公开(公告)号：US09870970B2

公开(公告)日：2018-01-16

申请号：US15035903

申请日：2015-01-28

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Jae Ho Jung ,  Bum Gyu Choi ,  Min Kyoun Kim

IPC: C08G77/12 ,  H01L23/29 ,  C08G77/20 ,  C09J183/04 ,  C08G77/00 ,  C08G77/08 ,  H01L33/56 ,  C08G77/38 ,  C08L83/04 ,  C08K5/5435 ,  C08L83/06 ,  C08K5/5419 ,  C08G77/14

CPC classification number: H01L23/296 ,  C08G77/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/38 ,  C08G77/48 ,  C08G77/80 ,  C08G2170/00 ,  C08G2190/00 ,  C08K5/5419 ,  C08K5/5435 ,  C08K5/56 ,  C08K2201/008 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/206 ,  C08L2205/025 ,  C09J183/04 ,  C09J2203/318 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/005

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

公开(公告)号：US09598542B2

公开(公告)日：2017-03-21

申请号：US14133403

申请日：2013-12-18

Applicant: LG CHEM, LTD.

Inventor： Bum Gyu Choi ,  Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/04 ,  C08L83/04 ,  H01L33/56 ,  H01L23/29 ,  C08L83/06 ,  C08K5/00 ,  C08G77/12 ,  C08G77/20 ,  H01L33/50 ,  C08K5/5425 ,  C08K5/54 ,  C08G77/14

CPC classification number: C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K5/0025 ,  C08K5/54 ,  C08K5/5425 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  H01L23/296 ,  H01L33/501 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

公开(公告)号：US09410018B2

公开(公告)日：2016-08-09

申请号：US14142067

申请日：2013-12-27

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim

IPC: C08G77/12 ,  H01L33/56 ,  C08K5/5419 ,  C08K5/5425 ,  C08L83/04 ,  H01L23/29 ,  C08G77/20 ,  C08G77/00

CPC classification number: C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/5419 ,  C08K5/5425 ,  C08L83/04 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  C08L83/00 ,  H01L2924/00

Abstract: The present application relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.

Abstract translation: 本申请涉及可固化组合物。 可以提供可固化组合物; 显示出优异的加工性和可加工性; 显示出优异的光提取效率，抗裂性，硬度，耐热冲击性和固化后的粘合强度; 并且在高温和/或高湿度条件下具有优异的可靠性和长期的可靠性。 此外，可以防止在固化产物中的浊度和表面粘性。

公开(公告)号：US20210269689A1

公开(公告)日：2021-09-02

申请号：US17262524

申请日：2019-07-25

Applicant: LG Chem, Ltd.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC: C09J175/16

Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range.

公开(公告)号：US10090219B2

公开(公告)日：2018-10-02

申请号：US15104030

申请日：2015-01-28

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Jae Ho Jung ,  Bum Gyu Choi ,  Min Kyoun Kim

IPC: H01L23/29 ,  C08L83/06 ,  C08G77/48 ,  C08G77/12 ,  C08G77/20 ,  C09J183/04 ,  C08G77/00 ,  C08G77/08 ,  H01L33/56 ,  C08G77/38 ,  C08L83/04 ,  C08K5/5435 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08G77/14

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

公开(公告)号：US09837329B2

公开(公告)日：2017-12-05

申请号：US15112387

申请日：2015-01-28

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Jae Ho Jung ,  Bum Gyu Choi ,  Min Kyoun Kim

IPC: C08G77/12 ,  H01L23/29 ,  C08G77/20 ,  C09J183/04 ,  C08G77/00 ,  C08G77/08 ,  H01L33/56 ,  C08G77/38 ,  C08L83/04 ,  C08K5/5435 ,  C08L83/06 ,  C08K5/5419 ,  C08G77/14

CPC classification number: H01L23/296 ,  C08G77/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/38 ,  C08G77/48 ,  C08G77/80 ,  C08G2170/00 ,  C08G2190/00 ,  C08K5/5419 ,  C08K5/5435 ,  C08K5/56 ,  C08K2201/008 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/206 ,  C08L2205/025 ,  C09J183/04 ,  C09J2203/318 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/005

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

公开(公告)号：US09805999B2

公开(公告)日：2017-10-31

申请号：US15104037

申请日：2015-01-28

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Kyung Mi Kim ,  Jae Ho Jung ,  Bum Gyu Choi ,  Min Kyoun Kim

IPC: H01L33/56 ,  H01L23/29 ,  C08G77/12 ,  C08G77/20 ,  C09J183/04 ,  C08G77/00 ,  C08G77/08 ,  C08G77/38 ,  C08L83/04 ,  C08K5/5435 ,  C08L83/06 ,  C08K5/5419 ,  C08G77/14

CPC classification number: H01L23/296 ,  C08G77/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/38 ,  C08G77/48 ,  C08G77/80 ,  C08G2170/00 ,  C08G2190/00 ,  C08K5/5419 ,  C08K5/5435 ,  C08K5/56 ,  C08K2201/008 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/206 ,  C08L2205/025 ,  C09J183/04 ,  C09J2203/318 ,  H01L33/56 ,  H01L2933/0033 ,  H01L2933/005

Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.

公开(公告)号：US09299896B2

公开(公告)日：2016-03-29

申请号：US14143815

申请日：2013-12-30

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim

IPC: C08G77/08 ,  H01L33/56 ,  C08L83/04 ,  H01L23/29 ,  C08G77/12 ,  C08G77/20 ,  C08G77/00 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08L83/04 ,  G02F2202/28 ,  H01L23/296 ,  H01L2924/0002 ,  C08L83/00 ,  H01L2924/00

Abstract: A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.

Abstract translation: 提供可固化组合物。 提供了显示出优异的光提取效率，耐裂纹性，硬度，耐热冲击性和固化后的粘合强度以及显示出优异的加工性和可加工性的固化产物。 此外，可以防止固化产物中的表面粘性而不引起混浊等

公开(公告)号：US09243166B2

公开(公告)日：2016-01-26

申请号：US14606682

申请日：2015-01-27

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C08G77/04 ,  C09D183/04 ,  C08L83/04 ,  H01L23/29 ,  H01L33/56

CPC classification number: C09D183/04 ,  C08G77/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L83/06 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.

Abstract translation: 提供可固化组合物及其用途。 该固化性组合物具有优异的加工性，加工性和粘合性，显示出优异的光提取效率，抗裂性，硬度，耐热冲击性和固化后的粘合性，即使在恶劣条件下也具有持久的耐久性和可靠性，并且不会引起美白或表面 粘性。 可固化组合物可以用作诸如LED的光学半导体的密封剂或粘合剂材料。

公开(公告)号：US09147819B2

公开(公告)日：2015-09-29

申请号：US14161563

申请日：2014-01-22

Applicant: LG CHEM, LTD.

Inventor： Min Jin Ko ,  Myung Sun Moon ,  Jae Ho Jung ,  Bum Gyu Choi ,  Dae Ho Kang ,  Min Kyoun Kim ,  Byung Kyu Cho

IPC: C09K19/00 ,  H01L33/56 ,  G02F1/1335 ,  C08L83/04 ,  C08K3/00 ,  C08G77/12 ,  C08G77/20 ,  H01L23/29 ,  C08G77/00 ,  C08G77/14

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/80 ,  C08K3/01 ,  C08K3/22 ,  C08K3/36 ,  C08K2201/002 ,  C08L83/00 ,  C08L83/04 ,  C08L2205/22 ,  G02F1/133603 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/1059 ,  Y10T428/1068 ,  H01L2924/00 ,  C08K3/0008

Abstract: A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided.

Abstract translation: 提供了可固化组合物及其用途。 该组合物可用于显示出优异的加工性和加工性，并且提供显示出优异的光提取效率，抗裂纹性，硬度，耐热冲击性和粘合性能的固化产物，在长时间的苛刻条件下具有优异的可靠性， 在固化时防止其表面上的不透明度和粘性。 另外，可以提供能够防止添加剂如荧光材料或光转化材料沉淀的固化性组合物，并且即使在添加剂添加到固化性组合物中时也可以形成为透明性良好的固化物。