ENCAPSULATION FILM
    4.
    发明申请
    ENCAPSULATION FILM 审中-公开

    公开(公告)号:US20200381664A1

    公开(公告)日:2020-12-03

    申请号:US16954897

    申请日:2018-12-18

    申请人: LG CHEM, LTD.

    摘要: The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.