公开(公告)号：US20140313683A1

公开(公告)日：2014-10-23

申请号：US14357450

申请日：2012-11-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Hong Il Kim

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/0038 ,  H05K2201/09009 ,  H01L2924/00

Abstract: Provided are a tape carrier package and a method of manufacturing the same, the method, including: forming through holes by performing a drill process using a laser to an insulating film of a flexible copper clad laminate (FCCL) film consisting of the insulating film and a copper layer; forming a circuit pattern layer by performing an etching process to the copper layer of the FCCL film; and selectively forming a plating layer on the circuit pattern layer. The method of manufacturing the tape carrier package according to the present invention is advantageous because a punching process, and processes for laminating and drying the copper layer which are necessary for the conventional method of manufacturing the tape carrier package can be omitted, a production cost of the tape carrier package is reduced, and the time required for the drying process is saved.

Abstract translation: 提供一种载带封装及其制造方法，该方法包括：通过对由绝缘膜和由绝缘膜构成的柔性覆铜层压板（FCCL）膜的绝缘膜进行激光的钻孔处理来形成通孔， 铜层; 通过对FCCL膜的铜层进行蚀刻工艺形成电路图案层; 并且在电路图案层上选择性地形成镀层。 根据本发明的带状载体包装的制造方法是有利的，因为可以省略传统的制造带状载体包装方法所需的冲压工艺和层压和干燥铜层的方法，生产成本 减少了载带包装，节省了干燥过程所需的时间。

公开(公告)号：US20150054162A1

公开(公告)日：2015-02-26

申请号：US14394583

申请日：2013-04-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Hong Il Kim

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L21/4846 ,  H01L23/3121 ,  H01L23/4985 ,  H01L24/29 ,  H01L2224/04042 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05083 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A chip package substrate includes a base substrate including via holes. A circuit pattern layer is formed in an area of the base substrate corresponding to the via holes, and a first plated layer formed on the other surface opposite to one surface of the circuit pattern layer in contact with the via holes.

Abstract translation: 芯片封装基板包括具有通孔的基板。 电路图案层形成在与通孔相对应的基底基板的区域中，第一镀层形成在与通路孔接触的与电路图案层的一个表面相反的另一表面上。

公开(公告)号：US09674955B2

公开(公告)日：2017-06-06

申请号：US14357450

申请日：2012-11-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Hong Il Kim

IPC: H05K3/46 ,  H05K1/11 ,  H01L21/48 ,  H05K3/00 ,  H01L23/498 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/0038 ,  H05K2201/09009 ,  H01L2924/00

Abstract: Provided are a tape carrier package and a method of manufacturing the same, the method, including: forming through holes by performing a drill process using a laser to an insulating film of a flexible copper clad laminate (FCCL) film consisting of the insulating film and a copper layer; forming a circuit pattern layer by performing an etching process to the copper layer of the FCCL film; and selectively forming a plating layer on the circuit pattern layer. The method of manufacturing the tape carrier package according to the present invention is advantageous because a punching process, and processes for laminating and drying the copper layer which are necessary for the conventional method of manufacturing the tape carrier package can be omitted, a production cost of the tape carrier package is reduced, and the time required for the drying process is saved.