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    METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS
    5.
    发明申请
    METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS 失效
    用于支持使用流体的基板的方法和装置

    公开(公告)号：US20060252354A1

    公开(公告)日：2006-11-09

    申请号：US11125605

    申请日：2005-05-09

    申请人： Leonel Arana ,  Terry Sterrett ,  Devendra Natekar

    发明人： Leonel Arana ,  Terry Sterrett ,  Devendra Natekar

    IPC分类号： B24B1/00

    CPC分类号： B24B7/228 ,  B24B41/068 ,  Y10T29/49998

    摘要： Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

    摘要翻译： 描述电子设备支持和处理方法。 一个实施例包括处理包括从其延伸的焊锡凸块的电子器件的方法。 该方法包括在支撑结构上提供至少一种选自电流变流体和流变流体的流体。 从电子设备延伸的焊料凸块位于流体中。 通过将从电场和磁场组成的组中选出的场施加到流体来激活流体。 活化流体将电子设备机械地保持在适当位置。 电子设备的表面被抛光，同时电子设备被活化的流体保持就位。 通过从流体中除去所施加的场，使流体失活，并且电子装置与去活化流体分离。 描述和要求保护其他实施例。

    Thinning semiconductor wafers
    6.
    发明申请
    Thinning semiconductor wafers 审中-公开
    薄化半导体晶圆

    公开(公告)号：US20060046433A1

    公开(公告)日：2006-03-02

    申请号：US10925775

    申请日：2004-08-25

    申请人： Terry Sterrett ,  Leonel Arana ,  Devendra Natekar

    发明人： Terry Sterrett ,  Leonel Arana ,  Devendra Natekar

    IPC分类号： H01L21/463

    CPC分类号： H01L21/02013 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363

    摘要： Wafer thinning may be accomplished by grinding while the wafer is held in the fixture. The fixture may have a series of protrusions that form an interference fit with surface features extending outwardly from the non-thinned surface of the wafer to be thinned. In some embodiments, a releasable adhesive may be utilized to augment the interference effect. Also, in some embodiments, openings in a shape memory material may be utilized that, upon heating, more firmly engage the bumps on the wafer to be thinned.

    摘要翻译： 晶片变薄可以通过在晶片保持在固定装置中的同时进行研磨来实现。 夹具可以具有一系列突起，其形成与要被变薄的晶片的非变薄表面向外延伸的表面特征的过盈配合。 在一些实施方案中，可以使用可释放粘合剂来增加干扰效应。 此外，在一些实施例中，可以利用形状记忆材料中的开口，其在加热时更牢固地接合要稀释的晶片上的凸块。