公开(公告)号：US20140197446A1

公开(公告)日：2014-07-17

申请号：US14156583

申请日：2014-01-16

Applicant: Lextar Electronics Corporation

Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Hsiu-Hsiang Lin

IPC: B29C45/27 ,  H01L33/48 ,  B29C45/02

CPC classification number: B29C45/02 ,  B29C45/14655 ,  B29K2101/10 ,  B29L2031/3406 ,  H01L33/00 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.

Abstract translation: LED安装基板包括引线框架，基座和注塑材料的残留物。 基座放置在引线框架上，并且包括腔体。 空腔的底部包括用于暴露引线框架的部分的开口。 空腔的横截面积沿着从引线框架到基座顶面的方向增加。 注塑材料的残留物保留在围绕空腔的基体的外壁之一上。 注射成型材料残留物的横截面积从引线框架到底座顶面的方向减小。

公开(公告)号：US20160082631A1

公开(公告)日：2016-03-24

申请号：US14956490

申请日：2015-12-02

Applicant: Lextar Electronics Corporation

Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Hsiu-Hsiang Lin

IPC: B29C45/02 ,  H01L33/00 ,  B29C45/14

CPC classification number: B29C45/02 ,  B29C45/14655 ,  B29K2101/10 ,  B29L2031/3406 ,  H01L33/00 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.

Abstract translation: 用于制造LED安装基板的模具包括第一模塑模具和第二模塑模具。第二模塑模具覆盖第一模塑模具。 第二成型模具包括材料容纳槽，按压部和材料入口通道。 按压部分在材料容纳槽上突出。 按压部沿着从第一成型模具向第二成型模具的方向扩展。 材料入口通道连接在第二模具的外壁和材料容纳槽之间。 材料入口通道沿着从第一模塑模具到第二模塑模具的方向收缩。

公开(公告)号：US09238317B2

公开(公告)日：2016-01-19

申请号：US14156583

申请日：2014-01-16

Applicant: Lextar Electronics Corporation

Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Hsiu-Hsiang Lin

IPC: B29C45/02 ,  H01L33/48 ,  H01L33/62 ,  B29C45/14 ,  H01L33/60

CPC classification number: B29C45/02 ,  B29C45/14655 ,  B29K2101/10 ,  B29L2031/3406 ,  H01L33/00 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.

Abstract translation: LED安装基板包括引线框架，基座和注塑材料的残留物。 基座放置在引线框架上，并且包括腔体。 空腔的底部包括用于暴露引线框架的部分的开口。 空腔的横截面积沿着从引线框架到基座顶面的方向增加。 注塑材料的残留物保留在围绕空腔的基体的外壁之一上。 注射成型材料残留物的横截面积从引线框架到底座顶面的方向减小。

公开(公告)号：US20130277706A1

公开(公告)日：2013-10-24

申请号：US13854163

申请日：2013-04-01

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Chun-Wei Wang

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package structure of a light emitting device is disclosed. The package structure includes a light emitting device, a leadframe and a cup structure. The leadframe is used for supporting the light emitting device. The leadframe has a top surface, a bottom surface and a side surface located between the top surface and the bottom surface. The side surface has a dimension in the thickness direction of the leadframe. The cup structure made of thermosetting resin is disposed on the leadframe. A sidewall of the cup structure covers the side surface of the leadframe, and has a connecting profile length in the thickness direction with respect to the side surface. The connecting profile length is larger than the dimension of the side surface in the thickness direction.

Abstract translation: 公开了一种发光器件的封装结构。 封装结构包括发光器件，引线框和杯结构。 引线框用于支撑发光器件。 引线框架具有顶表面，底表面和位于顶表面和底表面之间的侧表面。 侧面在引线框的厚度方向上具有尺寸。 由热固性树脂制成的杯结构设置在引线框架上。 杯结构的侧壁覆盖引线框架的侧表面，并且在相对于侧表面的厚度方向上具有连接轮廓长度。 连接轮廓长度大于侧面在厚度方向上的尺寸。