公开(公告)号：US07051430B2

公开(公告)日：2006-05-30

申请号：US10369873

申请日：2003-02-19

申请人： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

发明人： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

IPC分类号： H05K3/36 ,  H05K1/00 ,  H01L29/04 ,  H01L31/036

CPC分类号： H05K1/186 ,  H05K1/185 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49169

摘要： Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

摘要翻译： 制造印刷电路板组件的方法。 在一个实施例中，衬底被涂覆有导电材料; 电气部件安装在基板的一些区域上; 非导电材料设置在电气部件之间的区域中; 基板，电气部件和非导电材料夹在两片树脂涂覆的导电箔之间，其中箔上的树脂面向基板并埋入电气部件; 在树脂涂覆的导电箔的暴露表面中蚀刻电路图案; 并且在至少一个树脂涂覆的导电箔和电子部件之间建立电连接。

公开(公告)号：US06552265B1

公开(公告)日：2003-04-22

申请号：US09412697

申请日：1999-10-05

申请人： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

发明人： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

IPC分类号： H07L2328

CPC分类号： H05K1/186 ,  H05K1/185 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49169

摘要： A compact printed board assembly has a patterned copper-coated substrate (1) with electronic components (5, 12) mounted thereon. Depending on the height of the components, either SBU lacquer (11) or non-flow prepreg (3) and laminate (4) surround the electronic components. This subassembly is then sandwiched between two RC (resin coated) copper foils (8) with the resin (7) facing the components (5, 12) and burying them, thereby providing a new etchable copper surface which can be connected by means of microvias (10) to the embedded components (5, 12).

摘要翻译： 紧凑的印刷电路板组件具有安装在其上的电子部件（5,12）的图案化铜涂覆的基板（1）。 根据组件的高度，SBU漆（11）或非流动预浸料（3）和层压板（4）围绕电子部件。 然后将该子组件夹在两个RC（树脂涂覆的）铜箔（8）之间，树脂（7）面向部件（5,12）并将它们进行掩埋，从而提供可通过微孔连接的新的可蚀刻铜表面 （10）连接到嵌入式部件（5,12）。

公开(公告)号：US06459347B1

公开(公告)日：2002-10-01

申请号：US09384222

申请日：1999-08-27

申请人： Leif Bergstedt ,  Katarina Boustedt

发明人： Leif Bergstedt ,  Katarina Boustedt

IPC分类号： H01P308

CPC分类号： H05K1/0222 ,  H01P1/047 ,  H05K1/115 ,  H05K1/183 ,  H05K3/4046 ,  H05K2201/09809 ,  H05K2201/10356

摘要： Conductors extend parallel to one another in a device in the microwave range. Each conductor includes a conductive layer, a layer of a dielectric material and a ground plane. The ground planes of the two conductors are separated in the device by a core made of a dielectric material. The various layers are arranged on one another in the desired order, and a cavity is arranged in the device, extending from that layer in the first conductor which is to be connected to the second conductor, at right angles to the main direction of this layer, up to and including the layer on which the conductive layer of the second conductor is to lie. A component including a stripline conductor is arranged in the cavity, the component being arranged so that electrical contact is brought about between the conductor of the component and that layer in the first conductor which is to be connected to the second conductor. Subsequently, the conductive layer of the second conductor and its remaining ground plane and dielectric layer are arranged on the device so that the electrical contact is brought about between the conductor of the component and the conductive layer of the second conductor.

摘要翻译： 导体在微波范围内的器件中彼此平行延伸。 每个导体包括导电层，介电材料层和接地平面。 两个导体的接地面在器件中由电介质材料制成的芯体分开。 各层以所需的顺序彼此排列，并且在该装置中布置有空腔，该第一导体中的该层与该第二导体连接，该层与该层的主方向成直角 ，直到并包括第二导体的导电层所在的层。 包括带状线导体的部件布置在空腔中，该部件被布置成使得电连接在部件的导体和要连接到第二导体的第一导体中的该层之间。 随后，第二导体的导电层及其剩余的接地平面和电介质层被布置在器件上，使得电接触被带到部件的导体和第二导体的导电层之间。