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    Arrangement for more even current distribution in a transmission line
    4.
    发明授权
    Arrangement for more even current distribution in a transmission line 有权
    在传输线路中更均匀分布的布置

    公开(公告)号：US06369677B1

    公开(公告)日：2002-04-09

    申请号：US09383915

    申请日：1999-08-26

    申请人： Spartak Gevorgian ,  Leif Bergstedt

    发明人： Spartak Gevorgian ,  Leif Bergstedt

    IPC分类号： H01P308

    CPC分类号： H01P3/085

    摘要： More even current distribution in a transmission line is provided by an arrangement including a first conductive layer, a dielectric layer and a ground plane. The first conductive layer, the dielectric layer and the ground plane extend mainly in substantially the same direction, with the dielectric layer arranged between the first conductive layer and the ground plane. The arrangement includes an object located between the dielectric layer and the ground plane. The object can be electrically conductive or made of a dielectric material.

    摘要翻译： 通过包括第一导电层，电介质层和接地平面的布置来提供传输线中更均匀的电流分布。 第一导电层，电介质层和接地面主要以大致相同的方向延伸，其中电介质层布置在第一导电层和接地平面之间。 该布置包括位于介电层和接地平面之间的物体。 该物体可以是导电的或由电介质材料制成。

    Component for electromagnetic waves and a method for manufacturing the same
    5.
    发明授权
    Component for electromagnetic waves and a method for manufacturing the same 有权
    电磁波用部件及其制造方法

    公开(公告)号：US07192882B2

    公开(公告)日：2007-03-20

    申请号：US10500310

    申请日：2002-12-27

    申请人： Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

    发明人： Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

    IPC分类号： H01L21/302

    CPC分类号： H01P11/008

    摘要： The present invention relates to a method for fabricating a cavity in substrate for a component for electromagnetic waves, the method comprising providing said cavity by removal of material from said substrate by removal of material by immersing the substrate in a liquid bath of a chemical etchant, so that resultant cavity has a top and a bottom side and sidewalls, and said cavity at one of said top and/or bottom sides exhibits an at least a four sided opening having an opening with at least two different adjacent angles. The invention also relates to the component for microwave applications.

    摘要翻译： 本发明涉及一种用于制造用于电磁波部件的衬底中的空腔的方法，所述方法包括通过将衬底浸入化学蚀刻剂的液体浴中去除材料来从所述衬底移除材料来提供所述腔体， 使得所得到的空腔具有顶侧和底侧以及侧壁，并且所述顶部和/或底侧中的一个处的所述空腔具有至少四边形开口，该开口具有至少两个不同相邻角度的开口。 本发明还涉及用于微波应用的组件。

    Component for electromagnetic waves and a method for manufacturing the same
    6.
    发明申请
    Component for electromagnetic waves and a method for manufacturing the same 有权
    电磁波用部件及其制造方法

    公开(公告)号：US20050215020A1

    公开(公告)日：2005-09-29

    申请号：US10500310

    申请日：2002-12-27

    申请人： Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

    发明人： Leif Bergstedt ,  Spartak Gevorgian ,  Marica Gustafsson

    IPC分类号： B81C1/00 ,  H01P11/00 ,  H01L21/8222

    CPC分类号： H01P11/008

    摘要： The present invention relates to a method for fabricating a cavity in substrate for a component for electromagnetic waves, the method comprising providing said cavity by removal of material from said substrate by removal of material by immersing the substrate in a liquid bath of a chemical etchant, so that resultant cavity has a top and a bottom side and sidewalls, and said cavity at one of said top and/or bottom sides exhibits an at least a four sided opening having an opening with at least two different adjacent angles. The invention also relates to the component for microwave applications.

    摘要翻译： 本发明涉及一种用于制造用于电磁波部件的衬底中的空腔的方法，所述方法包括通过将衬底浸入化学蚀刻剂的液体浴中去除材料来从所述衬底去除材料来提供所述空腔， 使得所得到的空腔具有顶侧和底侧以及侧壁，并且所述顶部和/或底侧中的一个处的所述空腔具有至少四边形开口，该开口具有至少两个不同相邻角度的开口。 本发明还涉及用于微波应用的组件。

    Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
    7.
    发明授权
    Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method 有权
    制造印刷电路板的方法和根据该方法制造的散热装置

    公开(公告)号：US06459585B1

    公开(公告)日：2002-10-01

    申请号：US09520840

    申请日：2000-03-08

    申请人： Leif Bergstedt ,  Per Ligander

    发明人： Leif Bergstedt ,  Per Ligander

    IPC分类号： H05K720

    CPC分类号： H05K1/0204 ,  H05K3/4046 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

    摘要： A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

    摘要翻译： 安装在板（20）上的部件（16）被冷却表面（15）冷却，该冷却表面与金属螺柱（8）形式的散热元件接触，冷却表面又可以连接到外部冷却 表面。 实现这一点的一种方法是在层叠体（1）中形成孔（4），蚀刻图案（5），将金属柱（8）放置在孔（4）中，将电介质（9）施加到上下 （1）的侧面，在电介质（9）中形成开口（14），然后金属电镀整个电路板并蚀刻其它图案。 组件16然后可以安装在印刷电路板（20）上。 散热元件（8）包括切割边缘（18）并且可以有益地使用该方法的一个实施例。

    Electric component
    8.
    发明授权
    Electric component 有权
    电气部件

    公开(公告)号：US06421225B2

    公开(公告)日：2002-07-16

    申请号：US09333880

    申请日：1999-06-15

    申请人： Leif Bergstedt

    发明人： Leif Bergstedt

    IPC分类号： H01G420

    CPC分类号： H05K1/162 ,  H05K1/167 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672

    摘要： Invention refers to an electric component, preferably a component buried in a Printed Circuit Board (PCB) including at least two conductive layers (13,21, 36; 15, 35) and an intermediate layer (14, 37). The intermediate layer (14, 37) further consists of at least two layers (16, 17, 22, 23, 38, 39, 40): at least a first layer (17, 23, 39) and a second layer (16, 22, 38, 40), which at least first layer has more elastic characteristic than the second layer (16, 22, 38, 40) at a certain temperature and/or pressure.

    摘要翻译： 本发明涉及一种电子部件，优选埋入包括至少两个导电层（13,21,36; 15,35）和中间层（14,37）的印刷电路板（PCB）中的部件。 中间层（14,37）还包括至少两层（16,17,22,23,38,39,40）：至少第一层（17,23,39）和第二层（16， 22,38,40），其至少第一层在一定温度和/或压力下具有比第二层（16,22,38,40）更具弹性的特性。

    Method and an arrangement in an electronics system
    9.
    发明授权
    Method and an arrangement in an electronics system 有权
    电子系统中的方法和装置

    公开(公告)号：US06230401B1

    公开(公告)日：2001-05-15

    申请号：US09143436

    申请日：1998-08-28

    申请人： Per Ligander ,  Leif Bergstedt

    发明人： Per Ligander ,  Leif Bergstedt

    IPC分类号： H05K302

    CPC分类号： H01P11/003 ,  H05K1/0218 ,  H05K1/024 ,  H05K3/0023 ,  H05K3/386 ,  H05K3/4685 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/0715 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.

    摘要翻译： 本发明涉及一种用于在印刷电路板（1）上的至少一个导体（5,5a）上形成气隙（L，1a）的方法和装置，使导体（5,5a）中的损耗最小化。 使用众所周知的顺序构建（SBU）技术，其中具有导体（5,5a）的载体（3）被感光漆层（7,7a）覆盖。 通过照相方法在导体（5,5a）上方的清漆层（7,7a）中形成开口（8,8a）。 然后将金属层（11,11a）紧固到覆盖至少所述开口88,8a）的清漆层（7,7a），使得在导体（5,5a）和 金属层（11,11a）。 所得到的电路板（1）具有适合于导体（5,5a）的气隙（L，1a）。 根据替代的本发明方法，载体（3）还包括在载体的相对侧上与上述导体（5a）相对放置的下导体（5b）。 以与上述相同的方式，下部载体（5b）设置有气隙（1b）。 可以将电介质材料层（13）固定在金属层（11）上以获得更刚性的结构。