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公开(公告)号：US20180255666A1
公开(公告)日：2018-09-06
申请号：US15912067
申请日：2018-03-05
Applicant: Laird Technologies, Inc.
Inventor： Jason L. STRADER , Eugene Anthony PRUSS , Gerald R. ENGLISH
CPC classification number: H05K9/0024 , B26F1/00 , B32B37/206 , B32B38/04 , B32B2309/02 , B32B2309/12 , B32B2457/08 , H05K1/0216 , H05K1/0393 , H05K3/321 , H05K3/4655 , H05K3/4658 , H05K3/4691 , H05K9/003 , H05K9/0084 , H05K2201/0195 , H05K2201/0715 , H05K2201/10371
Abstract: According to various aspects, disclosed are exemplary embodiments of a multilayered thin film board level shield and exemplary embodiments of a system in package that comprise a a multilayer flexible board level shield. Also disclosed are exemplary embodiments of methods relating to making multilayer thin film board level shields. Additional exemplary embodiments are disclosed of systems and methods of applying board level shielding.
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公开(公告)号：US20180228065A1
公开(公告)日：2018-08-09
申请号：US15947120
申请日：2018-04-06
Applicant: Laird Technologies, Inc.
Inventor： Timothy M. WRONA , Gerald R. ENGLISH , Daniel JACKLINSKI
CPC classification number: H05K9/0081 , H01L23/3675 , H01L23/4093 , H01L23/552 , H05K7/2039 , H05K7/20918 , H05K7/20945 , H05K9/0032
Abstract: A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.
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