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    METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS
    1.
    发明申请
    METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS 失效
    用于支持使用流体的基板的方法和装置

    公开(公告)号：US20060252354A1

    公开(公告)日：2006-11-09

    申请号：US11125605

    申请日：2005-05-09

    申请人： Leonel Arana ,  Terry Sterrett ,  Devendra Natekar

    发明人： Leonel Arana ,  Terry Sterrett ,  Devendra Natekar

    IPC分类号： B24B1/00

    CPC分类号： B24B7/228 ,  B24B41/068 ,  Y10T29/49998

    摘要： Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

    摘要翻译： 描述电子设备支持和处理方法。 一个实施例包括处理包括从其延伸的焊锡凸块的电子器件的方法。 该方法包括在支撑结构上提供至少一种选自电流变流体和流变流体的流体。 从电子设备延伸的焊料凸块位于流体中。 通过将从电场和磁场组成的组中选出的场施加到流体来激活流体。 活化流体将电子设备机械地保持在适当位置。 电子设备的表面被抛光，同时电子设备被活化的流体保持就位。 通过从流体中除去所施加的场，使流体失活，并且电子装置与去活化流体分离。 描述和要求保护其他实施例。

    Thinning semiconductor wafers
    2.
    发明申请
    Thinning semiconductor wafers 审中-公开
    薄化半导体晶圆

    公开(公告)号：US20060046433A1

    公开(公告)日：2006-03-02

    申请号：US10925775

    申请日：2004-08-25

    申请人： Terry Sterrett ,  Leonel Arana ,  Devendra Natekar

    发明人： Terry Sterrett ,  Leonel Arana ,  Devendra Natekar

    IPC分类号： H01L21/463

    CPC分类号： H01L21/02013 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363

    摘要： Wafer thinning may be accomplished by grinding while the wafer is held in the fixture. The fixture may have a series of protrusions that form an interference fit with surface features extending outwardly from the non-thinned surface of the wafer to be thinned. In some embodiments, a releasable adhesive may be utilized to augment the interference effect. Also, in some embodiments, openings in a shape memory material may be utilized that, upon heating, more firmly engage the bumps on the wafer to be thinned.

    摘要翻译： 晶片变薄可以通过在晶片保持在固定装置中的同时进行研磨来实现。 夹具可以具有一系列突起，其形成与要被变薄的晶片的非变薄表面向外延伸的表面特征的过盈配合。 在一些实施方案中，可以使用可释放粘合剂来增加干扰效应。 此外，在一些实施例中，可以利用形状记忆材料中的开口，其在加热时更牢固地接合要稀释的晶片上的凸块。

    ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM
    8.
    发明申请
    ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM 审中-公开
    使用焊接前提的包装中的电气隔离互连和密封圈

    公开(公告)号：US20070241448A1

    公开(公告)日：2007-10-18

    申请号：US11765969

    申请日：2007-06-20

    申请人： Leonel Arana ,  John Heck

    发明人： Leonel Arana ,  John Heck

    IPC分类号： H01L23/12

    CPC分类号： B23K3/0623 ,  B23K2101/38 ,  H01L2224/17

    摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device. Other embodiments are described and claimed.

    摘要翻译： 实施例包括用于形成电子组件的电子组件和方法。 一个实施例包括形成MEMS器件组件的方法，包括在衬底上形成有源MEMS区域。 形成电耦合到有源MEMS区域的多个接合焊盘。 密封环润湿层也形成在衬底上，围绕有源MEMS区域的密封环润湿层。 单块焊料预制件位于接合焊盘和密封环润湿层上，单件焊料预制件包括密封环区域和焊盘区域。 密封圈区域通过多个焊接桥连接到焊盘区域。 该方法还包括将单件焊料预制件加热到高于回流温度的温度，使得桥接器分裂，并且来自预制件的焊料积聚在密封环润湿层和接合焊盘上。 盖子与焊料相连。 在某些实施例中，盖可以包括其中具有导电材料的通孔，用于提供与MEMS器件的电接触。 描述和要求保护其他实施例。

    Clipless integrated heat spreader process and materials
    9.
    发明授权
    Clipless integrated heat spreader process and materials 有权
    无夹杂散热器整体加工和材料

    公开(公告)号：US08163598B2

    公开(公告)日：2012-04-24

    申请号：US13006541

    申请日：2011-01-14

    申请人： George Kostiew ,  Raj Bahadur ,  James Mellody ,  George Vakanas ,  Leonel Arana

    发明人： George Kostiew ,  Raj Bahadur ,  James Mellody ,  George Vakanas ,  Leonel Arana

    IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

    CPC分类号： H01L23/42 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00

    摘要： In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips.

    摘要翻译： 在一个或多个实施例中，公开了一种方法，其包括将热压力应用于包括盖子，模具和封装基板的封装组件以组装封装组件。 该方法可以包括组装封装组件而不将偏压机构耦合到盖子。 可以将热量施加到与拾取和放置工具耦合的结合头。 可以将热量施加到在加工期间联接到用于保持包装组件的载体的接合台。 施加到盖子或封装基底上的粘合剂可以被允许至少部分固化。 该方法还可以包括在烘箱中回流耦合到盖子和模具的热界面材料（TIM），固化TIM和/或固化粘合剂，而不使用夹子。

    CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS
    10.
    发明申请
    CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS 有权
    无夹紧热交换器过程和材料

    公开(公告)号：US20090298235A1

    公开(公告)日：2009-12-03

    申请号：US12130822

    申请日：2008-05-30

    申请人： George Kostiew ,  Raj Bahadur ,  James Mellody ,  George Vakanas ,  Leonel Arana

    发明人： George Kostiew ,  Raj Bahadur ,  James Mellody ,  George Vakanas ,  Leonel Arana

    IPC分类号： H01L21/00

    CPC分类号： H01L23/42 ,  H01L21/50 ,  H01L23/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00

    摘要： In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips.

    摘要翻译： 在一个或多个实施例中，公开了一种方法，其包括将热压力应用于包括盖子，模具和封装基板的封装组件以组装封装组件。 该方法可以包括组装封装组件而不将偏压机构耦合到盖子。 可以将热量施加到与拾取和放置工具耦合的结合头。 可以将热量施加到在加工期间联接到用于保持包装组件的载体的接合台。 施加到盖子或封装基底上的粘合剂可以被允许至少部分固化。 该方法还可以包括在烘箱中回流耦合到盖子和模具的热界面材料（TIM），固化TIM和/或固化粘合剂，而不使用夹子。