摘要:
A sense amplifier charging circuit can work with different power supply voltages (EVCC). When EVCC is high, a signal generated from EVCC disables some of the charging transistors to reduce the circuit noise. When EVCC is low, the signal generated from EVCC enables the transistors thus increasing the circuit speed.
摘要:
A dynamic random access memory generates an internal power supply voltage IVCC. IVCC is lower in magnitude than the external power supply voltage EVCC. During a read operation, the sense amplifiers are powered from EVCC while the bit lines charge to their output levels. Then the sense amplifiers stop being powered from EVCC and begin being powered from IVCC to maintain the bit lines at their output levels. A timer defines the time that the sense amplifiers are powered from EVCC. This time depends inversely on EVCC. The timer includes a transistor connected between EVCC and an input of the inverter. The time that the sense amplifiers are powered from EVCC is defined by the time that the input of the inverter charges to the trip point of the inverter.
摘要:
An input/output bias circuit used in MOS memory devices is insensitive to inadvertent power supply variations. A memory cell, programmed to a given state, has a terminal connected to a first node. A first MOS switch, normally open, is connected between the first node and a ground terminal. A biasing circuit and a second MOS switch, normally closed, are connected between a power supply terminal and the first node. The first node is connected to one of two input terminals of a sense amplifier, the second input terminal being connected to a sense amplifier enable/disable signal. Upon selecting the memory cell, the first switch is turned on and the second switch is turned off for a first period of time. During this period, the biasing circuit and the first switch interact to bias the first node to a potential equal to one threshold voltage below the supply voltage. During a second period of time immediately after the first period, both switches 1 and 2 are turned off. During this period, the biasing circuit interacts with the memory cell to bias the first node to a potential corresponding to the state of the memory cell. Also during the second period of time the sense amplifier is enabled to detect the state of the memory cell by sensing the potential on the first node.
摘要:
An input/output bias circuit used in MOS memory devices is insensitive to inadvertent power supply variations. A memory cell, programmed to a given state, has a terminal connected to a first node. A first MOS switch, normally open, is connected between the first node and a ground terminal. A biasing circuit and a second MOS switch, normally closed, are connected between a power supply terminal and the first node. The first node is connected to one of two input terminals of a sense amplifier, the second input terminal being connected to a sense amplifier enable/disable signal. Upon selecting the memory cell, the first switch is turned on and the second switch is turned off for a first period of time. During this period, the biasing circuit and the first switch interact to bias the first node to a potential equal to one threshold voltage below the supply voltage. During a second period of time immediately after the first period, both switches 1 and 2 are turned off. During this period, the biasing circuit interacts with the memory cell to bias the first node to a potential corresponding to the state of the memory cell. Also during the second period of time the sense amplifier is enabled to detect the state of the memory cell by sensing the potential on the first node.
摘要:
A bias voltage generator generates the same bias voltage VBB for different external power supply voltages EVCC (for example, for EVCC=3.3V or 5.0V). During power-up, the charge pump that generates VBB is controlled by an enable signal ExtEn referenced to EVCC. Later an internal supply voltage IVCC becomes fully developed to a value independent from EVCC (for example, IVCC=3.0V), and the charge pump becomes controlled by an enable signal IntEn referenced to IVCC. This enable signal IntEn will cause VBB to reach its target value, for example, -1.5V. This target value is independent of EVCC. During power-up, when the charge pump is controlled by ExtEn, the bias voltage VBB is driven to an intermediate value (for example, -0.5V or -1V). This intermediate value depends on EVCC, but is below the target value in magnitude. The intermediate value reduces the likelihood of latch-up during power-up, but the intermediate value does not go beyond the target value thus does not create a significant pn-junction current leakage in semiconductor regions to which the bias voltage is applied.
摘要:
A memory performs a hidden refresh only at the end of a read operation or when the memory is disabled but is supposed to retain data in the disabled state. When the memory is in the enabled state, the refresh is not performed at the end of any operation other than read. This is done to ensure that execution of any memory access command will not be delayed by a refresh as long as the user follows certain timing rules. Other embodiments arc also provided.
摘要:
A memory such as a flash EPROM contains writing circuitry (58 and 60) that adjusts how much current or/and voltage is provided to a writing conductor (92) connected to the memory cells (50) of a cell group for simultaneously writing the bits of a bit group such as a word or byte into the cells of that cell group as a function of how many of those bits are in one of a pair of opposite logic states.
摘要:
Dynamic Random Access Memory (DRAM) cells are formed in a P well formed in a biased deep N well (DNW). PMOS transistors are formed in N wells. The NMOS channels stop implant mask is modified not to be a reverse of the N well mask in order to block the channels stop implant from an N+ contact region used for DNW biasing. In DRAMs and other integrated circuits, a minimal spacing requirement between a well of an integrated circuit on the one hand and adjacent circuitry on the other hand is eliminated by laying out the adjacent circuitry so that the well is located adjacent to a transistor having an electrode connected to the same voltage as the voltage that biases the well. For example, in DRAMs, the minimal spacing requirement between the DNW and the read/write circuitry is eliminated by locating the DNW next to a transistor precharging the bit lines before memory accesses. One electrode of the transistor is connected to a precharge voltage. This electrode overlaps the DNW which is biased to the same precharge voltage. This electrode provides the DNW N+ contact region.
摘要:
In each row of a nonvolatile memory array, the select gates of all the memory cells are connected together and are used to select a row for memory access. The control gates of each row are also connected together, and the source regions of each row are connected together. Also, the control gates of plural rows are connected together, and the source regions of plural rows are connected together, but if the source regions of two rows are connected together, then their control gates are not connected together. If one of the two rows is being accessed but the other one of the two rows is not being accessed, their control gates are driven to different voltages, reducing the probability of a punch-through in the non-accessed row.
摘要:
In a burst operation, a counter receives one or more bits of a starting column address. The count signal generated by the counter is provided to column decoders. The column decoders select two columns in response to a single value of the count signal. The two columns can be at non-consecutive column addresses. Alternatively, the two columns can be at consecutive column addresses starting at an odd column address boundary. Data are transferred between the two columns and a buffer in parallel. Data are transferred between the buffer and a data terminal serially. Some embodiments are suitable for burst operations defined by standards for synchronous dynamic random access memories.