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    Flow boiling heat sink structure with vapor venting and condensing
    3.
    发明授权
    Flow boiling heat sink structure with vapor venting and condensing 有权
    流动沸腾散热器结构，蒸气排出和冷凝

    公开(公告)号：US08564952B2

    公开(公告)日：2013-10-22

    申请号：US13189596

    申请日：2011-07-25

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  H05K7/20309 ,  H05K7/20318 ,  Y10T29/4935 ,  Y10T29/49377 ,  Y10T29/49378

    摘要： A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

    摘要翻译： 提供了一种散热器，以及使用散热器的冷却电子结构和冷却电子设备。 散热器由导热结构制成，其包括一个或多个冷却剂输送通道和一个或多个蒸汽冷凝通道。 一个薄膜设置在冷却剂输送通道和蒸汽冷凝通道之间。 膜包括至少一个透气区域，其至少一部分覆盖着一部分冷却剂输送通道，并且有助于将蒸气从冷却剂输送通道移除到蒸汽冷凝通道（ s）。 散热器还包括一个或多个冷却剂入口，所述冷却剂入口联接以向所述冷却剂输送通道提供第一液体冷却剂流，以及第二液体冷却剂流以冷凝所述蒸气冷凝通道内的蒸汽。

    Air-side economizer facilitating liquid-based cooling of an electronics rack
    5.
    发明授权
    Air-side economizer facilitating liquid-based cooling of an electronics rack 有权
    空气侧节能器促进电子机架的液体冷却

    公开(公告)号：US08955347B2

    公开(公告)日：2015-02-17

    申请号：US13187561

    申请日：2011-07-21

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F25D23/12 ,  F25D17/02 ,  H05K7/20

    CPC分类号： H05K7/20136 ,  H05K7/20209 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20781

    摘要： A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

    摘要翻译： 提供一种用于冷却电子机架的电子子系统的冷却装置和方法。 该冷却装置包括一个局部冷却站，该冷却站具有液体 - 空气热交换器和用于引导冷却气流穿过热交换器的管道。 冷却子系统与机架的电子子系统相关联，并且包括促进电子子系统的电子部件的浸入式冷却的壳体，或者向电子子系统的电子部件提供导电冷却的一个或多个液冷结构。 冷却剂回路将冷却子系统连接到本地冷却站的液 - 空热交换器。 在操作中，通过来自电子子系统的循环冷却剂传递热量，并将其在局部冷却站的液体 - 空气热交换器中排出到穿过液体 - 空气热交换器的冷却气流。 在一个实施例中，冷却气流是室外空气。

    Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
    7.
    发明授权
    Apparatus and method for facilitating servicing of a liquid-cooled electronics rack 有权
    便于维修液冷电子机架的装置和方法

    公开(公告)号：US08857057B2

    公开(公告)日：2014-10-14

    申请号：US13447421

    申请日：2012-04-16

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

    IPC分类号： B21D53/02 ,  B23P6/00 ,  F28D15/00 ,  H01S4/00 ,  H05K7/20

    CPC分类号： H05K7/20781 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49352 ,  Y10T29/49826

    摘要： An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

    摘要翻译： 提供一种用于便利液体冷却电子机架的维修的装置。 该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线， 冷却液返回口和冷却液箱。 每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。 至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。 当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。