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公开(公告)号:US20150028368A1
公开(公告)日:2015-01-29
申请号:US14512257
申请日:2014-10-10
Applicant: LG INNOTEK CO., LTD.
Inventor: Gun Kyo LEE , Jong Woo LEE , Yun Min CHO
IPC: H01L25/075 , H01L33/62 , H01L33/64
CPC classification number: H01L25/0753 , F21S41/141 , F21S43/14 , F21S45/47 , F21S45/49 , H01L33/62 , H01L33/64 , H01L33/644 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.
Abstract translation: 这里公开了一种发光模块。 根据示例性实施例的发光模块包括具有空腔并且在不具有空腔的区域处包括电路图案的电路板,在其上部处形成有位于空腔中的绝缘基板,其上部具有 至少一个焊盘和设置在焊盘上的至少一个发光器件,其中,接合结构设置在空腔的底表面和绝缘基板的底表面之间。
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公开(公告)号:US20140264395A1
公开(公告)日:2014-09-18
申请号:US14205833
申请日:2014-03-12
Applicant: LG INNOTEK CO., LTD.
Inventor: Gun Kyo LEE , In Yong PARK , Jong Woo LEE , Ju Young LEE , Yun Min CHO
IPC: H01L27/15
CPC classification number: H01L27/156 , F21S41/143 , F21S41/155 , F21S41/19 , F21S41/663 , F21Y2105/10 , F21Y2105/12 , H01L25/0753 , H01L27/15 , H01L33/20 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.
Abstract translation: 公开了一种发光模块。 发光模块包括衬底和设置在衬底上的多个发光器件,多个发光器件中的至少一个发光器件包括单独驱动的多个发光单元,并且多个发光单元包括一个 发光结构包括第一半导体层,有源层和第二半导体层,并且具有发光面发光。
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公开(公告)号:US20160116129A1
公开(公告)日:2016-04-28
申请号:US14989704
申请日:2016-01-06
Applicant: LG INNOTEK CO., LTD.
Inventor: Nam Seok OH , Yun Min CHO , Jong Woo LEE
CPC classification number: F21S41/147 , F21S41/125 , F21S41/141 , F21S41/255 , F21S41/285 , F21S41/321 , F21S41/36 , F21S41/365 , F21S41/43 , F21S45/47 , F21V3/08 , F21V7/22 , F21V9/30 , F21V13/02 , F21Y2115/10 , H01L25/0753 , H01L27/153 , H01L33/58 , H01L2224/48091 , H05K1/05 , H05K1/183 , H05K3/284 , H05K2201/09745 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.
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公开(公告)号:US20160056345A1
公开(公告)日:2016-02-25
申请号:US14779896
申请日:2014-03-25
Applicant: LG INNOTEK CO., LTD.
Inventor: In Yong PARK , Gun Kyo LEE , Jong Woo LEE , Ju Young LEE , Yun Min CHO
CPC classification number: H01L33/50 , F21S43/14 , F21S43/195 , H01L25/0753 , H01L25/0756 , H01L33/62 , H01L33/642 , H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00011 , H01L2224/45099
Abstract: A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-μm distance in the horizontal direction.
Abstract translation: 根据本发明的一个实施例的发光元件封装包括:包括具有不同高度的第一和第二区域的电路板; 分别设置在第一和第二区域中的发光元件; 以及分别设置在发光元件上的荧光体层,其中发光元件设置在水平方向上的100μm距离内。
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