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Patent Agency Ranking
公开(公告)号：US09788438B2
公开(公告)日：2017-10-10
申请号：US14368210
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Seol Hee Lim , Yun Kyoung Jo , Ae Rim Kim , Sai Ran Eom , Chang Hwa Park
IPC: H01R9/00 , H05K3/30 , H05K1/11 , H05K3/24 , C25D3/12 , C25D3/16 , C25D3/48 , C25D3/50 , C25D3/56 , C25D3/62 , C25D5/12 , H05K1/09 , H05K1/18 , H05K3/18 , C23C18/16
CPC classification number: H05K3/301 , C23C18/1653 , C25D3/12 , C25D3/16 , C25D3/48 , C25D3/50 , C25D3/562 , C25D3/567 , C25D3/62 , C25D5/12 , H05K1/092 , H05K1/117 , H05K1/18 , H05K3/185 , H05K3/244 , H05K2201/10159 , H05K2201/10909 , H05K2203/049 , H05K2203/1572 , Y10T29/49128
Abstract: The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.
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公开(公告)号：US09661750B2
公开(公告)日：2017-05-23
申请号：US14364013
申请日：2012-11-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Yun Kyoung Jo , Seol Hee Lim , Chang Hwa Park , Sai Ran Eom , Ae Rim Kim
CPC classification number: H05K1/092 , H05K3/182 , H05K3/188 , H05K3/244 , H05K2201/0341 , H05K2201/09436 , H05K2201/099 , Y10T29/49155
Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.
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3.发明申请公开(公告)号：US20140369016A1
公开(公告)日：2014-12-18
申请号：US14368210
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Seol Hee Lim , Yun Kyoung Jo , Ae Rim Kim , Sai Ran Eom , Chang Hwa Park
CPC classification number: H05K3/301 , C23C18/1653 , C25D3/12 , C25D3/16 , C25D3/48 , C25D3/50 , C25D3/562 , C25D3/567 , C25D3/62 , C25D5/12 , H05K1/092 , H05K1/117 , H05K1/18 , H05K3/185 , H05K3/244 , H05K2201/10159 , H05K2201/10909 , H05K2203/049 , H05K2203/1572 , Y10T29/49128
Abstract: Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.
Abstract translation: 本发明提供一种用于存储卡的印刷电路板及其制造方法，该存储卡用印刷电路板包括：绝缘层; 安装单元，其形成在所述绝缘层的第一表面上并电连接到存储器件; 端子单元，形成在所述绝缘层的第二表面上并电连接到外部的电子设备; 以及在安装单元和终端单元处形成并由相同材料制成的金属层。
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4.发明授权公开(公告)号：US09867288B2
公开(公告)日：2018-01-09
申请号：US14386637
申请日：2013-03-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Seol Hee Lim
CPC classification number: H05K1/05 , C25D3/14 , C25D3/16 , C25D5/022 , C25D5/12 , H01L2224/45144 , H01L2224/48091 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/244 , H05K2201/0104 , H05K2201/032 , H05K2201/0338 , H05K2201/10159 , H05K2203/049 , H01L2924/00014 , H01L2924/00
Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.
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5.发明申请SEMICONDUCTOR MEMORY CARD, PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF FABRICATING THE SAME 有权半导体存储卡，记忆卡印刷电路板及其制造方法公开(公告)号：US20150016049A1
公开(公告)日：2015-01-15
申请号：US14386637
申请日：2013-03-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Seol Hee Lim
IPC: H05K1/05
CPC classification number: H05K1/05 , C25D3/14 , C25D3/16 , C25D5/022 , C25D5/12 , H01L2224/45144 , H01L2224/48091 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/244 , H05K2201/0104 , H05K2201/032 , H05K2201/0338 , H05K2201/10159 , H05K2203/049 , H01L2924/00014 , H01L2924/00
Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.
Abstract translation: 用于存储卡的印刷电路板包括绝缘层; 绝缘层的第一表面上的安装部分，所述安装部分电连接到存储装置; 以及在所述绝缘层的第二表面上的端子部分，所述端子部分电连接到外部电子设备，其中在所述安装部分和所述端子部分的暴露表面上形成具有相同特性的相同金属层。
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