapsulation adhesive fills the recess to cover the UV LED chip.

    Abstract translation: 发光二极管装置包括具有凹部的外壳，其中外壳不含有金属氧化物。 多个引线框架从凹部的底部延伸到外壳的外部。 至少一个UV发光二极管（LED）芯片设置在凹槽的底部并且电连接到引线框架，其中UV LED芯片具有200nm-400nm的波长范围。 此外，封装粘合剂填充凹部以覆盖UV LED芯片。

    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
    2.
    发明申请
    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL 审中-公开

    公开(公告)号：US20200067009A1

    公开(公告)日：2020-02-27

    申请号：US16232041

    申请日：2018-12-25

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
    4.
    发明申请
    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL 有权

    公开(公告)号：US20220271251A1

    公开(公告)日：2022-08-25

    申请号：US17663431

    申请日：2022-05-15

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    PIXEL UNIT AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    PIXEL UNIT AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20230074731A1

    公开(公告)日：2023-03-09

    申请号：US17929714

    申请日：2022-09-05

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Hsin-Lun SU ,  Min-Che TSAI ,  Jo-Hsiang CHEN

    IPC: H01L25/075 ,  H01L33/52 ,  H01L33/62

    Abstract: A pixel unit includes a substrate, a wiring layer and three light-emitting elements. The wiring layer includes first electrode wires and second electrode wires. The first electrode wires and the second electrode wires are arranged side by side and separated from each other by a spacing. A first blocking wall structure is at a first end portion of each of the first electrode wires, the first end portion is near the corresponding second electrode wires, and a second blocking wall structure is at a second end portion of each of the second electrode wires, the second end portion is near the corresponding first electrode wires. Three light-emitting elements emit red light, green light and blue light respectively. The light-emitting elements are in a flip chip configuration and are connected to one of the first electrode wires and one of the second electrode wires adjacent to each other respectively.

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