公开(公告)号：US20070002694A1

公开(公告)日：2007-01-04

申请号：US11174221

申请日：2005-07-02

申请人： Lawrence Taugher ,  D. Mitchel Hanks ,  Paul Martin

发明人： Lawrence Taugher ,  D. Mitchel Hanks ,  Paul Martin

IPC分类号： G11B11/00

CPC分类号： G11B7/1275 ,  G11B7/0037

摘要： An optical mechanism includes an optical beam-generating mechanism and a light pipe. The optical-beam generating mechanism is to generate an optical beam. The light pipe is to guide the optical beam to an optically writable surface.

摘要翻译： 光学机构包括光束发生机构和光管。 光束产生机构是产生光束。 光管将光束引导到可光学写入的表面。

公开(公告)号：US20060248551A1

公开(公告)日：2006-11-02

申请号：US11116846

申请日：2005-04-28

申请人： Lawrence Taugher ,  Darwin Hanks ,  Paul Martin

发明人： Lawrence Taugher ,  Darwin Hanks ,  Paul Martin

IPC分类号： G11B7/09 ,  G11B7/08 ,  G11B7/085 ,  G11B7/00

CPC分类号： G11B7/0037

摘要： This invention relates to an optical disk writing and printing apparatus comprising; a motor operatively connected to an optical pickup unit and an optical print head such that the motor is engagingly connected to the optical pickup unit for assisting the optical pickup unit in writing data on one side of an optical disk and engagingly connected to the optical print head for assisting the optical print head in printing markings on another side of the optical disk.

摘要翻译： 本发明涉及一种光盘写入和打印设备，包括： 可操作地连接到光学拾取单元和光学打印头的马达，使得马达与光学拾取单元接合地连接，以辅助光学拾取单元在光盘的一侧上写入数据并且与光学打印头 用于辅助光学打印头在光盘的另一侧的打印标记。

公开(公告)号：US20070097819A1

公开(公告)日：2007-05-03

申请号：US11263445

申请日：2005-10-31

申请人： D. Mitchel Hanks ,  Lawrence Taugher ,  Paul Martin

发明人： D. Mitchel Hanks ,  Lawrence Taugher ,  Paul Martin

IPC分类号： G11B7/12

CPC分类号： G11B7/08582 ,  B41J3/4071 ,  G11B21/083 ,  G11B23/40

摘要： Various apparatuses and methods for laser positioning in an optical disc drive are provided. In one embodiment, a laser positioning apparatus is provided in which a first positioning assembly positions a first laser beam generated by a first laser and directed toward a first side of an optical disc site in the optical disc drive. A second positioning assembly positions a second laser beam generated by a second laser and directed toward a second side of the optical disc site in the optical disc drive. The second positioning assembly positions the second laser beam independent of the positioning of first laser beam by the first positioning assembly, the second positioning assembly further comprising an actuator that positions the second laser beam, and an elastic member that opposes a movement of the actuator.

摘要翻译： 提供了用于光盘驱动器中的激光定位的各种装置和方法。 在一个实施例中，提供了一种激光定位装置，其中第一定位组件将由第一激光器产生的第一激光束定位在光盘驱动器中的光盘位置的第一侧。 第二定位组件将由第二激光器产生的第二激光束定位在光盘驱动器中的光盘位置的第二侧。 第二定位组件通过第一定位组件定位第二激光束与第一激光束的定位无关，第二定位组件还包括定位第二激光束的致动器以及与致动器的运动相对的弹性部件。

公开(公告)号：US20070092837A1

公开(公告)日：2007-04-26

申请号：US11259844

申请日：2005-10-26

申请人： Lawrence Taugher ,  Paul Martin

发明人： Lawrence Taugher ,  Paul Martin

IPC分类号： G11B7/24

CPC分类号： G11B7/263 ,  G11B7/0037 ,  G11B7/24038 ,  G11B7/266

摘要： A method for forming an optical disc includes forming a first disc portion, forming a second disc portion, coupling the first disc portion to the second disc portion, wherein forming the first disc portion includes forming a data recording layer, and wherein forming the second disc portion includes forming a material layer including a plurality of embossed features having a depth of approximately ¼λ for optimized encoder compatibility, where λ is the wavelength of a light source being used to sense the embossed features.

摘要翻译： 一种形成光盘的方法包括：形成第一光盘部分，形成第二光盘部分，将第一光盘部分耦合到第二光盘部分，其中形成第一光盘部分包括形成数据记录层，并且其中形成第二光盘 部分包括形成包括多个具有大约1/4的深度的压花特征的材料层，用于优化的编码器兼容性，其中λ是用于感测压花特征的光源的波长。

公开(公告)号：US09249924B1

公开(公告)日：2016-02-02

申请号：US13910114

申请日：2013-06-05

申请人： Paul Martin

发明人： Paul Martin

IPC分类号： A47B96/00 ,  F16M13/02 ,  H05K5/03

CPC分类号： F16M13/02 ,  F16M11/041 ,  F16M11/40 ,  F16M13/00

摘要： The present invention will provide a mobile device retention unit which combines the protective quality of a case as well as the utility of an adjustable mount onto a desk and will enhance the quality of the audio produced. Furthermore, the present invention will allow for the integration of the rising popularity of mobile devices into a school or work setting. This is accomplished by creating a case that mounts onto a desk, while allowing for an adjustable angle and easy accessibility.

摘要翻译： 本发明将提供一种移动设备保持单元，其将壳体的保护质量以及可调节安装件的效用结合到桌面上并且将提高所产生的音频的质量。 此外，本发明将允许将移动设备的日益普及融入到学校或工作环境中。 这是通过创建一个安装在桌面上的情况来实现的，同时允许可调节角度和易于访问。

公开(公告)号：US08824662B2

公开(公告)日：2014-09-02

申请号：US13474210

申请日：2012-05-17

申请人： Paul Martin

发明人： Paul Martin

IPC分类号： H04M3/00 ,  H04M5/00 ,  G06Q20/10 ,  H04M3/523

CPC分类号： H04M3/523 ,  G06Q20/10 ,  G06Q20/108 ,  H04M2203/2094 ,  H04M2242/30

摘要： A method for interfacing a customer with a call center. Information obtained from a Radio Frequency Identification (RFID) tag is transmitted to the call center to provide additional information about the customer and allow the session to be accurately routed within the call center. The call center may be accessed by telephone, computer, or other type of customer premises equipment over a voice or data network. The RFID tag may be an identification tag provided to the customer for access to the call center or may be a tag associated with the customer and not specific to the call center. The call center may route calls based on routing information contained in the RFID tag information, customer identity and previous sessions with that customer, personal and demographic information and statistical support records for other sessions involving customers with similar personal and demographic information, and according to agent statistical support records.

摘要翻译： 一种将客户与呼叫中心进行接口的方法。 从射频识别（RFID）标签获得的信息被发送到呼叫中心，以提供关于客户的附加信息，并允许会话在呼叫中心内被精确地路由。 呼叫中心可以通过电话，计算机或其他类型的客户驻地设备通过语音或数据网络访问。 RFID标签可以是提供给客户以访问呼叫中心的识别标签，或者可以是与客户相关联并且不是呼叫中心特有的标签。 呼叫中心可以根据包含在RFID标签信息，客户身份和以前会话中的路由信息​​来路由呼叫，个人和人口信息以及涉及具有相似个人和人口信息的客户的其他会话的统计支持记录，并且根据代理 统计支持记录。

公开(公告)号：US08384118B2

公开(公告)日：2013-02-26

申请号：US12767845

申请日：2010-04-27

申请人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

发明人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC分类号： H01L33/00

CPC分类号： H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

摘要： Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

摘要翻译： 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US08186018B2

公开(公告)日：2012-05-29

申请号：US12584912

申请日：2009-09-14

申请人： Paul Martin

发明人： Paul Martin

IPC分类号： B25G1/10 ,  A45C13/26

CPC分类号： B25F5/026 ,  Y10T16/469 ,  Y10T16/4713 ,  Y10T16/498

摘要： An auxiliary handle for a hand-held power tool (7) includes a lockable lag hinge (46) provided between the clamping section (21) and the gripping member (34) and having a pivot pin (47), a tightening member (51) for tightening and loosening the clamping section (21) and arranged on an end (48) of the pivot pin (47) of the lag hinge (46), a locking device (41) for locking and releasing the lag hinge (46), and an independent from the tensioning member (51), a quick-release device (56) for the locking device (41) and the clamping section (21) for displacing the locking device (410 in a position in which the lag hinge (46) is released and for loosening tightening of the clamping section (21).

摘要翻译： 用于手持式电动工具（7）的辅助手柄包括设置在夹紧部分（21）和夹紧构件（34）之间并具有枢轴销（47）的可锁定延伸铰链（46），紧固构件 ），用于紧固和松开夹紧部分（21）并且布置在滞后铰链（46）的枢轴销（47）的端部（48）上，用于锁定和释放滞后铰链（46）的锁定装置（41） ，并且与张紧构件（51）独立，用于锁定装置（41）的快速释放装置（56）和用于使锁定装置（410）在滞后铰链（ 46）被释放并且用于松开夹紧部分（21）的紧固。

公开(公告)号：US07736945B2

公开(公告)日：2010-06-15

申请号：US11611775

申请日：2006-12-15

申请人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

发明人： Stefano Schiaffino ,  Daniel A. Steigerwald ,  Mari Holcomb ,  Grigoriy Basin ,  Paul Martin ,  John Epler

IPC分类号： H01L21/00

CPC分类号： H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/382 ,  H01L33/40 ,  H01L33/62 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/00

摘要： Described is a process for forming an LED structure using a laser lift-off process to remove the growth substrate (e.g., sapphire) after the LED die is bonded to a submount. The underside of the LED die has formed on it anode and cathode electrodes that are substantially in the same plane, where the electrodes cover at least 85% of the back surface of the LED structure. The submount has a corresponding layout of anode and cathode electrodes substantially in the same plane. The LED die electrodes and submount electrodes are ultrasonically welded together such that virtually the entire surface of the LED die is supported by the electrodes and submount. Other bonding techniques may also be used. No underfill is used. The growth substrate, forming the top of the LED structure, is then removed from the LED layers using a laser lift-off process. The extremely high pressures created during the laser lift-off process do not damage the LED layers due to the large area support of the LED layers by the electrodes and submount.

摘要翻译： 描述了在将LED管芯接合到基座之后，使用激光剥离工艺形成LED结构以去除生长衬底（例如，蓝宝石）的工艺。 LED芯片的下侧形成有基本上在同一平面中的阳极和阴极电极，其中电极覆盖LED结构的后表面的至少85％。 底座具有基本上在同一平面中的阳极和阴极电极的相应布局。 LED芯片电极和基座电极被超声波焊接在一起，使得LED芯片的整个表面几乎被电极和底座支撑。 也可以使用其它粘合技术。 没有使用底层填料。 然后使用激光剥离工艺从LED层去除形成LED结构顶部的生长衬底。 在激光剥离过程中产生的极高的压力不会由于电极和基座的LED层的大面积支撑而损坏LED层。

公开(公告)号：US20060240585A1

公开(公告)日：2006-10-26

申请号：US11421350

申请日：2006-05-31

申请人： John Epler ,  Paul Martin ,  Michael Krames

发明人： John Epler ,  Paul Martin ,  Michael Krames

IPC分类号： H01L21/00

CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency.

摘要翻译： 在衬底上生长LED外延层（n型，p型和有源层）。 对于每个管芯，n和p层电连接到延伸超过LED管芯边界的封装衬底，使得LED层位于封装衬底和生长衬底之间。 封装衬底提供电触头和导体，导致可焊接的封装连接。 然后除去生长底物。 因为精细的LED层在附着于生长衬底的同时与封装衬底结合，所以不需要用于LED层的中间支撑衬底。 然后将与去除的生长衬底相邻的较厚的LED外延层变薄，并将其顶表面加工成掺入光提取特征。 通过减薄的外延层对光的吸收非常小，因为LED层直接接合到封装基板上而没有任何支撑基板，因此封装和LED之间的电阻很小，因此封装的导热性很高 层效率（光输出与功率输入）高。 LED层的光提取特性进一步提高了效率。