公开(公告)号：US08970322B2

公开(公告)日：2015-03-03

申请号：US13977607

申请日：2010-12-29

Applicant: Mingquan Bao ,  Per Ligander

Inventor： Mingquan Bao ,  Per Ligander

IPC: H01P5/12 ,  H01P3/12 ,  H03D3/00 ,  H03D9/04 ,  H04B1/30 ,  H04L27/38

CPC classification number: H01P3/12 ,  H01P5/12 ,  H03D3/007 ,  H03D9/04 ,  H04B1/30 ,  H04L27/38

Abstract: A five-six-port circuit comprising a waveguide on a main surface of a substrate. The hollow waveguide comprises probes arranged longitudinally inside the hollow waveguide arranged to contact the input port of one of three power detectors, whose output ports are arranged to contact the input port of one power detector. The output ports of the power detectors contact the conductor of an open waveguide which extends in parallel to the hollow waveguide. The probes are equidistantly spaced with a distance of L. The circuit also comprises three LP filters, each of which is connected to the conductor of the open waveguide at a position which corresponds to the position of one of the power detectors.

Abstract translation: 一种五六端口电路，包括在衬底的主表面上的波导。 空心波导包括纵向设置在中空波导内部的探针，其布置成接触三个功率检测器之一的输入端口，其输出端口布置成接触一个功率检测器的输入端口。 功率检测器的输出端口与平行于中空波导延伸的开放波导的导体接触。 探头距离为L等距离间隔。该电路还包括三个LP滤波器，每个LP滤波器在对应于一个功率检测器的位置的位置处连接到开放波导的导体。

公开(公告)号：US20100289602A1

公开(公告)日：2010-11-18

申请号：US12810053

申请日：2008-03-27

Applicant: Per Ligander ,  Marcus Karl Hasselblad

Inventor： Per Ligander ,  Marcus Karl Hasselblad

IPC: H01P1/04

CPC classification number: H01P1/042 ,  H01P3/121 ,  H01P11/002

Abstract: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4), a second surface-mountable waveguide part (5) and a dielectric carrier material (1) with a metalization (M) provided on a first main side (2). Each waveguide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mountable waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other. The transition arrangement further comprises an electrically conducting sealing frame (17) that is arranged to be mounted over the ends (4a, 5a), covering them, where the frame (17) has a first wall (18), a second wall (19) and a third wall (20), where the second and third walls (19, 20) are arranged to contact a part of the metalization (M).

Abstract translation: 本发明涉及一种过渡装置，其包括第一表面安装的波导部分（4），第二可表面安装的波导部分（5）和介电载体材料（1），金属化（M）设置在第一主侧 （2）。 每个波导部分（4,5）包括第一壁（7,10），第二壁（8,11）和第三壁（9,12），所述第二壁和第三壁（8,9; 11,12） 被布置成接触金属化（M）的一部分，其中表面安装的波导部件（4,5）被布置成安装在电介质载体材料（1）上，使得表面安装的波导部件 4,5）包括位于彼此面对的端部（4a，5a）。 转换装置还包括导电密封框架（17），其布置成安装在端部（4a，5a）上方，覆盖它们，框架（17）具有第一壁（18），第二壁（19） ）和第三壁（20），其中所述第二和第三壁（19,20）布置成接触所述金属化（M）的一部分。

公开(公告)号：US20090289746A1

公开(公告)日：2009-11-26

申请号：US12373541

申请日：2006-07-13

Applicant: Per Ligander

Inventor： Per Ligander

IPC: H01P1/20 ,  H01P11/00

CPC classification number: H01P1/208 ,  H01P11/007 ,  Y10T29/49016

Abstract: A waveguide filter comprising a matching means for matching the filter. The waveguide filter comprises a housing comprising a cavity having a predetermined first volume. The matching means is in the form of a volume element having a predetermined second volume being matched to the first volume forming a predetermined volume to volume ratio. The matching means is fitted into the cavity in a fixed non-adjustable manner in relationship to the housing. The invention refers also to a method for manufacturing of such a waveguide filter.

Abstract translation: 一种波导滤波器，包括用于匹配滤波器的匹配装置。 波导滤波器包括壳体，该壳体包括具有预定第一体积的空腔。 匹配装置是体积元件的形式，其具有与形成预定体积/体积比的第一容积相匹配的预定第二容积。 匹配装置以与壳体相关的固定不可调方式装配到空腔中。 本发明还涉及这种波导滤波器的制造方法。

公开(公告)号：US07102480B2

公开(公告)日：2006-09-05

申请号：US10475137

申请日：2001-04-17

Applicant: Leif Bergstedt ,  Kent Falk ,  Per Ligander

Inventor： Leif Bergstedt ,  Kent Falk ,  Per Ligander

IPC: H01F27/28

CPC classification number: H01H50/005 ,  H05K1/16

Abstract: A printed circuit board includes a first layer on which a first stationary contact terminal is formed and one or more second layers spaced apart from the first layer by at least one intermediate layer. A portion of the one or more second layers extends into a recess formed by a discontinuity of the intermediate layers. The portion is flexible and has a second terminal which can be brought into contact with the first stationary terminal.

Abstract translation: 印刷电路板包括形成有第一固定接触端子的第一层和通过至少一个中间层与第一层隔开的一个或多个第二层。 一个或多个第二层的一部分延伸到由中间层的不连续形成的凹部中。 该部分是柔性的并且具有能够与第一固定端子接触的第二端子。

公开(公告)号：US5977915A

公开(公告)日：1999-11-02

申请号：US104328

申请日：1998-06-25

Applicant: Leif Bergstedt ,  Per Ligander

Inventor： Leif Bergstedt ,  Per Ligander

IPC: H01P3/08 ,  H01Q1/38 ,  H01Q13/08 ,  H01Q21/00

CPC classification number: H01P3/081 ,  H01P3/087 ,  H01Q1/38 ,  H01Q21/0075

Abstract: An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.

Abstract translation: 微波频率范围内的电磁信号环境友好的微带结构。 根据本发明的微带结构包括由无机非金属材料制成的至少两个介电体。 微带结构的导体设置在第一绝缘体上。 微带结构的接地平面设置在第二电介质体上。 介电体的取向使得第二电介质位于至少一个导体和接地平面之间，而第一绝缘体不是。 在第二绝缘体中至少一个导体周围形成至少一个空穴，从而形成包括空腔的气体/空气/真空和第二介电体的复合电介质。 复合电介质为微带结构提供了足够的性能，介质形成介质较薄但环境友好的介电材料。

公开(公告)号：US20130278351A1

公开(公告)日：2013-10-24

申请号：US13977607

申请日：2010-12-29

Applicant: Mingquan Bao ,  Per Ligander

Inventor： Mingquan Bao ,  Per Ligander

IPC: H01P1/213

CPC classification number: H01P3/12 ,  H01P5/12 ,  H03D3/007 ,  H03D9/04 ,  H04B1/30 ,  H04L27/38

Abstract: A five-six-port circuit comprising a waveguide on a main surface of a substrate. The hollow waveguide comprises probes arranged longitudinally inside the hollow waveguide arranged to contact the input port of one of three power detectors, whose output ports are arranged to contact the input port of one power detector. The output ports of the power detectors contact the conductor of an open waveguide which extends in parallel to the hollow waveguide. The probes are equidistantly spaced with a distance of L. The circuit also comprises three LP filters, each of which is connected to the conductor of the open waveguide at a position which corresponds to the position of one of the power detectors.

Abstract translation: 一种五六端口电路，包括在衬底的主表面上的波导。 空心波导包括纵向设置在中空波导内部的探针，其布置成接触三个功率检测器之一的输入端口，其输出端口布置成接触一个功率检测器的输入端口。 功率检测器的输出端口与平行于中空波导延伸的开放波导的导体接触。 探头距离为L等距离间隔。该电路还包括三个LP滤波器，每个LP滤波器在对应于一个功率检测器的位置的位置处连接到开放波导的导体。

公开(公告)号：US08487711B2

公开(公告)日：2013-07-16

申请号：US12743910

申请日：2007-11-30

Applicant: Per Ligander ,  Marcus Hasselblad

Inventor： Per Ligander ,  Marcus Hasselblad

IPC: H01P5/107

CPC classification number: H01P5/107

Abstract: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.

Abstract translation: 本发明涉及一种传输线到波导过渡装置，其包括具有第一主侧和第二主侧的电介质载体材料装置，该装置包括具有开口的过渡部分，该过渡部分具有至少一个边缘和导电边界， 沿着开口并且电连接到第二主侧上的接地金属化。 传输线导体在电介质载体材料装置中朝向边界延伸。 该布置还包括具有边界接触部分的过渡部分，该边界接触部分具有除了边界接触部分之外的间隙基本上遵循边界形状的外圆周。 过渡部分还包括导体接触部分，其从边界接触部分穿过间隙突出，接触传输线导体的端部并延伸到开口中。

公开(公告)号：US08081044B2

公开(公告)日：2011-12-20

申请号：US12517328

申请日：2007-06-19

Applicant: Per Ligander

Inventor： Per Ligander

IPC: H01P5/107

CPC classification number: H01P5/107 ,  H01P1/207 ,  H01P11/00 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09072 ,  H05K2201/09909

Abstract: A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.

Abstract translation: 一种表面可安装的波导装置，包括具有第一主侧和第二主侧的电介质载体材料，第二侧包括接地平面，第一侧被布置成通过相应的金属化图案形成微波电路布局 边。 微波电路布局包括用于表面安装的波导部分的覆盖区，波导部分包括开口侧，部分占地面积构成用于封闭开放侧的封闭壁。 波导部件布置成安装到包括在占地面积中的覆盖区焊料区域，具有外轮廓并且对应于波导部件上的可焊接接触区域。 阻焊线形成在覆盖区上，至少部分地限定封闭壁和焊接区域之间的边界。 本发明还涉及电介质载体。

公开(公告)号：US20090272568A1

公开(公告)日：2009-11-05

申请号：US12298455

申请日：2006-04-28

Applicant: Per Ligander

Inventor： Per Ligander

IPC: H05K1/16

CPC classification number: H01L23/24 ,  H01L23/057 ,  H01L23/5385 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0243 ,  H05K1/183 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises a second microwave laminate layer, with a first side and a second side, the second side of the second laminate layer being fixed to at least a part of the first side of the first laminate layer. The first laminate layer and/or the second laminate layer comprises at least one recess arranged for receiving a microwave chip intended to be connected to said conductor. The second laminate layer extends outside the outer limit of the first laminate layer, said conductors continuing on the second side of the second laminate layer without contacting the first laminate layer.

Abstract translation: 微波芯片支撑结构技术领域本发明涉及一种微波芯片支撑结构，其包括具有第一侧面和第二侧面以及外部极限的第一微波层叠层。 至少一个导体形成在所述第一侧上，朝向所述外界限延伸。 微波芯片支撑结构还包括具有第一侧和第二侧的第二微波层压层，第二层叠层的第二侧被固定在第一层压层的第一侧的至少一部分上。 第一层压层和/或第二层压层包括至少一个用于接收旨在连接到所述导体的微波芯片的凹槽。 第二层压层延伸到第一层压层的外部极限之外，所述导体在第二层压层的第二侧上延续，而不与第一层压层接触。

公开(公告)号：US06459585B1

公开(公告)日：2002-10-01

申请号：US09520840

申请日：2000-03-08

Applicant: Leif Bergstedt ,  Per Ligander

Inventor： Leif Bergstedt ,  Per Ligander

IPC: H05K720

CPC classification number: H05K1/0204 ,  H05K3/4046 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

Abstract translation: 安装在板（20）上的部件（16）被冷却表面（15）冷却，该冷却表面与金属螺柱（8）形式的散热元件接触，冷却表面又可以连接到外部冷却 表面。 实现这一点的一种方法是在层叠体（1）中形成孔（4），蚀刻图案（5），将金属柱（8）放置在孔（4）中，将电介质（9）施加到上下 （1）的侧面，在电介质（9）中形成开口（14），然后金属电镀整个电路板并蚀刻其它图案。 组件16然后可以安装在印刷电路板（20）上。 散热元件（8）包括切割边缘（18）并且可以有益地使用该方法的一个实施例。